Abstract: A semiconductor structure includes a first transistor, a second transistor, a first dummy source/drain, a third transistor, a fourth transistor, and a second dummy source/drain. The first transistor and a second transistor adjacent to the first transistor are at a first elevation. The first dummy source/drain is disposed at the first elevation. The third transistor and a fourth transistor adjacent to the third transistor, are at a second elevation different from the first elevation. The second dummy source/drain is disposed at the second elevation. The second transistor is vertically aligned with the third transistor. The first dummy source/drain is vertically aligned with a source/drain of the fourth transistor. The second dummy source/drain is vertically aligned with a source/drain of the first transistor. The gate structure between the second dummy source/drain and a source/drain of the third transistor is absent. A method for manufacturing a semiconductor structure is also provided.

Abstract: A chip package structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a chip, a molding layer and a package cover. The conductive substrate has first and second board surfaces opposite to each other, and a die-bonding region is defined on the first board surface. The chip is disposed on the first board and located in the die-bonding region, and is electrically connected to the conductive substrate. The molding layer is disposed on the first board surface and surrounds the die-bonding region and the chip. The package cover is disposed on the molding layer, and the package cover, the molding layer and the conductive substrate jointly define an enclosed space surrounding the chip. Two of the conductive substrate, the molding layer and the package cover are connected to each other through a mortise-tenon joint structure.

Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: A memory unit with time domain edge delay accumulation for computing-in-memory applications is controlled by a first word line and a second word line. The memory unit includes at least one memory cell, at least one edge-delay cell multiplexor and at least one edge-delay cell. The at least one edge-delay cell includes a weight reader and a driver. The weight reader is configured to receive a weight and a multi-bit analog input voltage and generate a multi-bit voltage according to the weight and the multi-bit analog input voltage. The driver is connected to the weight reader and configured to receive an edge-input signal. The driver is configured to generate an edge-output signal having a delay time according to the edge-input signal and the multi-bit voltage. The delay time of the edge-output signal is positively correlated with the multi-bit analog input voltage multiplied by the weight.

Abstract: A semiconductor device includes one or more active semiconductor components, wherein a front side is defined over the semiconductor substrate and a back side is defined beneath the semiconductor substrate. A front side power rail is formed at the front side of the semiconductor device and is configured to receive a first reference power voltage. First and second back side power rails are formed on the back side of the semiconductor substrate and are configured to receive corresponding second and third reference power voltages. The first, second and third reference power voltages are different from each other.

Abstract: An integrated circuit includes first-type transistors aligned within a first-type active zone, second-type transistors aligned within a second-type active zone, a first power rail and a second power rail extending in a first direction. A first distance between the long edge of the first power rail and the first alignment boundary of the first-type active zone is different from a second distance between the long edge of the second power rail and the first alignment boundary of the second-type active zone. Each of the first distance and the second distance is along a second direction which is perpendicular to the first direction.

Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.

Abstract: A connector assembly includes a printed circuit board (PCB) enclosed within a metallic cover. The PCB has an exposed mating port at a front region, and a transmission region around a rear region. A latch structure associated with a pulling tape is provided on the metallic cover. A CMOS (Complementary Metal-Oxide-Semiconductor) IC and a control IC are mounted upon the PCB and electrically connected to the mating port for transforming the electrical signal to the THz electromagnetic waves. An optional lens is optionally located at the rear region to refocus the THz electromagnetic waves to a low dielectric constant wave guide for further transmission. A system includes a pair of connector assemblies oppositely arranged and linked with each other via the low dielectric constant wave guide.

Abstract: An electrical connector includes an insulative housing, a contact module, and a magnetic module. The insulative housing defines a receiving cavity forwardly communicating with an exterior plug and a mounting cavity located behind the receiving cavity. The contact module includes a set of mating contacts each having a contacting portion exposed within the receiving cavity and a set of mounting contacts for connecting to an exterior substrate. The magnetic module is received in the mounting cavity and electrically connecting the mating contacts to corresponding mounting contacts. The magnetic module includes a printed circuit board (PCB) and four isolated transformers surface mounted on a same face thereof. The four discrete transformers are arranged on a limited space of the PCB.

Abstract: A magnetic element (100) includes a board unit (2) including a paddle board (21) having a row of first conductive vias (251) and a row of second conductive vias (252) for insertion of terminals (3), a number of embedded magnetic components (22), and a number of SMDs (surface mount devices) (23) mounted on the paddle board by SMT (surface mount technology). Each embedded magnetic component includes a magnetic core (221) embedded in the paddle board, and a number of PCB (printed circuit board) layout traces (222) disposed in the paddle board. Each PCB layout trace includes a first PCB layout trace (222a) encircling around the magnetic core and connecting with the first conductive via, and a second PCB layout trace (222b) encircling around the magnetic core and connecting with the SMD.

Abstract: An electrical connector includes an insulative housing, a contact module, and a magnetic module. The inslulative housing defines a receiving cavity forwardly communicating with an exterior plug and a mounting cavity located behind the receiving cavity. The contact module includes a set of mating contacts each having a contacting portion exposed within the receiving cavity and a set of mounting contacts for connecting to an exterior substrate. The magnetic module is received in the mounting cavity and electrically connecting the mating contacts to corresponding mounting contacts. The magnetic module includes a printed circuit board (PCB) and four isolated transformers surface mounted on a same face thereof. The four discrete transformers are arranged on a limited space of the PCB.

Abstract: An electrical connector includes an insulative housing (2) defining a port (102, 103) and a contact module (5) inserted into the port. The contact module includes a set of contacts (540, 542) received in the port, a ground component (5323) for grounding and a horizontal PCB (541, 543). The horizontal PCB having a first conductive trace (5410, 5430) disposed at the upper side of the horizontal PCB, a second conductive trace (5411, 5431) disposed at the lower side of the horizontal PCB and a shielding layer positioned between the first and second conductive traces. The first and second conductive traces electrically connect with the set of contacts, respectively. The horizontal PCB has a ground section (5414, 5434) electrically connecting with shielding layer to the ground component for grounding. The shield layer is provided to shield the crosstalk between the contacts that are provided as differential signal pairs.

Abstract: A transformer (100) includes a bar-shaped core (5), a number of coils (7) comprising a first winding group (71, 72) and a second winding group (73, 74) wound around the core, a housing (1) receiving the core and the coils, and a number of conductive terminals (3) being secured in the housing. The first winding group and the second winding group wound around different parts of the core. The coils are soldered to the conductive terminals (3). The coils (7) are wound around the core automatically by an automatic winder. Therefore, the cost of manufacturing the transformer is decreased.

Abstract: An electrical connector system includes a substrate (1) connected to PHY side and an electrical connector (3) mounted on the substrate (1), a transformer (5) and a common mode filter (7). The electrical connector (3) is used to mate with a cable assembly and so forms a Cable side. The transformer (5) further includes a first wire (51) having two opposite ends electrically connected to the PHY side and a second wire (53) having two opposite ends. The common mode filter (7) has a third wire (73) and a fourth wire (75) that are physically separated from and electrically connected to opposite ends of the second wire (53).

Abstract: An electrical connector includes an insulative housing (2) defining a port (102, 103) and a contact module (5) inserted into the port. The contact module includes a set of contacts (540, 542) received in the port, a ground component (5323) for grounding and a horizontal PCB (541, 543). The horizontal PCB having a first conductive trace (5410, 5430) disposed at the upper side of the horizontal PCB, a second conductive trace (5411, 5431) disposed at the lower side of the horizontal PCB and a shielding layer positioned between the first and second conductive traces. The first and second conductive traces electrically connect with the set of contacts, respectively. The horizontal PCB has a ground section (5414, 5434) electrically connecting with shielding layer to the ground component for grounding. The shield layer is provided to shield the crosstalk between the contacts that are provided as differential signal pairs.

Abstract: A choke module (100) for connecting with a mother board includes a housing (1), a magnetic unit (2) and a number of terminals (3). The magnetic unit includes a paddle board (21) attached to the housing and having a number of conductive pads 9212) and conductive sections (211), a number of SMDs (Surface Mount Devices 22) surface mounted on the paddle board, and a number of magnetic components (23) each having a magnetic core (231) stacked on the corresponding SMD along a vertical direction and a plurality of wires (232) winding around the magnetic core and soldered on the conductive pads. The number terminals are electrically connected with the conductive sections and secured to the housing for connecting with the mother board.

Abstract: A modular jack connector (100) includes a contact module (2) having a paddle board (22) formed with two conductive sections (28b). The contact module includes two transformers (24) each including a magnetic core (271) embedded in the paddle board, and a number of PCB layout traces distributed in the paddle board and including a first group of PCB layout traces having one group of tips extending to a position adjacent to corresponding magnetic core to form a magnetic field and another group of tips connected to the conductive section, and a second group of PCB layout traces having one group of tips extending to a position adjacent to corresponding magnetic core to form a magnetic field and another group of tips connected to the vias. The common mode chokes are surface mounted on the conductive section.

Abstract: A transformer (100) includes a bar-shaped core (5), a number of coils (7) comprising a first winding group (71, 72) and a second winding group (73, 74) wound around the core, a housing (1) receiving the core and the coils, and a number of conductive terminals (3) being secured in the housing. The first winding group and the second winding group wound around different parts of the core. The coils are soldered to the conductive terminals (3). The coils (7) are wound around the core automatically by an automatic winder. Therefore, the cost of manufacturing the transformer is decreased.

Abstract: A modular jack connector (100) includes a contact module (2) having a paddle board (21) and a magnetic module (23). The magnetic module includes a number of magnetic cores (231) embedded in the paddle board, and a number of PCB layout traces (232, 233) arranged in each side face of the paddle board. The PCB layout traces on each side face includes a primary group of PCB layout traces (232a, 233a) having one group of tips (2322, 2331) extending to a position adjacent to corresponding magnetic core to form a magnetic field and another group of tips (2321, 2332) connected to a conductive section (2111, 2121) of the paddle board, and a secondary group of PCB layout traces (232b, 233b) having one group of tips (2323, 2333) extending to a position adjacent to corresponding magnetic core to form a magnetic field and another group of tips (2324, 2334) connected to vias of the paddle board.

Abstract: A magnetic element (100) includes a board unit (2) including a paddle board (21) having a row of first conductive vias (251) and a row of second conductive vias (252) for insertion of terminals (3), a number of embedded magnetic components (22), and a number of SMDs (surface mount devices) (23) mounted on the paddle board by SMT (surface mount technology). Each embedded magnetic component includes a magnetic core (221) embedded in the paddle board, and a number of PCB (printed circuit board) layout traces (222) disposed in the paddle board. Each PCB layout trace includes a first PCB layout trace (222a) encircling around the magnetic core and connecting with the first conductive via, and a second PCB layout trace (222b) encircling around the magnetic core and connecting with the SMD.