Abstract: An intrusion detection apparatus, including: a printed circuit board (PCB), including: an electrical switch, the electrical switch including: conductive pads positioned on a top layer of the PCB, and a conductive ground ring positioned on the top layer and surrounding the conductive pads; and a mechanical pin coupled to a first portion of a chassis of the information handling system at a first end of the mechanical pin, the mechanical pin including a conductive gasket positioned at a second end of the mechanical pin, the first end opposite to the second end, wherein the ground ring provides an intrusion signal when a foreign conductive object is in contact with the ground ring to indicate a presence of the foreign conductive object.

Abstract: An intrusion detection apparatus, including: a printed circuit board (PCB), including: an electrical switch, the electrical switch including: conductive pads positioned on a top layer of the PCB, and a conductive ground ring positioned on the top layer and surrounding the conductive pads; and a mechanical pin coupled to a first portion of a chassis of the information handling system at a first end of the mechanical pin, the mechanical pin including a conductive gasket positioned at a second end of the mechanical pin, the first end opposite to the second end, wherein the ground ring provides an intrusion signal when a foreign conductive object is in contact with the ground ring to indicate a presence of the foreign conductive object.

Abstract: A hinge assembly for a computing system, including a hinge assembly coupled to a base bracket of a display assembly, including: a sleeve including a hollow portion at a first end of the sleeve; a retractable shaft, wherein a first end of the retractable shaft is positioned within the hollow portion of the sleeve, the retractable shaft adjustable between a first positional state and a second positional state with respect to the sleeve such that: when the retractable shaft is in the first positional state, a second end of the retractable shaft, opposite the first end, extends a first distance from a second end of the sleeve, opposite the first end of the sleeve; when the retractable shaft is in the second position state, the second end of the retractable shaft extends a second distance from the second end of the sleeve, the second distance greater than the first distance.

Abstract: An integrated snap and handling apparatus is provided. The apparatus may be capable of being assembled with and disassembled from a mating component without damage. The apparatus may include a pair of features that provide an intuitive and easy user interface for removal, handling and installation. The pair of features may allow a user to use a pinching motion to engage and disengage the apparatus from the mating component without the use of a tool. The integrated snap and handling apparatus may provide for low removal forces when the user interface is properly actuated while resisting high separation forces when the user interface is not properly actuated. The integrated snap and handling apparatus may be incorporated into a wide variety of assemblies and devices. For example, the integrated snap and handling apparatus may be incorporated into a cooling duct for the control of airflow around an electronic component.

Abstract: An integrated snap and handling apparatus is provided. The apparatus may be capable of being assembled with and disassembled from a mating component without damage. The apparatus may include a pair of features that provide an intuitive and easy user interface for removal, handling and installation. The pair of features may allow a user to use a pinching motion to engage and disengage the apparatus from the mating component without the use of a tool. The integrated snap and handling apparatus may provide for low removal forces when the user interface is properly actuated while resisting high separation forces when the user interface is not properly actuated. The integrated snap and handling apparatus may be incorporated into a wide variety of assemblies and devices. For example, the integrated snap and handling apparatus may be incorporated into a cooling duct for the control of airflow around an electronic component.

Abstract: A method of controlling gate formation of semiconductor devices includes determining the correlation between the step heights of isolation structures and the over-etching time by measuring step heights of isolation structures, determining an over-etching time based on the step heights, and etching gates using the over-etching time. The method may include an after-etching-inspection to measure the gate profile and fine-tune the gate formation control. Within-wafer uniformity can also be improved by measuring the step height uniformity on a wafer and adjusting gate formation processes.

Abstract: A method for controlling a critical dimension in an etched structure comprises the steps of: forming a hard mask above a substrate, measuring a critical dimension of the hard mask, and using the measured hard mask critical dimension to control a critical dimension trim operation performed on a circuit trace above the substrate.