Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.

Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.

Abstract: A server includes a baseboard management controller (BMC). More than one inter-integrated circuit (I2C) device may be connected to the BMC via a multiplexing switch. The server sets a first identifier for indicating which channels of I2C device are open, and a second identifier for indicating which channels of the I2C devices are closed, and sends the set information to the BMC. To test a selected I2C device, the server opens a channel to the selected I2C device and assigns the first identifier to the channel of the selected I2C device. During testing of the selected I2C device, if the BMC intends to access a different I2C device, the BMC waits for the identifier of the selected I2C device to change from the first identifier to the second identifier, and then opens a channel to the different I2C device.

Abstract: A server includes a baseboard management controller (BMC). More than one inter-integrated circuit (I2C) device may be connected to the BMC via a multiplexing switch. The server sets a first identifier for indicating which channels of I2C device are open, and a second identifier for indicating which channels of the I2C devices are closed, and sends the set information to the BMC. To test a selected I2C device, the server opens a channel to the selected I2C device and assigns the first identifier to the channel of the selected I2C device. During testing of the selected I2C device, if the BMC intends to access a different I2C device, the BMC waits for the identifier of the selected I2C device to change from the first identifier to the second identifier, and then opens a channel to the different I2C device.