Publication number: 20240264528
Abstract: Photoresist underlayer compositions, comprising: a curable compound comprising a group of the following formula (1): wherein: R1 is each independently H, C1-30 alkyl, or C3-30 cycloalkyl; Ar1 is an aromatic ring or a fused aromatic ring system having from 5 to 30 carbon atoms, wherein Ar1 is substituted or unsubstituted; Ar2 is an aromatic ring chosen from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a fused aromatic ring system having from 5 to 30 carbon atoms, wherein Ar2 optionally comprises a fused cyclic imide moiety, a fused oxazole moiety, a fused imidazole moiety, or a fused thiazole moiety, and wherein Ar2 is substituted or unsubstituted; Y1 is a single covalent bond, or is selected from —O—, —C(O)—, —C(O)O—, —S—, —S(O)2—, —N(R2)—, —C(O)N(R2)—, —C(O)N(R2)C(O)—, —(CH2)y—, or a combination thereof, wherein R2 is H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, C5-30 aryl, C(O)R3, or S(O)2R3, wherein R3 is chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl,
Type:
Application
Filed:
December 12, 2023
Publication date:
August 8, 2024
Inventors:
Sheng LIU, Iou-Sheng KE, Keren ZHANG, James F. CAMERON, Shintaro YAMADA, Li CUI