Abstract: The invention relates to an adaptive active noise cancellation apparatus and an audio playback system using the same. The adaptive active noise cancellation apparatus shapes an error signal and a noise signal according to a shape of an ideal noise. After that, the shaped noise signal and the shaped error signal are sent into a parameter adjusting unit to perform an adaptive parameter adjustment. Thus, the adaptive noise filter unit is not only can adaptively suppress noise and minimize the error signal, but also can suppress specific frequencies that are sensitive to the human ear.

Abstract: An active noise control (ANC) circuit is used for generating an anti-noise signal, and has a plurality of filters including at least one first filter and at least one second filter. The at least one first filter generates at least one first filter output, wherein each of the at least one first filter has at least one non-static filter and at least one static filter connected in a series fashion. The at least one second filter generates at least one second filter output, wherein each of the at least one second filter has at least one adaptive filter. The anti-noise signal is jointly controlled by the at least one first filter output and the at least one second filter output. The at least one first filter and the at least one second filter are connected in a parallel fashion.

Abstract: An adaptive active noise control (ANC) system includes an ANC circuit and a control circuit. The ANC circuit generates an anti-noise signal for noise reduction, wherein the ANC circuit includes at least one adaptive filter. The control circuit receives a first input signal derived from a reference signal output by a reference microphone that picks up ambient noise, receives a second input signal derived from an error signal output by an error microphone that picks up remnant noise resulting from the noise reduction, and performs a transfer function variation detection based on the first input signal and the second input signal to control the at least one adaptive filter.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: Devices and methods for forming a chip package structure including a package substrate, a first adhesive layer attached to a top surface of the package substrate, and a beveled stiffener structure attached to the package substrate. The beveled stiffener structure may include a bottom portion including a tapered top surface, in which a bottom surface of the bottom portion is in contact with the first adhesive layer, a second adhesive layer attached to the tapered top surface, and a top portion including a tapered bottom surface, in which the tapered bottom surface is in contact with the second adhesive layer. The tapered top surface and the tapered bottom surface have a taper angle between 5 degrees and 60 degrees with respect to a top surface of the package substrate.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: An assembly of beverage bottle/can and cup consisting of a beverage bottle or can for containing the beverage and a cup for encasing the lower part of said bottle or can to be integrated as one body, wherein a plurality of parallel linear projections are provided to the inner wall at the upper part of cup whereon a plurality of vent grooves are spaced in a suitable distance in the direction perpendicular to the said projections, and a clip is provided to the outer upper edge of cup; the said assembly provides the consumers with the convenience of pouring the beverage for drinking as they like by taking the advantage of the cup, fixing the bottle or can onto their knapsack bag or girdle optionally by means of the clip, and bringing the beverage bottle or can with them if the beverage therein has not been drunk up.