Patents by Inventor Li-Chun Lee

Li-Chun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186400
    Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.
    Type: Application
    Filed: February 13, 2024
    Publication date: June 6, 2024
    Inventors: De-Fang Chen, Teng-Chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
  • Patent number: 11984516
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: May 14, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Publication number: 20240136202
    Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 25, 2024
    Inventors: LI-CHUN HUNG, JUI-HUNG HSU, CHIEN-CHEN LEE
  • Publication number: 20240136376
    Abstract: A chip package structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a chip, a molding layer and a package cover. The conductive substrate has first and second board surfaces opposite to each other, and a die-bonding region is defined on the first board surface. The chip is disposed on the first board and located in the die-bonding region, and is electrically connected to the conductive substrate. The molding layer is disposed on the first board surface and surrounds the die-bonding region and the chip. The package cover is disposed on the molding layer, and the package cover, the molding layer and the conductive substrate jointly define an enclosed space surrounding the chip. Two of the conductive substrate, the molding layer and the package cover are connected to each other through a mortise-tenon joint structure.
    Type: Application
    Filed: March 10, 2023
    Publication date: April 25, 2024
    Inventors: DONG-RU WU, CHIEN-CHEN LEE, LI-CHUN HUNG
  • Publication number: 20240136386
    Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.
    Type: Application
    Filed: March 15, 2023
    Publication date: April 25, 2024
    Inventors: LI-CHUN HUNG, JUI-HUNG HSU, CHIEN-CHEN LEE
  • Patent number: 11967652
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Publication number: 20240113202
    Abstract: Embodiments of the present disclosure relate to a FinFET device having gate spacers with reduced capacitance and methods for forming the FinFET device. Particularly, the FinFET device according to the present disclosure includes gate spacers formed by two or more depositions. The gate spacers are formed by depositing first and second materials at different times of processing to reduce parasitic capacitance between gate structures and contacts introduced after epitaxy growth of source/drain regions.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 4, 2024
    Inventors: Wen-Kai Lin, Bo-Yu Lai, Li Chun Te, Kai-Hsuan Lee, Sai-Hooi Yeong, Tien-I Bao, Wei-Ken Lin
  • Publication number: 20240113414
    Abstract: Disclosed is an electronic device including a device body and an antenna module. The antenna module includes a conductive element and at least one antenna element. The conductive element includes a main body portion and at least one assembly portion connected with each other. The at least one assembly portion is assembled on the device body. The at least one antenna element is disposed on the device body and coupled with the conductive element to excite a first resonance mode. The at least one assembly portion overlaps the at least one antenna element in the length direction of the main body portion.
    Type: Application
    Filed: September 24, 2023
    Publication date: April 4, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Heng Lin, Li-Chun Lee, Shih-Chia Liu, Jui-Hung Lai, Hung-Yu Yeh
  • Publication number: 20240106104
    Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 28, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
  • Patent number: 11932714
    Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 19, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Yi Chu, Yun-Ching Lee, Li-Chun Liang, Wei-Ta Yang, Hsiang-Chin Juan
  • Publication number: 20240088179
    Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 14, 2024
    Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: You-Wei Chang, Chien-Chen Lee, Li-Chun Hung
  • Patent number: 11923886
    Abstract: An antenna device and a method for configuring the same are provided. The antenna device includes a grounding metal, a grounding part, a radiating part, a feeding part, a proximity sensor, and a sensing metal. The radiating part is electrically connected to the grounding metal through the grounding part. The feeding part is coupled to the grounding metal through a feeding point. The sensing metal is electrically connected to the proximity sensor. The sensing metal is separated from the radiating part at a distance. The distance is less than or equal to one thousandth of a wavelength corresponding to an operating frequency of the antenna device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 5, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Yan-Ming Lin, Jui-Hung Lai
  • Patent number: 11916131
    Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: De-Fang Chen, Teng-Chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
  • Patent number: 11764476
    Abstract: An antenna device is disposed. The antenna device includes a signal cable, a casing, a grounding component, and a metal member. The signal cable includes a signal portion and a grounding portion. The signal cable is fixed on the casing. The grounding portion is connected to the metal member through the grounding component.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: September 19, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Jui-Hung Lai
  • Patent number: 11749903
    Abstract: The disclosure provides an antenna structure including a ground plane, a first coupling antenna and a reference antenna. The first coupling antenna includes a first excitation source connected to the ground plane. The first excitation source is configured to excite a first resonant mode, and the first coupling antenna forms a first zero current area on the ground plane in response to the first resonant mode. The reference antenna includes a second excitation source connected to the ground plane. The second excitation source is configured to excite a second resonant mode, and the reference antenna forms a second zero current area on the ground plane in response to the second resonant mode. The first excitation source is located in the second zero current area, and the second excitation source is located in the first zero current area.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: September 5, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Jui-Hung Lai, Chih-Heng Lin
  • Patent number: 11606702
    Abstract: An electronic device and a method for adjusting an adjustable antenna are provided. The electronic device includes a storage medium, an antenna switch, a wireless local area network (WLAN) card, and a processor. The storage medium stores multiple system modules. The antenna switch is coupled to the adjustable antenna. The WLAN card is coupled to the antenna switch and obtains a communication signal from the adjustable antenna. The communication signal includes channel information. The processor is coupled to the storage medium, the antenna switch, and the WLAN card. The processor accesses and executes the multiple system modules including an operation system (OS) and a signal capturing module. The OS obtains the channel information from the WLAN card. The signal capturing module obtains the channel information from the OS and configures the antenna switch according to the channel information to adjust the antenna performance of the adjustable antenna.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 14, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Li-Chun Lee, Shih-Chia Liu, Jhin-Ciang Chen, Jui-Hung Lai, Peng-Hsiang Sung, Hsiang-Pin Yang, Sheng-Ju Yu, Kuan-Ting Chen, Hung-Han Sun
  • Patent number: 11588244
    Abstract: The disclosure provides an antenna structure, including at least one supporting module, a first antenna, and a second antenna. The first antenna is disposed on the at least one supporting module and includes a first feeding point and a first zero-current zone. The first antenna is connected to a ground plane. The second antenna is disposed on the at least one supporting module and includes a second feeding point and a second zero-current zone. The second antenna is connected to the ground plane. The first feeding point of the first antenna is disposed in the second zero-current zone of the second antenna, and the second feeding point of the second antenna is disposed in the first zero-current zone of the first antenna.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: February 21, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chao-Lin Wu, Jui-Hung Lai, Chih-Heng Lin
  • Patent number: 11460891
    Abstract: An electronic device including a device body, a first antenna module, a second antenna module, and an electrically conductive structure is provided. The first antenna module is disposed on the device body, and the second antenna module is disposed on the device body. The electrically conductive structure includes a first section and a second section, and the first section is connected between the first antenna module and the second section. The first section is extended along a first direction, the second section is extended toward the second antenna module along a second direction not parallel to the first direction, and the second section and the second antenna module have a gap therebetween.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: October 4, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: I-Lung Chen, Wang-Hung Yeh, Hsiao-Ching Hung, Li-Chun Lee, Shih-Chia Liu, Kun-Rong Lin
  • Publication number: 20220263531
    Abstract: An antenna device and a method for configuring the same are provided. The antenna device includes a grounding metal, a grounding part, a radiating part, a feeding part, a proximity sensor, and a sensing metal. The radiating part is electrically connected to the grounding metal through the grounding part. The feeding part is coupled to the grounding metal through a feeding point. The sensing metal is electrically connected to the proximity sensor. The sensing metal is separated from the radiating part at a distance. The distance is less than or equal to one thousandth of a wavelength corresponding to an operating frequency of the antenna device.
    Type: Application
    Filed: August 27, 2021
    Publication date: August 18, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Yan-Ming Lin, Jui-Hung Lai
  • Publication number: 20220223996
    Abstract: An electronic device including a first body, a second body, and at least one cavity antenna module is provided. The second body has a pivot side and a plurality of non-pivot sides, and the pivot side is connected pivotally to the first body. The cavity antenna module includes a metal cavity body and a first antenna structure. The metal cavity body is disposed in the second body and has an opening. A distance between one of the non-pivot sides and the metal cavity body is smaller than a distance between the pivot side and the metal cavity body, and the opening faces the one of the non-pivot sides. The first antenna structure is disposed in the opening of the metal cavity body, and the first antenna structure includes a feeding portion, a radiating portion, and a ground portion connected with one another.
    Type: Application
    Filed: October 21, 2021
    Publication date: July 14, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Je-Wei Liao, Chun-Cheng Chan, Jui-Hung Lai