Patents by Inventor Li Chung Chen
Li Chung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11982944Abstract: A method of lithography process is provided. The method includes forming a conductive layer over a reticle. The method includes applying ionized particles to the reticle by a discharging device. The method includes forming a photoresist layer over a semiconductor substrate. The method includes securing the semiconductor substrate by a wafer electrostatic-clamp. The method also includes patterning the photoresist layer by emitting radiation from a radiation source via the reticle.Type: GrantFiled: May 31, 2023Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsiao-Lun Chang, Chueh-Chi Kuo, Tsung-Yen Lee, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng, Che-Chang Hsu
-
Patent number: 11983475Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.Type: GrantFiled: February 7, 2023Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
-
Patent number: 11979971Abstract: An extreme ultra violet (EUV) radiation source apparatus includes a collector mirror, a target droplet generator for generating a tin (Sn) droplet, a rotatable debris collection device, one or more coils for generating an inductively coupled plasma (ICP), a gas inlet for providing a source gas for the ICP, and a chamber enclosing at least the collector mirror and the rotatable debris collection device. The gas inlet and the one or more coils are configured such that the ICP is spaced apart from the collector mirror.Type: GrantFiled: April 10, 2019Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yen-Shuo Su, Chun-Lin Chang, Han-Lung Chang, Li-Jui Chen, Po-Chung Cheng
-
Publication number: 20240143455Abstract: A virtual machine backup method, performed by a first host, includes: capturing a request to write data from a virtual machine to a hard disk image file, wherein the request includes written data and input and output location information, copying the written data to a temporary storage area, calculating a first key of the written data, storing the first key, the input and output location information into a first resource location structure, pausing an operation of the virtual machine and generating a second resource location structure according to the first resource location structure, the first key and a second key, and outputting a backup data set to a second host according to the second resource location structure, wherein the backup data set includes the second resource location structure and only one of existing data and the written data when the first key and the second key are the same.Type: ApplicationFiled: May 15, 2023Publication date: May 2, 2024Applicant: INSTITUTE FOR INFORMATION INDUSTRYInventors: Lee Chung CHEN, Li Hao CHIANG, Gin CHI, Wei Jie HSU, Jiann Wen WANG, Wen Dwo HWANG
-
Patent number: 11973302Abstract: The present disclosure provides a method for aligning a master oscillator power amplifier (MOPA) system. The method includes ramping up a pumping power input into a laser amplifier chain of the MOPA system until the pumping power input reaches an operational pumping power input level; adjusting a seed laser power output of a seed laser of the MOPA system until the seed laser power output is at a first level below an operational seed laser power output level; and performing a first optical alignment process to the MOPA system while the pumping power input is at the operational pumping power input level, the seed laser power output is at the first level, and the MOPA system reaches a steady operational thermal state.Type: GrantFiled: February 20, 2023Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chun-Lin Louis Chang, Henry Tong Yee Shian, Alan Tu, Han-Lung Chang, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng
-
Patent number: 11967596Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.Type: GrantFiled: August 5, 2021Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Guo-Huei Wu, Shih-Wei Peng, Wei-Cheng Lin, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien, Lee-Chung Lu
-
Patent number: 11948702Abstract: A radiation source apparatus includes a vessel, a laser source, a collector, a horizontal obscuration bar, and a reflective mirror. The vessel has an exit aperture. The laser source is configured to emit a laser beam to excite a target material to form a plasma. The collector is disposed in the vessel and configured to collect a radiation emitted by the plasma and to reflect the collected radiation to the exit aperture of the vessel. The horizontal obscuration bar extends from a sidewall of the vessel at least to a position between the laser source and the exit aperture of the vessel. The reflective mirror is in the vessel and connected to the horizontal obscuration bar.Type: GrantFiled: May 5, 2023Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Chung Tu, Sheng-Kang Yu, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
-
Publication number: 20240088024Abstract: A semiconductor device includes a transistor layer, a first via layer over the transistor layer, a first metallization layer over the first via layer, the first metallization layer including first conductors having long axes extending substantially in a first direction, a second via layer over the first metallization layer, and a conductive deep via extending in the second via layer, the first metallization layer, and the first via layer. The first conductors represent a majority of conductive material in the first metallization layer, and a size of the deep via in the first direction in the first metallization layer is substantially less than a minimum length of the first conductors in the first metallization layer.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Ta-Pen GUO, Chien-Ying CHEN, Li-Chun TIEN, Lee-Chung LU
-
Publication number: 20240071849Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Jian-You Chen, Kuan-Yu Huang, Li-Chung Kuo, Chen-Hsuan Tsai, Kung-Chen Yeh, Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu
-
Patent number: 11750434Abstract: A multidrop network system includes N network devices including a master device and a plurality of slave devices. The N network devices synchronize their respective time zones in a synchronization phase, then jointly perform equalizer coefficient training in a training phase, and then obtain their respective transmission opportunities in turn in a data transmission phase. Each network device includes a channel equalizer trained in the training phase and used for processing data in the data transmission phase. In the training phase, the master device sends out a training notification to request the slave devices to enter the training phase; the master device performs the equalizer coefficient training after it transmits the training notification, and the slave devices perform the equalizer coefficient training after they receive the training notification. After the completion of the equalizer coefficient training, the master device sends out a beacon to start the data transmission phase.Type: GrantFiled: March 17, 2022Date of Patent: September 5, 2023Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Yung-Le Chang, Li-Chung Chen, Yuan-Jih Chu, Shieh-Hsing Kuo
-
Publication number: 20230141638Abstract: A coater cup deformation testing device includes a supporting board, a first plate and a second plate. The first plate is located on a first side surface of the supporting board. The first plate is circular and has a first diameter. The second plate is located on the first plate or on a second side surface of the supporting board. The second side surface is opposite to the first side surface. The second plate is circular and has a second diameter less than the first diameter. An area of each of the first and second plates is less than an area of the supporting board. A projection of each of the first and second plates on the supporting board is formed within the supporting board.Type: ApplicationFiled: November 5, 2021Publication date: May 11, 2023Inventors: Li-Chung CHEN, Cheng LIU, Chuan-Chen HSU
-
Publication number: 20230010016Abstract: A multidrop network system includes N network devices including a master device and a plurality of slave devices. The N network devices synchronize their respective time zones in a synchronization phase, then jointly perform equalizer coefficient training in a training phase, and then obtain their respective transmission opportunities in turn in a data transmission phase. Each network device includes a channel equalizer trained in the training phase and used for processing data in the data transmission phase. In the training phase, the master device sends out a training notification to request the slave devices to enter the training phase; the master device performs the equalizer coefficient training after it transmits the training notification, and the slave devices perform the equalizer coefficient training after they receive the training notification. After the completion of the equalizer coefficient training, the master device sends out a beacon to start the data transmission phase.Type: ApplicationFiled: March 17, 2022Publication date: January 12, 2023Inventors: YUNG-LE CHANG, LI-CHUNG CHEN, YUAN-JIH CHU, SHIEH-HSING KUO
-
Patent number: 11456753Abstract: A signal processor includes a signal receiving circuit, a pre-processing circuit, a period acquisition circuit, and a decoding circuit. The signal receiving circuit is configured to receive an input signal. The pre-processing circuit is configured to generate a square wave signal according to the input signal. The period acquisition circuit is configured to capture several periods of the square wave signal. The several signal periods includes several signal period groups, and each of the several signal period groups includes at least two signal periods of the several signal periods. The at least two signal periods are adjacent to each other. The decoding circuit is coupled to the period acquisition circuit and is configured to perform decoding according to a time length and a number of times of voltage value change of the several signal period groups to obtain a decoding result.Type: GrantFiled: March 16, 2021Date of Patent: September 27, 2022Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Yuan-Jih Chu, Bo-Cheng Lin, Chia-Chang Lin, Li-Chung Chen
-
Publication number: 20220116051Abstract: A signal processor includes a signal receiving circuit, a pre-processing circuit, a period acquisition circuit, and a decoding circuit. The signal receiving circuit is configured to receive an input signal. The pre-processing circuit is configured to generate a square wave signal according to the input signal. The period acquisition circuit is configured to capture several periods of the square wave signal. The several signal periods includes several signal period groups, and each of the several signal period groups includes at least two signal periods of the several signal periods. The at least two signal periods are adjacent to each other. The decoding circuit is coupled to the period acquisition circuit and is configured to perform decoding according to a time length and a number of times of voltage value change of the several signal period groups to obtain a decoding result.Type: ApplicationFiled: March 16, 2021Publication date: April 14, 2022Inventors: Yuan-Jih CHU, Bo-Cheng Lin, Chia-Chang Lin, Li-Chung Chen
-
Patent number: 11277168Abstract: A communication device is disclosed. The communication device includes a transceiver circuit, an echo canceler, and a processor. The transceiver circuit is configured to transmit a test signal to a channel. The echo canceler is configured to obtain a plurality of echo power of a reflected signal corresponding to the test signal. The processor is configured to obtain a plurality of positions on the channel according to a parameter value. The parameter value is N, a number of the plurality of positions is N, and the plurality of positions corresponds to the top N largest of the plurality of echo power. The echo canceler is further configured to eliminate part of the plurality of echo power corresponding to the plurality of positions according to the plurality of positions.Type: GrantFiled: September 8, 2020Date of Patent: March 15, 2022Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Wei-Ting Lin, Yuan-Jih Chu, Li-Chung Chen, Hsin-Yun Hu
-
Publication number: 20210175924Abstract: A communication device is disclosed. The communication device includes a transceiver circuit, an echo canceler, and a processor. The transceiver circuit is configured to transmit a test signal to a channel. The echo canceler is configured to obtain a plurality of echo power of a reflected signal corresponding to the test signal. The processor is configured to obtain a plurality of positions on the channel according to a parameter value. The parameter value is N, a number of the plurality of positions is N, and the plurality of positions corresponds to the top N largest of the plurality of echo power. The echo canceler is further configured to eliminate part of the plurality of echo power corresponding to the plurality of positions according to the plurality of positions.Type: ApplicationFiled: September 8, 2020Publication date: June 10, 2021Inventors: Wei-Ting LIN, Yuan-Jih CHU, Li-Chung CHEN, Hsin-Yun HU
-
Patent number: 10791006Abstract: An electronic system includes a feedforward equalizer, a feedback equalizer, an RFI canceler, and a control circuit. The feedforward equalizer and the feedback equalizer are configured to adjust the channel response of a transmission channel in the electronic system. The RFI canceler is configured to cancel the RFI presence in the electronic system. When the RFI canceler is off, the controller is configured to turn on the RFI canceler according to a signal error value before RFI cancelation, an error term of the electronic system, or an SNR of the electronic system.Type: GrantFiled: January 20, 2020Date of Patent: September 29, 2020Assignee: Realtek Semiconductor Corp.Inventors: Chia-Chang Lin, Li-Chung Chen, Ching-Yao Su, Yuan-Jih Chu
-
Publication number: 20190130417Abstract: Systems and methods to maintain digital chain of custody of containers and products loaded therein are described. A container may be verified, and products to be loaded into the container may be identified. Video data may be captured throughout the loading process, and the video data, together with product information, may be combined to generate a digital container model. Further, a monitoring device may be included within the container to gather data during shipment. During shipment, the digital container model may be provided to and reviewed by a recipient of the container. Upon arrival of the container, monitoring data of the monitoring device may also be reviewed by the recipient. Based on reviews of the digital container model and the monitoring data, digital chain of custody may be established and maintained for all or a portion of the products in the container from loading to arrival.Type: ApplicationFiled: October 27, 2017Publication date: May 2, 2019Inventors: William James Watt, James Li-Chung Chen, Christopher Angelo Rocca
-
Publication number: 20170364636Abstract: A method for conducting questionnaire survey is implemented by a server coupled to a user equipment (UE). The method includes the steps of: transmitting a first questionnaire to the UE; receiving a user answer for a specific question of the first questionnaire from the UE; determining whether to transmit to the UE a second questionnaire that is associated with an issue raised in the specific question according to the user answer therefor and at least one of a physiological parameter associated with a user, an ambient parameter, or personal information of the user; and when the determination is affirmative, transmitting the second questionnaire to the UE.Type: ApplicationFiled: January 11, 2017Publication date: December 21, 2017Inventor: Mike Li-Chung CHEN
-
Patent number: 7898376Abstract: A transformer apparatus and a transformer shielding method are provided for shielding external electronic noises and protecting against erosion. The transformer apparatus comprises a toroidal core, a primary winding, a secondary winding, a protection tape, a metal foil, and an UL tube. The primary winding and the secondary winding are wound around the toroidal core at opposite side to each other. The protection tape is wrapped around the primary winding and the secondary winding. The metal foil encloses the protection tape. The UL tube enfolds the metal foil. The transformer shielding method comprises wrapping a primary winding and a secondary winding of the transformer apparatus by a protection tape, enclosing the protection tape by a metal foil, and enfolding the metal foil by an UL tube.Type: GrantFiled: May 20, 2008Date of Patent: March 1, 2011Assignee: Sercomm CorporationInventors: Yuan Yuan Yu, Li Chung Chen