Abstract: A method of forming a semiconductor includes forming a first recess in a first semiconductor fin protruding from a substrate and forming a second recess in a second semiconductor fin protruding from the substrate first semiconductor fin and forming a source/drain region in the first recess and the second recess. Forming the source/drain region includes forming a first portion of a first layer in the first recess and forming a second portion of the first layer in the second recess, forming a second layer on the first layer by flowing a first precursor, and forming a third layer on the second layer by flowing a second precursor, the third layer being a single continuous material.

Abstract: The present disclosure provides a semiconductor structure with having a source/drain feature with a central cavity, and a source/drain contact feature formed in central cavity of the source/drain region, wherein the source/drain contact feature is nearly wrapped around by the source/drain region. The source/drain contact feature may extend to a lower most of a plurality semiconductor layers.

Abstract: A method of manufacturing a semiconductor device includes forming a multi-layer stack of alternating first layers of a first semiconductor material and second layers of a second semiconductor material on a semiconductor substrate, forming a first recess through the multi-layer stack, and laterally recessing sidewalls of the second layers of the multi-layer stack. The sidewalls are adjacent to the first recess. The method further includes forming inner spacers with respective seams adjacent to the recessed second layers of the multi-layer stack and performing an anneal treatment on the inner spacers to close the respective seams.

Abstract: The present invention discloses a composite molded casing, which comprises a casing body having a mold line and a decorative layer coated on the surface of the casing body to cover the mold line. The present invention exempts the composite molded casing from complicated secondary machining processes (such as processes of grinding and polishing) and thus indirectly reduces the fabrication cost of molds and promotes the yield of products. Further, the present invention uses an IMF technology to fabricate the decorative layer, not only completely covering the mold line but also overcoming the problem of color difference likely to occur in the conventional injection-molded plastic products. Therefore, the present invention can exempt the composite molded casing from complicated post-fabrication processes, such as processes of paint spraying, printing, electroplating, photoelectric engraving, etc.

Abstract: A footpad includes an anti-slip pad and a fixing member. The anti-slip pad provides an inner recess. The fixing member has a base corresponding to the inner groove, extending outward a plurality of holding pawls from a lateral side of the base and the holding pawls are disposed at the circumference edge of the lateral side equidistantly in a way of spacing apart a gap from each other. The fixing member is capable of being inserted into the inner recess and the holding pawls are capable of engaging with the base of a product such as the telephone set, the stationery or the office article easily without loosening to perform the function of resisting slip.