Patents by Inventor Li-Hua TAI

Li-Hua TAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220310576
    Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a substrate, a first electronic component, an interlayer, a third electronic component and an encapsulant. The first electronic component is disposed on the substrate. The first electronic component has an upper surface and a lateral surface and a first edge between the upper surface and the lateral surface. The interlayer is on the upper surface of the first electronic component. The third electronic component is attached to the upper surface of the first electronic component via the interlayer. The encapsulant encapsulates the first electronic component and the interlayer. The interlayer does not contact the lateral surface of the first electronic component.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 29, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei Tsung CHEN, Li-Hua TAI, Paofa WANG
  • Publication number: 20220037244
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface of the first substrate. The second substrate has a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate. The semiconductor device package also includes a first electronic component disposed on the first surface of the second substrate and electrically connected to the first surface of the second substrate. The semiconductor device package also includes a first encapsulant and a second encapsulant between the first substrate and the second substrate. The first encapsulant is different from the second encapsulant. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Application
    Filed: August 3, 2020
    Publication date: February 3, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Hua TAI, Wen-Pin HUANG
  • Publication number: 20210391278
    Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.
    Type: Application
    Filed: August 30, 2021
    Publication date: December 16, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Hua TAI, Pai-Chou LIU, Yun-Chih FEI, Wen-Pin HUANG, Sheng-Hong ZHENG
  • Patent number: 11177221
    Abstract: A semiconductor device package includes a first carrier, a first electronic component, a second electronic component, a second carrier and an electrical connection structure. The first carrier has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the first carrier. The second electronic component is disposed on the second surface of the first carrier. The second carrier has a first surface facing the second surface of the first carrier and a second surface opposite to the first surface. The electrical connection structure is electrically connecting the first carrier with the second carrier.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: November 16, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Li-Hua Tai, Yueh-Ju Lin, Wen Shang Chang, Wen-Pin Huang
  • Patent number: 11107774
    Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: August 31, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Li-Hua Tai, Pai-Chou Liu, Yun-Chih Fei, Wen-Pin Huang, Sheng-Hong Zheng
  • Publication number: 20210118806
    Abstract: A semiconductor device package includes a first carrier, a first electronic component, a second electronic component, a second carrier and an electrical connection structure. The first carrier has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the first carrier. The second electronic component is disposed on the second surface of the first carrier. The second carrier has a first surface facing the second surface of the first carrier and a second surface opposite to the first surface.
    Type: Application
    Filed: October 18, 2019
    Publication date: April 22, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Hua TAI, Yueh-Ju LIN, Wen Shang CHANG, Wen-Pin HUANG
  • Publication number: 20200335452
    Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 22, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Hua TAI, Pai-Chou LIU, Yun-Chih FEI, Wen-Pin HUANG, Sheng-Hong ZHENG