Patents by Inventor Li-Ju Hsu

Li-Ju Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969448
    Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 30, 2024
    Assignee: GENMONT BIOTECH INC.
    Inventors: Wan-Hua Tsai, I-ling Hsu, Shan-ju Hsu, Wen-ling Yeh, Ming-shiou Jan, Wee-wei Chieng, Li-jin Hsu, Ying-chun Lai
  • Publication number: 20240091635
    Abstract: The present invention discloses a force feedback hand training method including: providing a training game content and adjusting the training game content based on predetermined parameters; displaying the training game content on a display; determining whether an input button position of at least one input signal from a hand training device matches a predetermined input button position; and storing a determination result in a storage module.
    Type: Application
    Filed: September 20, 2023
    Publication date: March 21, 2024
    Inventors: Fong-Chin Su, Li-Chieh Kuo, Hsiao-Feng Chieh, Chien-Ju Lin, Hsiu-Yun Hsu
  • Publication number: 20240087980
    Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.
    Type: Application
    Filed: February 17, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Yen-Ju WU, Yen-Pin HSU, Li-Ling SU, Ming-Hsien LIN, Hsiao-Kang CHANG
  • Publication number: 20180198239
    Abstract: A signal terminal set includes a first material strip including a first connecting plate and a plurality of first signal terminals connected in parallel to the first connection plate and providing a respective bridging segment, and a second material strip including a second connecting plate attached onto the first connection plate and a plurality of second signal terminals connected in parallel to the second connection plate and providing a respective travel segment to create with the bridging segments of the first signal terminals a compensated structure, simplifying the manufacturing process and increasing the yield.
    Type: Application
    Filed: October 10, 2017
    Publication date: July 12, 2018
    Inventors: Ching-Neng KAN, Li-Ju HSU, Shu-Hung HSIAO
  • Patent number: 9966690
    Abstract: A modular electrical connector having the characteristics of simple manufacturing process, reduced manufacturing cost and high production yield is disclosed to include two signal terminal sets arranged one above the other in a staggered manner to provide a compensated structure, and an electrically insulative terminal block including a mounting block and a mating connection block and molded on the signal terminal sets by injection molding. The connection segments of the signal terminals of the two signal terminal sets are bent to move the mounting block and the mating connection block toward each other to further force a positioning portion of the mounting block into engagement with a positioning groove of the mating connection block.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: May 8, 2018
    Assignee: KINSUN INDUSTRIES INC.
    Inventors: Ching-Neng Kan, Li-Ju Hsu, Shu-Hung Hsiao