Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: A semiconductor structure includes a first transistor, a second transistor, a first dummy source/drain, a third transistor, a fourth transistor, and a second dummy source/drain. The first transistor and a second transistor adjacent to the first transistor are at a first elevation. The first dummy source/drain is disposed at the first elevation. The third transistor and a fourth transistor adjacent to the third transistor, are at a second elevation different from the first elevation. The second dummy source/drain is disposed at the second elevation. The second transistor is vertically aligned with the third transistor. The first dummy source/drain is vertically aligned with a source/drain of the fourth transistor. The second dummy source/drain is vertically aligned with a source/drain of the first transistor. The gate structure between the second dummy source/drain and a source/drain of the third transistor is absent. A method for manufacturing a semiconductor structure is also provided.

Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: A semiconductor device includes one or more active semiconductor components, wherein a front side is defined over the semiconductor substrate and a back side is defined beneath the semiconductor substrate. A front side power rail is formed at the front side of the semiconductor device and is configured to receive a first reference power voltage. First and second back side power rails are formed on the back side of the semiconductor substrate and are configured to receive corresponding second and third reference power voltages. The first, second and third reference power voltages are different from each other.

Abstract: An integrated circuit includes first-type transistors aligned within a first-type active zone, second-type transistors aligned within a second-type active zone, a first power rail and a second power rail extending in a first direction. A first distance between the long edge of the first power rail and the first alignment boundary of the first-type active zone is different from a second distance between the long edge of the second power rail and the first alignment boundary of the second-type active zone. Each of the first distance and the second distance is along a second direction which is perpendicular to the first direction.

Abstract: An object location guiding device and an operation method thereof are provided. The object location guiding device includes a processor, a controller and a guiding element array. Guiding elements of the guiding element array are disposed at different positions in a field so as to point to storage positions of different objects in the field. The processor converts the object data on an object list into storage-position information. The controller receives the storage-position information from the processor, converts the storage-position information into a first axis position code and a second axis position code, and drives the guiding element array by using the first axis position code and the second axis position code, so as to allow at least one corresponding guiding element of the guiding elements to point to a storage position of a corresponding object in the field.

Abstract: An object location guiding device and an operation method thereof are provided. The object location guiding device includes a processor, a controller and a guiding element array. Guiding elements of the guiding element array are disposed at different positions in a field so as to point to storage positions of different objects in the field. The processor converts the object data on an object list into storage-position information. The controller receives the storage-position information from the processor, converts the storage-position information into a first axis position code and a second axis position code, and drives the guiding element array by using the first axis position code and the second axis position code, so as to allow at least one corresponding guiding element of the guiding elements to point to a storage position of a corresponding object in the field.

Abstract: A cap structure includes a capping body, for covering a container mouth of a container. The capping body includes a base layer, a plurality of protruding members disposed on the base layer, and a sidewall joined to a periphery of the base layer. A liner layer having coupling structures is locked with the protruding members. A space is formed between the base layer and the liner layer.

Abstract: A video surveillance system gets a first image from at least a video source, and extracts its image features. It embeds annotation information with at least the image features into the first image, and converts the embedded image into a second image without changing the image format. After having compressed and decompressed the second image, the system extracts the embedded information from the decompressed embedded stream to separate the image and the annotation information, thereby obtaining completely recovered annotation information after a recovery process and an image processing. Because the image format is not changed, the operations on the second image at the rear end of the system, such as compression and decompression, are not affected.

Abstract: A fractal code is provided. The fractal code includes a substrate and a frequency selective surface (FSS). The FSS includes a fractal configuration designed by an iterative procedure, and the fractal configuration is disposed on the substrate. The fractal configuration is formed by a plurality of fractal circle patterns. The radii of the fractal circle patterns decrease by a specified ratio so as to assume a self-similar property, thereby achieving a multi-spectrum property and generating an identification code in frequency domain (FD-ID code). The FD-ID code is applied with space-feed method, and thus a wireless signal is operated in a predetermined band with reflection or transmission radiations, thereby achieving the function of radio frequency identification.

Abstract: A system for testing RFID devices is introduced. The system includes a carrier plate configured for carrying an RFID device, a cable configured for supporting the carrier plate, a pulley apparatus configured for transporting the carrier plate along the cable, and a controller configured for adjusting test parameters in testing the RFID device.

Abstract: A system for testing RFID devices is introduced. The system includes a carrier plate configured for carrying an RFID device, a cable configured for supporting the carrier plate, a pulley apparatus configured for transporting the carrier plate along the cable, and a controller configured for adjusting test parameters in testing the RFID device.

Abstract: A sealing cap with an anti-counterfeit and identification capability comprises a cap body, an identification chip with a signal emitting device generating an identification signal, and a destructive device, characterized in that the cap body is electrically connected with the signal generating device and serves as an antenna of a relatively large area and in that the destructive device after dismounting of the cap destroys the capability to emit radiation and thus prevents said identifying chip from being dismounted and reused.

Abstract: A sealing cap with an anti-counterfeit and identification capability comprises a cap body, an identification chip with a signal emitting device generating an identification signal, and a destructive device, characterized in that the cap body is electrically connected with the signal generating device and serves as an antenna of a relatively large area and in that the destructive device after dismounting of the cap destroys the capability to emit radiation and thus prevents said identifying chip from being dismounted and reused.