Abstract: Dual operation centrifugal fan apparatus and methods of operating same that may be used, for example, to cool the internal heat-generating components of an information handling system or other device. The dual operation centrifugal fan apparatus may be implemented in one embodiment as a self-cleaning blower apparatus that is operated in a first normal cooling direction to dissipate heat from internal components of an information handling system, and operated in second cleaning direction to reverse airflow and expel accumulated dust from the interior of the information handling system.

Abstract: A chemical mechanical polishing (CMP) system includes a wafer polishing unit comprising a waste liquid sink for receiving a used slurry and a waste slurry drain piping for draining the used slurry; and a post-CMP cleaning unit coupled to the wafer polishing unit such that a used base chemical such as tetramethyl ammonium hydroxide (TMAH) produced from the post-CMP cleaning unit flows toward the wafer polishing unit to frequently wash at least the waste slurry drain piping in a real time fashion on a wafer by wafer basis.

Abstract: A chemical mechanical polishing (CMP) system includes a wafer polishing unit producing a used slurry; a slurry treatment system for receiving and treating the used slurry to thereby produce an extracted basic solution; and a post-CMP cleaning unit utilizing the extracted basic solution to wash a polished wafer surface. The post-CMP cleaning unit includes a plurality of rollers for supporting and rotating a wafer, a brush for scrubbing the wafer, and a spray bar disposed in proximity to the brush for spraying the extracted basic solution onto the polished wafer surface.

Abstract: A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying device comprising two spray bars jointed together via a joint member.

Abstract: An information handling system (IHS) chassis defines a component housing. An IHS component is located in the component housing. The IHS component defines a module channel, a module chassis locating slot adjacent the module channel, and a pair of module chassis securing apertures adjacent the module channel. The IHS component includes a module chassis retaining surface that is spaced apart from the module channel. A module chassis is located in the module channel, includes a retaining wall that engages the module chassis retaining surface and a locating member that extends into the module chassis locating slot, and defines a module housing. The module chassis is secured to the component through the pair of module chassis securing apertures. A latching module is located in the module housing and secured to the module chassis. The latching module engages the IHS chassis to resist removal of the IHS component from the component housing.

Abstract: A securing system includes a base member. A display member is rotatably coupled to the base member by a shaft. A locking member is operable to move axially relative to the shaft and engage the display member in order to restrict the display member from rotating relative to the base member. The base member and the display member may be part of an information handling system (IHS). A lock including a cable that is coupled to a stationary object may be used to secure the IHS to the stationary object and prevent the use of the IHS by positioning the lock in the base member in order to move the locking member such that it engages the display member.

Abstract: A CMP slurry mix and delivery system includes at least one container for holding a polishing agent; a pump connected to the container for pumping the polishing agent to a point of use; and a slurry dispersion unit installed between the pump and the point of use, wherein slurry dispersion unit provides megasonic energy that is capable of dispersing the polishing agent flowing through the slurry dispersion unit.

Abstract: A method of cleaning a wafer is disclosed in the present invention. This method is particularly suitable for cleaning the metal layer on the wafer. First, a wafer having a metal layer is loaded into a cleaning chamber, wherein a plurality of particles are inlaid in a surface of the metal layer. Later, a first clean stage is performed to rinse the wafer by jetted liquid introduced with megasonic energy. After the first clean stage, a second clean stage is performed to scrub the wafer. Finally, the wafer is dried.

Abstract: A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying device comprising two spray bars jointed together via a joint member.

Abstract: A CMP apparatus includes an enclosure; a platen disposed within the enclosure, and a carrier for holding and rotating a wafer. The platen consists of a central, circular-shaped segment and a peripheral, annular-shaped segment with a gap formed therebetween. A first polishing pad is mounted on the central, circular-shaped segment. A second polishing pad is mounted on the peripheral, annular-shaped segment. In polishing, the carrier rotates between the first and second polishing pads, such that an annular edge region of the wafer is in direct contact with the second polishing pad.

Abstract: A wafer cleaning method includes: (1) providing a wafer cleaning apparatus comprising a sponge for scrubbing a surface of a semiconductor wafer to be cleaned; (2) implementing a pre-conditioning flow to pre-condition the sponge using a dummy wafer; and (3) performing a regular cleaning flow to scrub the surface of the semiconductor wafer to be cleaned using the pre-conditioned sponge. The dummy wafer has a plurality of upward protruding features on a surface of the dummy wafer for removing residual fibers or unwanted substances from the sponge.

Abstract: A chemical mechanical polishing (CMP) system includes a wafer polishing unit comprising a waste liquid sink for receiving a used slurry and a waste slurry drain piping for draining the used slurry; and a post-CMP cleaning unit coupled to the wafer polishing unit such that a used base chemical such as tetramethyl ammonium hydroxide (TMAH) produced from the post-CMP cleaning unit flows toward the wafer polishing unit to frequently wash at least the waste slurry drain piping in a real time fashion on a wafer by wafer basis.

Abstract: A chemical mechanical polishing (CMP) system includes a wafer polishing unit producing a used slurry; a slurry treatment system for receiving and treating the used slurry to thereby produce an extracted basic solution; and a post-CMP cleaning unit utilizing the extracted basic solution to wash a polished wafer surface. The post-CMP cleaning unit includes a plurality of rollers for supporting and rotating a wafer, a brush for scrubbing the wafer, and a spray bar disposed in proximity to the brush for spraying the extracted basic solution onto the polished wafer surface.

Abstract: An information handling system (IHS) chassis defines a component housing. An IHS component is located in the component housing. The IHS component defines a module channel, a module chassis locating slot adjacent the module channel, and a pair of module chassis securing apertures adjacent the module channel. The IHS component includes a module chassis retaining surface that is spaced apart from the module channel. A module chassis is located in the module channel, includes a retaining wall that engages the module chassis retaining surface and a locating member that extends into the module chassis locating slot, and defines a module housing. The module chassis is secured to the component through the pair of module chassis securing apertures. A latching module is located in the module housing and secured to the module chassis. The latching module engages the IHS chassis to resist removal of the IHS component from the component housing.

Abstract: Dual operation centrifugal fan apparatus and methods of operating same that may be used, for example, to cool the internal heat-generating components of an information handling system or other device. The dual operation centrifugal fan apparatus may be implemented in one embodiment as a self-cleaning blower apparatus that is operated in a first normal cooling direction to dissipate heat from internal components of an information handling system, and operated in second cleaning direction to reverse airflow and expel accumulated dust from the interior of the information handling system.

Abstract: A thermal sublimation imaging apparatus and a thermal sublimation printer using the same are described. A print head of the thermal sublimation imaging apparatus is fixed, a platen capable of contacting or separating from the fixed print head is lifted up to contact the fixed print head, and an elastic component is used in conjunction to provide a pressure for printing. The platen lays flat in paper feed/reverse mode, and presses downwardly to drive a paper pickup plate to fetch paper. These actions are achieved by a stepper motor together with a sensor through a worm shaft, a worm gear, and at least a gear. Therefore, the number and the cost of the gears are reduced, and the time for switching the printing action is greatly reduced since the switching can be implemented within a very small rotation angle.

Abstract: A metal laminate assembly includes a plastic film and a metal film bonded together using a pressure-sensitive adhesive between them. The bonded films may be formed into a desired shape. A plastic part is formed to the bonded films using a single-shot in-mold film molding system. Accordingly, the laminate assembly has the plastic part on a first side and the metal film on a second side, opposite the first side of the assembly.

Abstract: A securing system includes a base member. A display member is rotatably coupled to the base member by a shaft. A locking member is operable to move axially relative to the shaft and engage the display member in order to restrict the display member from rotating relative to the base member. The base member and the display member may be part of an information handling system (IHS). A lock including a cable that is coupled to a stationary object may be used to secure the IHS to the stationary object and prevent the use of the IHS by positioning the lock in the base member in order to move the locking member such that it engages the display member.

Abstract: A thermal sublimation imaging apparatus and a thermal sublimation printer using the same are described. A print head of the thermal sublimation imaging apparatus is fixed, a platen capable of contacting or separating from the fixed print head is lifted up to contact the fixed print head, and an elastic component is used in conjunction to provide a pressure for printing. The platen lays flat in paper feed/reverse mode, and presses downwardly to drive a paper pickup plate to fetch paper. These actions are achieved by a stepper motor together with a sensor through a worm shaft, a worm gear, and at least a gear. Therefore, the number and the cost of the gears are reduced, and the time for switching the printing action is greatly reduced since the switching can be implemented within a very small rotation angle.

Abstract: A chemical mechanical polishing apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, a washer having a cleaning device; and a dresser. The dresser comprises a bottom disk contacting the polishing pad. The dresser can move between the polishing pad and the washer. When the dresser moves into the washer, a diamond zone on the bottom disk cleans the polishing pad, and the cleaning device cleans the diamond zone.