Patents by Inventor Li-Ming Yi

Li-Ming Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6296534
    Abstract: An electrical adapter assembly (1) comprises an adapter plate (16), and first and second electrical connectors (12, 14) mounted onto opposite first and second surfaces (165, 166) of the adapter plate. The first and second connectors comprise first and second conductive contact tail portions (1232, 1432), respectively, projecting beyond the second and first surfaces, respectively. A method of encapsulating the electrical adapter assembly comprises the following steps. First, trimming the first and second tail portions for facilitating subsequent formation of smooth soldered dots (21). Second, soldering the first and second tail portions to the adapter plate, forming the smooth soldered dots. Third, placing insulative layers (23, 24) over the soldered dots. Fourth, placing shielding layers (25, 25′, 26, 26′) over the insulative layers. Fifth, soldering edges of the shielding layers to the adapter plate with soldering tin (27).
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 2, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Li-Ming Yi