Patents by Inventor Li-Hui Kao

Li-Hui Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942403
    Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu
  • Publication number: 20240079399
    Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 7396277
    Abstract: A coin counter includes a chassis supporting a rotary disk and a chute extending from the disk. An operation device is arranged below one side of the chute and includes first and second plates coupled to an adjusting valve. First and second posts extend from ends of the first and second plates, respectively and are fixed to the chassis. A thickness adjusting mechanism is fixed to and supported by the second post, while a coin forwarding mechanism is fixed to and supported by the first post. Such a construction allows the thickness adjusting mechanism and the coin forwarding mechanism to be individually removable from the chassis as individual sub-assemblies, which facilitates ready mounting/dismounting and thus easy maintenance and repairing.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: July 8, 2008
    Assignee: Origo Klebe Technik Co., Ltd
    Inventor: Li-Hui Kao
  • Publication number: 20060148395
    Abstract: A coin counter includes a chassis supporting a rotary disk with a support bracket mounted above the rotary disk and two posts mounted to predetermined positions of the chassis; an adjusting mechanism mounted to the posts; a conveying mechanism supported by the support bracket and comprised of a support frame, a conveyor and an actuation element; a driving mechanism arranged below the chassis and coupled to the coin forwarding mechanism; a transmission mechanism coupled to the driving mechanism and also coupled to the rotary disk and comprised of a frame and a transmission shaft. Such an arrangement allows for modularization of the adjusting mechanism, the conveying mechanism, and the transmission mechanism, respectively, for easy disassembling, repairing, and maintenance.
    Type: Application
    Filed: December 13, 2004
    Publication date: July 6, 2006
    Inventor: Li-Hui Kao
  • Publication number: 20060148396
    Abstract: A coin counter includes a chassis supporting a rotary disk and a chute extending from the disk. An operation device is arranged below one side of the chute and includes first and second plates coupled to an adjusting valve. First and second posts extend from ends of the first and second plates, respectively and are fixed to the chassis. A thickness adjusting mechanism is fixed to and supported by the second post, while a coin forwarding mechanism is fixed to and supported by the first post. Such a construction allows the thickness adjusting mechanism and the coin forwarding mechanism to be individually removable from the chassis as individual sub-assemblies, which facilitates ready mounting/dismounting and thus easy maintenance and repairing.
    Type: Application
    Filed: December 13, 2004
    Publication date: July 6, 2006
    Inventor: Li-Hui Kao
  • Publication number: 20060048348
    Abstract: The present invention is a CPU clamp including an upper clamp and a lower clamp that, by utilizing an elastic body and hooks, a CPU can be easily and swiftly taken out of and placed on a mount, thereby preventing damage to the CPU due to being carelessly hit during operations.
    Type: Application
    Filed: September 8, 2004
    Publication date: March 9, 2006
    Inventor: Li-Hui Kao
  • Publication number: 20060022335
    Abstract: The present invention is a CPU clamp that a CPU can be taken out of a handling cell and placed on a mount without using a hand, which prevents damage to the CPU, due to being carelessly dropped.
    Type: Application
    Filed: July 29, 2004
    Publication date: February 2, 2006
    Inventor: Li-Hui Kao
  • Patent number: 6927981
    Abstract: The present invention is a CPU clamp (1) including an upper clamp, a lower clamp, and a framework that, by utilizing an elastic body and hooks, a CPU can be easily and swiftly taken out of and placed on a mount and also be protected in a protector formed by the framework and the lower clamp, thereby enabling the CPU being prevented from hitting out of a careless operation and being carried or shipped without causing damage.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: August 9, 2005
    Assignee: Horng Tong Enterprise Co., LTD
    Inventor: Li-Hui Kao
  • Patent number: D513622
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: January 17, 2006
    Assignees: Origo Klebe Technik Co., Scan Coin International AB
    Inventor: Li-Hui Kao