Abstract: A cooling fan includes a base, a stator and an rotator, one end of the stator is fixed to the base, the other end of the stator forms a shaft, the rotator is mounted to the shaft, an end of the shaft protrudes out of the rotator, each of the rotator and the shaft is <same as claims> an electromagnet driving unit matching each other, the rotator is driven to rotate by the electromagnet driving unit. An electronic device using such a cooling fan is further disclosed.

Abstract: A cooling fan includes a frame and a fan body. A bottom end of the frame forms a pressed portion that borders an air inlet. The pressed portion increases the size of the air inlet allowing more air to flow to better cool an electronic device.

Abstract: A motherboard cooling system includes a motherboard, a heat producing element, a fan module, a heat sink, a heat pipe, and a heat conducting plate. The heat conducting plate, the heat pipe, the heat sink, and the fan module cooperatively define an air path for airflow produced by the fan module to cool the heat producing element.

Abstract: An electronic device assembly includes a fan module, a frame, and a bottom plate of an electronic device enclosure. The fan module includes a cover, a fan secured to the cover. The frame is secured to the bottom plate. The cover is secured to the frame. The frame, the cover, and the bottom plate define a receiving space receiving the fan.

Abstract: A cooling fan includes a frame and a fan body. A bottom end of the frame forms a pressed portion that borders an air inlet. The pressed portion increases the size of the air inlet allowing more air to flow to better cool an electronic device.

Abstract: An electronic device includes a chassis and a cooling module. A plurality of air inlets and a plurality of air outlets are defined in a same side plate of the chassis. A partition separates the air inlets from the air outlets. Air flows into the chassis through the plurality of air inlets and flows out of the plurality of air outlets under the action of the cooling module, and then the electronic device is cooled.

Abstract: A heat sink includes a plurality of fins. Each of the plurality of fins includes a fin body and a bent part located on one side of the fin body. The bent part of each of the plurality of fins includes an extension piece slanted relative to the fin body.

Abstract: A heat dissipation device includes a centrifugal fan and a fin assembly aside the centrifugal fan. The centrifugal fan includes a casing and an impeller received in the casing, the casing defines an air outlet at one side thereof. The fin assembly is located at the air outlet of the centrifugal fan. The fin assembly includes a plurality of fins parallel to and spaced from each other. Each of the fins includes a main body and an extending portion extending form the main body toward the air outlet of the centrifugal fan. Each extending portion includes a side edge facing the air outlet of the centrifugal fan, the side edge is arc shaped and inwardly concaved toward the main body.

Abstract: A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.