Patents by Inventor Li Liqiao

Li Liqiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10899055
    Abstract: An injection molding apparatus comprising: a manifold, a nozzle, A distal tip of the nozzle being comprised of a highly heat conductive insert and an insulation cap that is substantially less heat conductive than the insert, the downstream end portion of the insulation cap being disposed between the gate and the downstream end portion of the highly heat conductive insert forming a fluid seal around the gate, a valve pin, wherein when the valve pin is in a gate closed position, an axially interior surface of a fluid exit aperture of the insulation cap surrounds a gap enabling circumferential surface of the valve pin forming a spatial gap immediately upstream of the gate between the interior surface of the fluid exit aperture of the insulation cap and the gap enabling circumferential surface of the valve pin.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: January 26, 2021
    Assignee: Synventive Molding Solutions, Inc.
    Inventors: Ling Feng, Li Liqiao, William Henderson, Vito Galati