Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.

Abstract: A touch knob which can transmit user touches above to a touch-sensitive surface below includes a base, a rotating shaft, and a rotating cap. The rotating cap defines a receiving groove facing the base, and the rotating shaft extends into the receiving groove and is connected to the rotating cap. The rotating cap is configured to rotate to transmit user touches in a bounded circular area, at least one conductive touch head is located on the rotating cap and in the receiving groove, and moves as the rotating cap moves. The disclosure avoids the need to cut or form any opening in the cover of the touch-sensitive surface or panel for buttons to be installed. A device using the above touch knob is also provided.

Abstract: A touch knob which can transmit user touches above to a touch-sensitive surface below includes a base, a rotating shaft, and a rotating cap. The rotating cap defines a receiving groove facing the base, and the rotating shaft extends into the receiving groove and is connected to the rotating cap. The rotating cap is configured to rotate to transmit user touches in a bounded circular area, at least one conductive touch head is located on the rotating cap and in the receiving groove, and moves as the rotating cap moves. The disclosure avoids the need to cut or form any opening in the cover of the touch-sensitive surface or panel for buttons to be installed. A device using the above touch knob is also provided.

Abstract: An exposure value adjustment apparatus, method, and non-transitory tangible machine-readable medium thereof are provided. The exposure value adjustment apparatus includes a camera module and a processor. The camera module captures a reference image by a base exposure value. The processor generates a histogram of the reference image, divides the histogram into a low partial histogram, a middle partial histogram, and a high partial histogram by a first threshold and a second threshold, decides a high exposure value according to the low partial histogram and the middle partial histogram, decides a low exposure value according to the high partial histogram and the middle partial histogram, and decides a middle exposure value according to the high exposure value and the low exposure value. The low exposure value is lower than the high exposure value, and the middle exposure value is between the high exposure value and the low exposure value.

Abstract: A packaging tray includes a base plate, two first side plates and two second side plates. Two first side plates and two second side plates are connected to four sides of the base plate, respectively. Each of the first side plates includes a first base body and two first combining areas with an opening connected to the first base body. Each of the second side plates includes a second base body and two second combining areas connected to the second base body. Each of the first combining area includes a head part and a neck part connecting the head part and the second base body. The head parts of the second combining areas pierce through and are fixed to the openings of the first combining areas adjacent to the second combining areas, respectively, so that the first side plates are attached with the second side plates, respectively.

Abstract: A protecting device for placing an object includes two connecting members and two stretchable members. The two stretchable members are attached between the two connecting members to enclose an accommodating space. Each of the stretchable members includes a first block, a second block and two joint units. The first block includes a first linking part. The second block includes a recess portion located between two second linking parts. The two first ends of the joint unit are attached with each other and attached to the first linking part. The two second ends of the joint unit are separated with each other and attached to the second linking parts, respectively. When the stretchable members are at the retracted state, part of the joint unit is located inside the recess portion, and the joint unit is located outside the recess portion at the extended state.

Abstract: The present invention discloses an image capture method comprises capturing a sequence of image frames; providing the sequence of image frames for preview along a first path and buffering the sequence of image frames into a buffer along a second path separately and concurrently; receiving an input command via an input interface unit; and in response to the input command, extracting a portion of the sequence of image frames from the buffer and encoding the portion of image frames along the second path; and storing the portion of encoded image frames in a memory unit.

Abstract: With the aid of separating data paths for generating preview frames, for generating video frames, and for generating encoded camera frames of an image fetching system in a concurrent and mutually-independent manner, the image fetching system is free from introducing unnecessary shutter lags.

Abstract: The present invention discloses a mobile device, where the mobile device includes an image sensing unit, a touch screen, and a processor. The image sensing unit is configured to receive at least an image of a scene comprising at least an object. The touch screen is configured to display at least an image of a scene and received at least one user input. The processor is configured to identify the object in response to a first user input corresponding to the object is received, determine characteristics of the object, track the object in the scene according to the characteristics of the object, and capture a number of images of the scene according to a motion state of the object. The motion state is determined according to variance of the characteristics of the object in consecutive images received by the image sensing unit.

Abstract: Methods and systems for application management are provided. First, a first picture of an application is displayed on a lower display layer in a touch-sensitive display unit. At least one contact on the touch-sensitive display unit is detected. In response to the at least one contact, a second picture is displayed on an upper display layer in the touch-sensitive display unit, wherein the upper display layer is visually above the lower display layer.

Abstract: The present invention discloses a structure and a method for booting an image signal processor. The method comprises the steps of: providing an image processing module including an image signal processor and an interface; receiving a booting program from an external source by the interface; and initializing the image processing module according to the booting program by the image signal processor.