Patents by Inventor Li-Hsuan Shen

Li-Hsuan Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230115965
    Abstract: The present disclosure provides a molding system for fabricating a FRP composite article. The molding system includes a detector, a resin dispenser, a processing module, and a molding machine. The detector is configured to capture a graph of a woven fiber from a top view. The resin dispenser is configured to provide a resin to the woven fiber to form a FRP. The processing module is configured to receive the graph and a plurality of parameters of the FRP. The processing module includes a CNN model, and is configured to use the CNN model to obtain a plurality of predicted mechanical properties of the FRP according to the graph and the plurality of parameters of the FRP. The molding machine is configured to mold the FRP to fabricate the FRP composite article according to the plurality of predicted mechanical properties.
    Type: Application
    Filed: March 10, 2022
    Publication date: April 13, 2023
    Inventors: CHI-HUA YU, MAO-KEN HSU, YI-WEN CHEN, LI-HSUAN SHEN, CHIH-CHUNG HSU, CHIA-HSIANG HSU, RONG-YEU CHANG
  • Patent number: 11602908
    Abstract: The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: March 14, 2023
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Ching-Kai Chou, Chien-Ting Wu, Hsun Yang, Li-Hsuan Shen, Chih-Chung Hsu, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Publication number: 20230058453
    Abstract: The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.
    Type: Application
    Filed: December 29, 2021
    Publication date: February 23, 2023
    Inventors: Ching-Kai CHOU, Chien-Ting WU, Hsun YANG, Li-Hsuan SHEN, Chih-Chung HSU, Chia-Hsiang HSU, Rong-Yeu CHANG
  • Patent number: 11521903
    Abstract: The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: December 6, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Chien-Ting Wu, Ching-Kai Chou, Kai-Yi Bai, Wei-Yu Lin, Li-Hsuan Shen, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu