Abstract: Disclosed is an electronic device including a device body and an antenna module. The antenna module includes a conductive element and at least one antenna element. The conductive element includes a main body portion and at least one assembly portion connected with each other. The at least one assembly portion is assembled on the device body. The at least one antenna element is disposed on the device body and coupled with the conductive element to excite a first resonance mode. The at least one assembly portion overlaps the at least one antenna element in the length direction of the main body portion.

Abstract: The present invention provides a wafer holder shield in a physical vapor deposition chamber for use in a metal deposition process without the arcing problem. The shield is constructed in a configuration of a toroid wherein the toroid has a rectangular cross-section and a flat bottom surface. The toroid further has a cavity at the center adapted for receiving a wafer when the shield is placed on a wafer holder. The flat bottom surface of the wafer holder shield has an inner end adjacent to an inner periphery of the toroid that is supported by the wafer holder. The flat bottom surface further has an outer end adjacent to an outer periphery of the toroid suspended over and spaced apart from a chamber shield for the deposition chamber at a distance sufficient to prevent bridge formation between the wafer holder shield and the chamber shield by metal particles generated in the deposition chamber.