Patents by Inventor Li-Fu Ding

Li-Fu Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tool and method for modeling interposer RC couplings
    Patent number: 8856710
    Abstract: A method comprises analyzing front side conductive patterns and back side conductive patterns on a semiconductor interposer using a machine implemented RC extraction tool, and outputting data representing a plurality of respective RC nodes from the RC extraction tool to a tangible persistent machine readable storage medium. A substrate mesh model of the semiconductor interposer is generated, having a plurality of substrate mesh nodes. Each substrate mesh node is connected to adjacent ones of the plurality of substrate mesh nodes by respective substrate impedance elements. A set of inputs to a timing analysis tool is formed. The plurality of RC nodes are connected to ones of the plurality of substrate mesh nodes of the substrate mesh model. The set of inputs is stored in a tangible machine readable storage medium.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: October 7, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chao-Yang Yeh, Ze-Ming Wu, Meng-Lin Chung, Chih-Chia Chen, Li-Fu Ding, Sa-Lly Liu
  • TOOL AND METHOD FOR MODELING INTERPOSER RC COUPLINGS
    Publication number: 20130007692
    Abstract: A method comprises analyzing front side conductive patterns and back side conductive patterns on a semiconductor interposer using a machine implemented RC extraction tool, and outputting data representing a plurality of respective RC nodes from the RC extraction tool to a tangible persistent machine readable storage medium. A substrate mesh model of the semiconductor interposer is generated, having a plurality of substrate mesh nodes. Each substrate mesh node is connected to adjacent ones of the plurality of substrate mesh nodes by respective substrate impedance elements. A set of inputs to a timing analysis tool is formed. The plurality of RC nodes are connected to ones of the plurality of substrate mesh nodes of the substrate mesh model. The set of inputs is stored in a tangible machine readable storage medium.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 3, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Yang Yeh, Ze-Ming Wu, Meng-Lin Chung, Chih-Chia Chen, Li-Fu Ding, Sa-Lly Liu