Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: A heat sink includes a cooling module and an installing assembly for fixing the heat sink on a housing. The installing assembly includes a case, a handle rotatablely fixed in the case and a support including a fixing board with blocks and two brackets. The handle is actively connected with the support. The fixing board is fixed on a bottom plate of the case. The handle includes two bulges. The brackets include two slide openings for receiving the bulges. When the heat sink is installed, the handle is rotated to be vertical, the bulges are out of the slide openings, and the blocks are stuck on the housing. When the heat sink is dismantled, the handle is rotated to be horizontal and the bulges are stuck into the slide openings to resist the brackets, thereof the fixing board being uplifted and the blocks being pushed away from the housing.

Abstract: A heat sink includes a cooling module and an installing assembly for fixing the heat sink on a housing. The installing assembly includes a case, a handle rotatablely fixed in the case and a support including a fixing board with blocks and two brackets. The handle is actively connected with the support. The fixing board is fixed on a bottom plate of the case. The handle includes two bulges. The brackets include two slide openings for receiving the bulges. When the heat sink is installed, the handle is rotated to be vertical, the bulges are out of the slide openings, and the blocks are stuck on the housing. When the heat sink is dismantled, the handle is rotated to be horizontal and the bulges are stuck into the slide openings to resist the brackets, thereof the fixing board being uplifted and the blocks being pushed away from the housing.

Abstract: A power adapter includes a body, a plug, and an operation board. The plug is detachably received in and electrically connected to the body. The plug has an engagement slot. The operation board is rotatably received in the body and includes a hook, a pressing portion and a pop portion. The hook latches to the engagement slot to secure the plug to the body. The pressing portion is pressed by external forces. The pop portion is positioned below the plug. When the pressing portion receives an external force, the pressing portion rotates towards the body and drives the pop portion to rotate away from the body, whereby the pop portion pops up the plug from the body.

Abstract: A power bank assembly includes a housing, a power bank casing, a clasp structure, and a fastening structure. The clasp structure is correspondingly formed on a first end of the housing and a first end of the power bank casing to enable the first end of the housing to engage with the first end of the power bank casing, and the clasp structure also allows the housing to rotate relative to the power bank casing and about the first end of the housing serving as a pivot. The fastening structure is correspondingly formed on the second end of the housing and the second end of the power bank casing, and the fastening structure secures the housing to the power bank casing when the second end of the housing touches the second end of the power bank casing.

Abstract: A projector includes a casing, a light source disposed in the casing and capable of providing an illumination beam, a light valve disposed in the casing and capable of converting the illumination beam into an image beam, a lens disposed in the casing and adapted to project the image beam, and the lens collar module. The lens collar module includes a fitting part and a lens collar. The fitting part is formed on the casing, and has a fitting opening and a first bump. The lens collar has a fitting periphery and a second bump. The fitting periphery is fitted to the fitting opening, the lens collar is adapted to be rotated and translated relative to the casing along an axial direction. Engagement of the first bump and the second bump limits rotation and translation of the lens collar relative to the casing along the axial direction.

Abstract: A power bank assembly includes a housing, a power bank casing, a clasp structure, and a fastening structure. The clasp structure is correspondingly formed on a first end of the housing and a first end of the power bank casing to enable the first end of the housing to engage with the first end of the power bank casing, and the clasp structure also allows the housing to rotate relative to the power bank casing and about the first end of the housing serving as a pivot. The fastening structure is correspondingly formed on the second end of the housing and the second end of the power bank casing, and the fastening structure secures the housing to the power bank casing when the second end of the housing touches the second end of the power bank casing.

Abstract: A projector includes a casing, a light source disposed in the casing and capable of providing an illumination beam, a light valve disposed in the casing and capable of converting the illumination beam into an image beam, a lens disposed in the casing and adapted to project the image beam, and the lens collar module. The lens collar module includes a fitting part and a lens collar. The fitting part is formed on the casing, and has a fitting opening and a first bump. The lens collar has a fitting periphery and a second bump. The fitting periphery is fitted to the fitting opening, the lens collar is adapted to be rotated and translated relative to the casing along an axial direction. Engagement of the first bump and the second bump limits rotation and translation of the lens collar relative to the casing along the axial direction.