Patents by Inventor LI-HONG NA

LI-HONG NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9855722
    Abstract: A composite article includes a ceramic part, a plastic part, and an adhesive layer connecting the ceramic part to the plastic part. The adhesive layer includes polyvinyl acetate, polyvinyl alcohol, dibutyl phthalate, and sec-butyl acetate.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: January 2, 2018
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (Hong Kong) Limited
    Inventors: Li-Hong Na, Xu Liu
  • Publication number: 20160187932
    Abstract: A housing includes a substrate defining a surface, and at least one seal ring formed on the substrate, the seal ring is made of elastic material, a surface of the seal ring connected with the substrate has a plurality of ribs, the surface of the substrate connecting with the seal ring has a plurality of holes, the ribs are engaged in the holes. A method of making a housing includes: a substrate defining a surface is provided; a plurality of holes is formed on the substrate; and at least one seal ring is formed on the substrate, the seal ring has a plurality of ribs, the ribs are engaged in the holes.
    Type: Application
    Filed: January 27, 2015
    Publication date: June 30, 2016
    Inventors: CHAO-HSUN LIN, YI-TING YEH, LI-HONG NA, YUAN-XIONG LIU
  • Patent number: 9243317
    Abstract: A electronic device housing includes a substrate, and the electronic device housing further includes a first color layer, a metallic coating, a second color layer, and a second metallic coating formed directly on the substrate in that order. The first color layer is disposed on the substrate and covering portions of the internal surface. The first metallic coating is formed on the first color layer and completely covers the first color layer. The second color layer is formed on the first metallic coating and directly covers the portions of the internal surface which is uncovered by the first color layer. The second color layer and the first color layer have different colors. The second color layer and the first color layer are transparent or translucent. A method for manufacturing the electronic device housing is also provided.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: January 26, 2016
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (Hong Kong) Limited
    Inventors: Xu Liu, Li-Hong Na
  • Publication number: 20140255634
    Abstract: A housing includes a substrate and a protective layer. The protective layer is formed on the substrate. The substrate includes a first member and a second member, the first member is made of plastic and the second member is made of metal. The protective layer is made of silicone rubber and is formed on the second member of the substrate. The protective layer has a peripheral waterproof portion covering a peripheral edge of the substrate.
    Type: Application
    Filed: August 23, 2013
    Publication date: September 11, 2014
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventor: LI-HONG NA
  • Publication number: 20140186616
    Abstract: A composite article includes a ceramic part, a plastic part, and an adhesive layer connecting the ceramic part to the plastic part. The adhesive layer includes polyvinyl acetate, polyvinyl alcohol, dibutyl phthalate, and sec-butyl acetate.
    Type: Application
    Filed: April 17, 2013
    Publication date: July 3, 2014
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: LI-HONG NA, XU LIU
  • Publication number: 20140113089
    Abstract: A electronic device housing includes a substrate, and the electronic device housing further includes a first color layer, a metallic coating, a second color layer, and a second metallic coating formed directly on the substrate in that order. The first color layer is disposed on the substrate and covering portions of the internal surface. The first metallic coating is formed on the first color layer and completely covers the first color layer. The second color layer is formed on the first metallic coating and directly covers the portions of the internal surface which is uncovered by the first color layer. The second color layer and the first color layer have different colors. The second color layer and the first color layer are transparent or translucent. A method for manufacturing the electronic device housing is also provided.
    Type: Application
    Filed: April 30, 2013
    Publication date: April 24, 2014
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: XU LIU, LI-HONG NA