Patents by Inventor LI-HUI LIU

LI-HUI LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996283
    Abstract: The present disclosure provides a method for forming an integrated circuit (IC) structure. The method includes providing a metal gate (MG), an etch stop layer (ESL) formed on the MG, and a dielectric layer formed on the ESL. The method further includes etching the ESL and the dielectric layer to form a trench. A surface of the MG exposed in the trench is oxidized to form a first oxide layer on the MG. The method further includes removing the first oxide layer using a H3PO4 solution.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shich-Chang Suen, Li-Chieh Wu, Chi-Jen Liu, He Hui Peng, Liang-Guang Chen, Yung-Chung Chen
  • Publication number: 20120308287
    Abstract: A moving apparatus for a printer includes a support board, a motor mounted on the support board, an endless belt, and a printing module. A sliding pole is located on the support board. A follower wheel is rotatably mounted on the support board. The motor includes a drive wheel. A belt is set on the drive wheel and the follower wheel. A sliding groove is defined in the printing module. The printing module is located on the support board with the sliding pole located in the sliding groove. The printing module is attached to the belt. The motor is adapted to drive the drive wheel to rotate, and the belt is adapted to bring the printing module to slide on the sliding pole.
    Type: Application
    Filed: December 2, 2011
    Publication date: December 6, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHU-YA CHIANG, YU-O HU, LI-HUI LIU