Patents by Inventor Li-Jia Yang

Li-Jia Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7109117
    Abstract: A method for chemical mechanical polishing (CMP) of a shallow trench isolation (STI) structure employs a sequence of slurry polishes. In the first step the substrate is polished with either silica-based slurry or diluted ceria-based slurry. The first polishing is at a higher removal rate than the second polishing step. The polishing proceeds with some planarization but does not expose the polish stop layer. After partial planarization, the high selectivity slurry was used to complete the process. Improved throughput, lower defects and good within wafer uniformity are achieved.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: September 19, 2006
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Ching Tseng, Syun-Ming Jang, Li-Jia Yang, Chuan-Ping Hou
  • Patent number: 7016790
    Abstract: An in-line hot-wire sensor for monitoring the mixing and the flow rate of slurry is disclosed. The hot-wire sensor may include a number of resistors organized into a Wheatstone bridge, as well as a frequency-domain transform mechanism. The resistors include a hot-wire resistor that is placed in-line with the slurry after substances have been mixed to become the slurry. The Wheatstone bridge thus yields a signal that is transformed to the frequency domain by the frequency-domain transform mechanism, such as by performing a Fast Fourier Transform (FFT) of the signal. The frequency-domain transform is used to monitor the mixing of the substances into the slurry, and the flow rate of the slurry. The signal may be amplified prior to transformation to the frequency domain.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: March 21, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Ching Tseng, Li-Jia Yang
  • Publication number: 20050153555
    Abstract: A method for chemical mechanical polishing (CMP) of a shallow trench isolation (STI) structure employs a sequence of slurry polishes. In the first step the substrate is polished with either silica-based slurry or diluted ceria-based slurry. The first polishing is at a higher removal rate than the second polishing step. The polishing proceeds with some planarization but does not expose the polish stop layer. After partial planarization, the high selectivity slurry was used to complete the process. Improved throughput, lower defects and good within wafer uniformity are achieved.
    Type: Application
    Filed: January 14, 2004
    Publication date: July 14, 2005
    Inventors: Tung-Ching Tseng, Syun-Ming Jang, Li-Jia Yang, Chuan-Ping Hou
  • Publication number: 20040083068
    Abstract: An in-line hot-wire sensor for monitoring the mixing and the flow rate of slurry is disclosed. The hot-wire sensor may include a number of resistors organized into a Wheatstone bridge, as well as a frequency-domain transform mechanism. The resistors include a hot-wire resistor that is placed in-line with the slurry after substances have been mixed to become the slurry. The Wheatstone bridge thus yields a signal that is transformed to the frequency domain by the frequency-domain transform mechanism, such as by performing a Fast Fourier Transform (FFT) of the signal. The frequency-domain transform is used to monitor the mixing of the substances into the slurry, and the flow rate of the slurry. The signal may be amplified prior to transformation to the frequency domain.
    Type: Application
    Filed: October 23, 2002
    Publication date: April 29, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Ching Tseng, Li-Jia Yang