Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a bottom electrode layer over a substrate. A magnetic tunnel junction (MTJ) layers are formed over the bottom electrode layer. A top electrode layer is formed over the MTJ layers. The top electrode layer is patterned. After patterning the top electrode layer, one or more process cycles are performed on the MTJ layers and the bottom electrode layer. A patterned top electrode layer, patterned MTJ layers and a patterned bottom electrode layer form MTJ structures. Each of the one or more process cycles includes performing an etching process on the MTJ layers and the bottom electrode layer for a first duration and performing a magnetic treatment on the MTJ layers and the bottom electrode layer for a second duration.

Abstract: Provided is a photocurable conductive black composition including: (a) at least one (meth)acrylate-functionalized urethane oligomer; (b) at least one photopolymerizable compound; (c) a photoinitiator; (d) a visible-light blocking system; (e) conductive fillers; and optionally (f) a thermal initiator. Also provided are a method for forming a cured product composed of the photocurable conductive black compositions, and an article comprising the cured product.

Abstract: A method of producing ceramic articles with a relief image comprises the steps of providing a ceramic article formed with a relief image thereon, providing a planar transfer decal having an image corresponding to the relief image, perforating the transfer decal to form a plurality of perforations through the transfer decal, applying the perforated transfer decal to the ceramic article, and firing the ceramic article with the perforated transfer article in a kiln. A pin tool comprising an array of pins is used to perforating the transfer decal. The relief image of the ceramic article can be formed in a mold or by an impressing roll such that an internal angle formed by each element of the relief image with respect to a surface of the ceramic article is less than 50 degree, preferably less than 45 degree. Pressure is applied to the perforated transfer decal against the surface of the relief image of the ceramic article manually or mechanically prior to the firing step.