Patents by Inventor LI-CHUNG LAI

LI-CHUNG LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157217
    Abstract: A golf teaching method and a golf teaching system are provided. The golf teaching method includes: configuring image capturing devices and golf simulator to capture swing images and corresponding simulator data records, when a user performs a golf swing; configuring an expert model that includes expert motion information and corresponding correction suggestion information; configuring a computing device to perform an analysis process on the swing images and the simulator data records to divide the golf swing into user motions according to stages and obtaining records of user motion information corresponding to the plurality of stages, and to compare the user motion information with the corresponding expert motion information in each stage through the expert model, and to provide the corresponding correction suggestion information according to a comparison result; and configuring a user interface to provide the correction suggestion information.
    Type: Application
    Filed: April 20, 2023
    Publication date: May 16, 2024
    Inventors: CHENG-HUNG TSAI, CHIA-YU JIH, CHIH-CHUNG CHIEN, LI-LIN LU, SHAO-JUN TAN, WEN-FU LAI
  • Publication number: 20240145378
    Abstract: An interconnect structure on a semiconductor die includes: a lower conductive layer; an upper conductive layer disposed above the lower conductive layer; and a VIA disposed between the lower conductive layer and the upper conductive layer. The VIA includes: a primary interconnect structure and a sacrificial stress barrier ring disposed around the primary interconnect structure and separated a distance from the primary interconnect structure. A fabrication method for the interconnect structure includes: forming a dielectric layer over a lower conductive layer; patterning photoresist (PR) layer over the dielectric layer to define a location for a plurality of VIA trenches, wherein the patterning includes patterning the PR layer to provide a center opening for the VIA trenches that is surrounded by a ring opening for the VIA trenches, wherein the center opening and the ring opening are spaced apart.
    Type: Application
    Filed: February 7, 2023
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ting Liu, Chen-Chiu Huang, Dian-Hau Chen, Hung-Chao Kao, Hsiang-Ku Shen, Wen-Chiung Tu, Li Chung Yu, Yu-Chung Lai
  • Patent number: 11114252
    Abstract: Disclosures of the present invention mainly describe a method for manufacturing perovskite solar cell module. At first, a laser scribing is adopted for forming multi transparent conductive films (TCFs) on a transparent substrate. Subsequently, by using a first mask, multi HTLs, active layers, and ETLs are sequentially formed on the TCFs. Consequently, by the use of a second make, each of the ETLs is formed with an electrically connecting layer thereon, such that a perovskite solar cell module comprising a plurality of solar cell units is hence completed on the transparent substrate. It is worth explaining that, during the whole manufacturing process, each of the solar cell units is prevented from receiving bad influences that are provided by laser scribing or manufacture environment, such that each of the solar cell units is able to exhibit outstanding photoelectric conversion efficiency.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: September 7, 2021
    Assignee: CPC Corporation, Taiwan
    Inventors: Kuan-Chieh Huang, Li-Chung Lai, Chung-Kwang Lee
  • Publication number: 20210057169
    Abstract: Disclosures of the present invention mainly describe a method for manufacturing perovskite solar cell module. At first, a laser scribing is adopted for forming multi transparent conductive films (TCFs) on a transparent substrate. Subsequently, by using a first mask, multi HTLs, active layers, and ETLs are sequentially formed on the TCFs. Consequently, by the use of a second make, each of the ETLs is formed with an electrically connecting layer thereon, such that a perovskite solar cell module comprising a plurality of solar cell units is hence completed on the transparent substrate. It is worth explaining that, during the whole manufacturing process, each of the solar cell units is prevented from receiving bad influences that are provided by laser scribing or manufacture environment, such that each of the solar cell units is able to exhibit outstanding photoelectric conversion efficiency.
    Type: Application
    Filed: February 12, 2020
    Publication date: February 25, 2021
    Inventors: Kuan-Chieh Huang, Li-Chung Lai, Chung-Kwang Lee
  • Publication number: 20170194102
    Abstract: A solar cell module with a perovskite layer is revealed. The solar cell module includes a transparent substrate with a light incident surface and a surface opposite to the light incident surface. A plurality of solar cell units is disposed on the surface and each solar cell includes a transparent conductive layer, a first carrier transport layer, a perovskite layer and a second carrier transport layer. An insulation layer is not only located between the adjacent solar cell units but also covered over the solar cell units. A plurality of conductors is used for electrical connection of the plurality of solar cell units in series. Thus the solar cell module has better open circuit voltage and higher stability owing to connection way of the solar cell units in series and the insulation layer.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 6, 2017
    Inventors: KUAN-CHIEH HUANG, LI-CHUNG LAI