Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: An image-sensor structure is provided. The image-sensor structure includes a substrate with a plurality of photoelectric conversion units formed therein, a plurality of color filters formed above the substrate, wherein the color filters are divided into red color filters, green color filters and blue color filters, a plurality of microlenses correspondingly formed above the color filters, a transparent material layer formed above the microlenses, a first filter blocking infrared (IR) light formed above the transparent material layer, a second filter allowing transmission of visible light formed above the first filter, and a lens module formed above the second filter.

Abstract: An image-sensor structure is provided. The image-sensor structure includes a substrate with a plurality of photoelectric conversion units formed therein, a plurality of color filters formed above the substrate, wherein the color filters are divided into red color filters, green color filters and blue color filters, a plurality of microlenses correspondingly formed above the color filters, a transparent material layer formed above the microlenses, a first filter blocking infrared (IR) light formed above the transparent material layer, a second filter allowing transmission of visible light formed above the first filter, and a lens module formed above the second filter.

Abstract: A method and system for facilitating focusing of a camera module are disclosed. The camera module includes an image sensor, a lens cube, a barrel and an adjustable member. An adjustable member can be configured to fine-tune the focal length with respect to an image sensor, so that a lens cube with a shorter or longer focal length can be corrected and integrated into the camera module.

Abstract: A method and system for facilitating focusing of a camera module are disclosed. The camera module includes an image sensor, a lens cube, a barrel and an adjustable member. An adjustable member can be configured to fine-tune the focal length with respect to an image sensor, so that a lens cube with a shorter or longer focal length can be corrected and integrated into the camera module.