Patents by Inventor LI-JEN HUANG

LI-JEN HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969677
    Abstract: A method for eliminating bubbles from a liquid dispensing system includes flowing a liquid containing bubbles into a liquid inlet of a tank from a filter to substantially fill the tank, wherein substantially all bubbles accumulate in an upper portion of the tank having a lateral dimension greater than a lateral dimension of a lower portion of the tank, and flowing the liquid into the tank comprises flowing the liquid through an inlet pipe extending at an acute angle relative to a horizontally-oriented axis of the tank. The method further includes flowing a liquid substantially free of bubbles out of the tank via a liquid outlet at the lower portion of the tank for dispensing to a substrate.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Y. L. Huang, Chin-Kun Fang, Li-Jen Wu, Yu Kai Chen
  • Publication number: 20240071911
    Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.
    Type: Application
    Filed: January 31, 2023
    Publication date: February 29, 2024
    Inventors: Harry-Haklay Chuang, Wen-Tuo Huang, Li-Feng Teng, Wei-Cheng Wu, Yu-Jen Wang
  • Publication number: 20190173014
    Abstract: A benzodiazaborole derivative is shown in General Formula (1), wherein R1 is selected from the group consisting of hydrogen atom, General Formula (2), General Formula (3) and General Formula (4), R2 is selected from the group consisting of hydrogen atom, General Formula (3) and General Formula (4), R1 and R2 are different and at least one of them is a hydrogen atom, R3 is General Formula (4) when R2 is General Formula (4) and R3 is a hydrogen atom when R2 is a hydrogen atom or General Formula (3). Wherein R4 to R19 are independently selected from the group consisting of hydrogen atom, fluorine atom, cyano group, alkyl group, cycloalkyl group, alkoxy group, haloalkyl group, thioalkyl group, silyl group and alkenyl group.
    Type: Application
    Filed: November 16, 2018
    Publication date: June 6, 2019
    Inventors: Hio-Tong IEONG, Chi-Feng LIN, Man-Kit LEUNG, Jiun-Haw LEE, Tien-Lung CHIU, Li-Jen HUANG, Sheng-Chieh LIN
  • Publication number: 20110258492
    Abstract: A device for testing a serial interface of a circuit board. The device includes a testing serial interface, a memory, a processor. The testing serial interface is coupled to the serial interface of the circuit board. The processor is electrically connected between the memory and the at least one testing serial interface. The processor is configured for receiving first serial data from the circuit board via the testing serial interface, converting the first serial data to parallel data, and writing the parallel data into the memory, and also configured for reading the parallel data from the memory, converting the parallel data to second serial data and transmits the second serial data to the circuit board via the testing serial interface.
    Type: Application
    Filed: June 14, 2010
    Publication date: October 20, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHAO-TSUNG FAN, LI-JEN HUANG