Patents by Inventor Li-Hsiang Chao

Li-Hsiang Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230290842
    Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 14, 2023
    Inventors: Cheng-Wei Chang, Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu
  • Publication number: 20230278160
    Abstract: A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Yuan YANG, Huai-Tei YANG, Yu-Chen WEI, Szu-Cheng WANG, Li-Hsiang CHAO, Jen-Chieh LAI, Shih-Ho LIN
  • Patent number: 11685015
    Abstract: A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: June 27, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Yuan Yang, Huai-Tei Yang, Yu-Chen Wei, Szu-Cheng Wang, Li-Hsiang Chao, Jen-Chieh Lai, Shih-Ho Lin
  • Patent number: 11652149
    Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: May 16, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Wei Chang, Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu
  • Publication number: 20220052168
    Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.
    Type: Application
    Filed: December 4, 2020
    Publication date: February 17, 2022
    Inventors: Cheng-Wei Chang, Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu
  • Publication number: 20200238473
    Abstract: A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.
    Type: Application
    Filed: January 28, 2019
    Publication date: July 30, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Yuan YANG, Huai-Tei YANG, Yu-Chen WEI, Szu-Cheng WANG, Li-Hsiang CHAO, Jen-Chieh LAI, Shih-Ho LIN
  • Publication number: 20150129131
    Abstract: A semiconductor processing apparatus includes an electromagnetic generator, an analog signal module, and an electromagnetic shield. The electromagnetic generator is capable of generating an electromagnetic field. The analog signal module is located adjacent to the electromagnetic generator and capable of generating an analog signal. The electromagnetic shield is capable of shielding the analog signal module. The electromagnetic shield includes a plurality of covering plates. Each of the covering plates and the analog signal module are apart from at least a predetermined distance.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Ching LI, Wei-Hao WU, Li-Hsiang CHAO, Bo-Wei WANG, Yen-Yu CHEN, Wei ZHANG
  • Publication number: 20100257031
    Abstract: In an interactive advertising system and a method thereof, the system includes: an advertising platform system, for storing at least one advertising and a specific answer related to the advertising content provided by at least one advertiser; and at least one man-machine interface, for connecting the advertising platform system through a network. If the advertising platform system provides at least one reply screen to the man-machine interface through the network, and a user give at least one answer to at least one reply screen, the advertising platform system will compare the answer with the specific answer and rebate a predetermined amount of bonus to the user according to a comparison result. Therefore, the user can get a bonus after browsing the advertising and answering the question, such that the key points of the advertising can further give a deeper impression to users to improve the exposure and advertising effects.
    Type: Application
    Filed: April 3, 2009
    Publication date: October 7, 2010
    Inventor: Li-Hsiang Chao
  • Publication number: 20070267487
    Abstract: A system for using a communications network with a server and a database to provide income-generating business card and referral card network. In one embodiment, a credit card issuer provides a set of personalized business cards to a first customer for his use, upon qualifying the first customer for a credit card from the card issuer. The business cards can be used to receive a discount from a merchant within certain network affiliated with the card issuer. At the same time, the business cards provide a linkage to the first customer's account, so that the first customer will receive a credit to his account, based on the second customer's use of the business card at an affiliated merchant. The second customer is then invited to apply for a credit card from the card issuer. If the second customer qualifies and accepts the credit card, the second customer receives his own set of personalized business cards for distribution.
    Type: Application
    Filed: August 8, 2007
    Publication date: November 22, 2007
    Inventor: Li-Hsiang Chao
  • Patent number: 7255267
    Abstract: A system and method for using a communications network with a server and a database to provide income-generating business card and referral card network. In one embodiment, a credit card issuer provides a set of personalized business cards to a first customer for his use, upon qualifying the first customer for a credit card from the card issuer. The business cards can be used to receive a discount from a merchant within certain network affiliated with the card issuer. At the same time, the business cards provide a linkage to the first customer's account, so that the first customer will receive a credit to his account, based on the second customer's use of the business card at an affiliated merchant. The second customer is then invited to apply for a credit card from the card issuer. If the second customer qualifies and accepts the credit card, the second customer receives his own set of personalized business cards for distribution.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: August 14, 2007
    Inventor: Li-Hsiang Chao
  • Publication number: 20050279830
    Abstract: A system and method for using a communications network with a server and a database to provide income-generating business card and referral card network. In one embodiment, a credit card issuer provides a set of personalized business cards to a first customer for his use, upon qualifying the first customer for a credit card from the card issuer. The business cards can be used to receive a discount from a merchant within certain network affiliated with the card issuer. At the same time, the business cards provide a linkage to the first customer's account, so that the first customer will receive a credit to his account, based on the second customer's use of the business card at an affiliated merchant. The second customer is then invited to apply for a credit card from the card issuer. If the second customer qualifies and accepts the credit card, the second customer receives his own set of personalized business cards for distribution.
    Type: Application
    Filed: September 20, 2005
    Publication date: December 22, 2005
    Inventor: Li-Hsiang Chao