Patents by Inventor LI-PIN WANG

LI-PIN WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fingerprint identification module and manufacturing method thereof
    Patent number: 10176356
    Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: January 8, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Li-Pin Wang, Hong-Kai Huang, Chih-Hao Hsu
  • FINGERPRINT IDENTIFICATION MODULE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180129851
    Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.
    Type: Application
    Filed: January 6, 2017
    Publication date: May 10, 2018
    Inventors: MAO-HSIU HSU, LI-PIN WANG, HONG-KAI HUANG, CHIH-HAO HSU