Abstract: A package structure includes a package substrate, an interposer module on the package substrate, a thermal interface material (TIM) layer on the interposer module, and a package lid on the TIM layer, including a package lid foot portion attached to the package substrate, a package lid plate portion connected to the package lid foot portion, and a plurality of fins extending from the package lid plate portion into the TIM layer over the interposer module.

Abstract: A package structure including a packaging substrate, a semiconductor device, passive components, a lid, and a dam structure is provided. The semiconductor device is disposed on and electrically connected to the packaging substrate. The passive components are disposed on the packaging substrate, wherein the semiconductor device is surrounded by the passive components. The lid is disposed on the packaging substrate, and the lid covers the semiconductor device and the passive components. The dam structure is disposed between the packaging substrate and the lid, wherein the dam structure covers the passive components and laterally encloses the semiconductor device.

Abstract: A calibration system is configured to detect a capacity difference of a tipping bucket rain gauge and determine an operational condition of the tipping bucket rain gauge. The calibration system includes a field calibration device, a detection communication box, and an application. The application is executed by an electronic device, which, upon receiving metering information and environmental information transmitted by the detection communication box, can calculate the capacity difference of the tipping bucket rain gauge. The calibration system allows an operator to directly perform testing of the capacity difference and the operational condition of the tipping bucket rain gauge, so as to provide users with follow-up measures or suggestions.