Patents by Inventor Li-Ching Wang
Li-Ching Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11916131Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.Type: GrantFiled: November 4, 2020Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: De-Fang Chen, Teng-Chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
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Patent number: 11479689Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.Type: GrantFiled: December 31, 2020Date of Patent: October 25, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Li-Ching Wang, Yuan-Yin Chen
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Publication number: 20220204804Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Inventors: Li-Ching Wang, Yuan-Yin Chen
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Patent number: 10964912Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.Type: GrantFiled: April 10, 2019Date of Patent: March 30, 2021Assignees: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Yung-Hui Yeh, Jui-Chang Chuang, Li-Ching Wang, Cheng-Yueh Chang, Chyi-Ming Leu, Shih-Ming Chen
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Publication number: 20200052243Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.Type: ApplicationFiled: April 10, 2019Publication date: February 13, 2020Applicants: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Yung-Hui Yeh, Jui-Chang Chuang, Li-Ching Wang, Cheng-Yueh Chang, Chyi-Ming Leu, Shih-Ming Chen
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Substrate structure, manufacturing method thereof, and method for manufacturing an electronic device
Patent number: 9796874Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the total number of acrylate groups in the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.Type: GrantFiled: November 6, 2014Date of Patent: October 24, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Wei Chen, Sin-An Chen, Chuan-Hsu Fu, Li-Ching Wang, Yi-Ling Chen -
SUBSTRATE STRUCTURE, MANUFACTURING METHOD THEREOF, AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
Publication number: 20150307732Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the sum of acrylate group of the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.Type: ApplicationFiled: November 6, 2014Publication date: October 29, 2015Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Wei CHEN, Sin-An CHEN, Chuan-Hsu FU, Li-Ching WANG, Yi-Ling CHEN -
Publication number: 20140264784Abstract: Consistent with an example embodiment, there is a semiconductor device having a front-side surface, back-side surface, and vertical surfaces. The semiconductor device comprises an active device die having electrical contacts on the front-side surface. A metal shield is plated on the back-side surface and the vertical surfaces of the active device die. Conductive links connect the plated metal shield to selected electrical contacts on the front-side surface.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Inventors: Chung Hsiung Ho, Wen Hung Huang, Wen-Jen Kuo, W.H. Lin, ChihLi Huang, Pao Tung Pan, I. Pin Chen, Li Ching Wang
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Publication number: 20130299955Abstract: Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where the IC dies and the bond wires are enclosed by the film-on-wire layer, and cutting the substrate or the leadframe into IC devices. Other embodiments are also described. The FOW based method for IC packaging can eliminate the need for molding in the IC packaging process and consequently, can reduce the cost of IC packaging and the dimensions of packaged IC devices.Type: ApplicationFiled: May 8, 2012Publication date: November 14, 2013Applicant: NXP B.V.Inventors: Ching Hui Chang, Li Ching Wang, Wen Hung Huang, Pao Tung Pan, Chih Li Huang, I Pin Chen, Chia Han Lin, Chung Hsiung Ho
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Patent number: 8268227Abstract: The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n1 is 2-25, R1 is C1-10 alkyl or H and R2 is H or CH3; (c) adding a water-soluble polymer in the suspension; (d) adding a bi-functional acrylic oligomer of formula (II) in the suspension, wherein n2 is 3-50, and R3 and R4 independently are H or CH3; (e) after the step (d), drying the suspension to form a film; (f) exposing the film under UV light to cure the film; and (g) stretching the film, wherein the film has only a negative C-plate property before the stretching and has both negative C-plate and positive A-plate properties after the stretching.Type: GrantFiled: September 30, 2008Date of Patent: September 18, 2012Assignee: Industrial Technology Research InstituteInventors: Chih-Kuang Chen, Shih-Ming Chen, Kun-Tsung Lu, Jia-Chih Huang, Li-Ching Wang
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Patent number: 7935738Abstract: A transparent flexible film is provided, formed by curing a composition, comprising: about 40-75 parts by weight of a clay; about 15-45 parts by weight of a water-soluble polymer; about 1-10 parts by weight of a mono-functional acrylic oligomer of formula (I), wherein n1 is an integer 2-25, R1 is C1-10 alkyl or H, and R2 is H or CH3; and about 10-45 parts by weight of a bi-functional acrylic oligomer of formula (II), wherein n2 is an integer 3-50, R3 and R4 are H or CH3.Type: GrantFiled: May 22, 2008Date of Patent: May 3, 2011Assignee: Industrial Technology Research InstituteInventors: Chih-Kuang Chen, Shih-Ming Chen, Jia-Chi Huang, Young-Jen Lee, Li-Ching Wang
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Patent number: 7854522Abstract: The invention provides an antiglare film. A resin layer is disposed on a substrate. Micro-aggregates are distributed in an interior and over a surface of the resin layer. Each of the micro aggregates has a size of 0.1-3 ?m and is formed by aggregating aggregated nano-particles. The micro-aggregates distributing over the surface result in a surface roughness of the resin layer. The weight ratio of the resin layer to the micro-aggregates is 1:0.1-0.7.Type: GrantFiled: March 11, 2009Date of Patent: December 21, 2010Assignee: Industrial Technology Research InstituteInventors: Li-Ching Wang, Shih-Ming Chen, Jia-Chi Huang, Chih-Kuang Chen
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Publication number: 20090279176Abstract: The invention provides an antiglare film. A resin layer is disposed on a substrate. Micro-aggregates are distributed in an interior and over a surface of the resin layer. Each of the micro aggregates has a size of 0.1-3 ?m and is formed by aggregating aggregated nano-particles. The micro-aggregates distributing over the surface result in a surface roughness of the resin layer. The weight ratio of the resin layer to the micro-aggregates is 1:0.1-0.7.Type: ApplicationFiled: March 11, 2009Publication date: November 12, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Li-Ching WANG, Shih-Ming CHEN, Jia-Chi HUANG, Chih-Kuang CHEN
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Publication number: 20090167993Abstract: The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n1 is 2-25, R1 is C1-10 alkyl or H and R2 is H or CH3; (c) adding a water-soluble polymer in the suspension; (d) adding a bi-functional acrylic oligomer of formula (II) in the suspension, wherein n2 is 3-50, and R3 and R4 independently are H or CH3; (e) after the step (d), drying the suspension to form a film; (f) exposing the film under UV light to cure the film; and (g) stretching the film, wherein the film has only a negative C-plate property before the stretching and has both negative C-plate and positive A-plate properties after the stretching.Type: ApplicationFiled: September 30, 2008Publication date: July 2, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Kuang Chen, Shih-Ming Chen, Kun-Tsung Lu, Jia-Chi Huang, Li-Ching Wang
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Publication number: 20090149564Abstract: A transparent flexible film is provided, formed by curing a composition, comprising: about 40-75 parts by weight of a clay; about 15-45 parts by weight of a water-soluble polymer; about 1-10 parts by weight of a mono-functional acrylic oligomer of formula (I), wherein n1 is an integer 2-25, R1 is C1-10 alkyl or H, and R2 is H or CH3; and about 10-45 parts by weight of a bi-functional acrylic oligomer of formula (II), wherein n2 is an integer 3-50, R3 and R4 are H or CH3.Type: ApplicationFiled: May 22, 2008Publication date: June 11, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Kuang CHEN, Shih-Ming CHEN, Jia-Chi HUANG, Young-Jen LEE, Li-Ching WANG