Abstract: A method of forming spacer bumps includes providing a substrate, and the substrate has an alignment film thereon. A metal mold is disposed on the alignment film, and the metal mold includes a plurality of holes penetrating through it. A photo curable material is filled into the holes of the metal mold, and the photo curable material is pre-cured using UV radiation. The metal mold is removed, and then the photo curable material is secondary-cured using UV radiation to form a plurality of spacer bumps. The material of the alignment film is different from the material of the spacer bumps.

Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.

Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the total number of acrylate groups in the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.

Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the sum of acrylate group of the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.

Abstract: The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n1 is 2-25, R1 is C1-10 alkyl or H and R2 is H or CH3; (c) adding a water-soluble polymer in the suspension; (d) adding a bi-functional acrylic oligomer of formula (II) in the suspension, wherein n2 is 3-50, and R3 and R4 independently are H or CH3; (e) after the step (d), drying the suspension to form a film; (f) exposing the film under UV light to cure the film; and (g) stretching the film, wherein the film has only a negative C-plate property before the stretching and has both negative C-plate and positive A-plate properties after the stretching.

Abstract: A transparent flexible film is provided, formed by curing a composition, comprising: about 40-75 parts by weight of a clay; about 15-45 parts by weight of a water-soluble polymer; about 1-10 parts by weight of a mono-functional acrylic oligomer of formula (I), wherein n1 is an integer 2-25, R1 is C1-10 alkyl or H, and R2 is H or CH3; and about 10-45 parts by weight of a bi-functional acrylic oligomer of formula (II), wherein n2 is an integer 3-50, R3 and R4 are H or CH3.

Abstract: The invention provides an antiglare film. A resin layer is disposed on a substrate. Micro-aggregates are distributed in an interior and over a surface of the resin layer. Each of the micro aggregates has a size of 0.1-3 ?m and is formed by aggregating aggregated nano-particles. The micro-aggregates distributing over the surface result in a surface roughness of the resin layer. The weight ratio of the resin layer to the micro-aggregates is 1:0.1-0.7.

Abstract: The invention provides an antiglare film. A resin layer is disposed on a substrate. Micro-aggregates are distributed in an interior and over a surface of the resin layer. Each of the micro aggregates has a size of 0.1-3 ?m and is formed by aggregating aggregated nano-particles. The micro-aggregates distributing over the surface result in a surface roughness of the resin layer. The weight ratio of the resin layer to the micro-aggregates is 1:0.1-0.7.

Abstract: The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n1 is 2-25, R1 is C1-10 alkyl or H and R2 is H or CH3; (c) adding a water-soluble polymer in the suspension; (d) adding a bi-functional acrylic oligomer of formula (II) in the suspension, wherein n2 is 3-50, and R3 and R4 independently are H or CH3; (e) after the step (d), drying the suspension to form a film; (f) exposing the film under UV light to cure the film; and (g) stretching the film, wherein the film has only a negative C-plate property before the stretching and has both negative C-plate and positive A-plate properties after the stretching.

Abstract: A transparent flexible film is provided, formed by curing a composition, comprising: about 40-75 parts by weight of a clay; about 15-45 parts by weight of a water-soluble polymer; about 1-10 parts by weight of a mono-functional acrylic oligomer of formula (I), wherein n1 is an integer 2-25, R1 is C1-10 alkyl or H, and R2 is H or CH3; and about 10-45 parts by weight of a bi-functional acrylic oligomer of formula (II), wherein n2 is an integer 3-50, R3 and R4 are H or CH3.