Abstract: An image capture system includes a light detection and ranging (LIDAR) device which captures images of an environment while rotating and a plurality of cameras, disposed separately from the LIDAR device, each including a rolling shutter sensor and each capturing images of the environment. The plurality of cameras include a first camera disposed to face in a first direction and a second camera disposed to face in a second direction. A time at which the first camera captures a first image is synchronized with a time at which the LIDAR device captures a second image when the LIDAR device rotates to face in the first direction, and a time at which the second camera captures a third image is synchronized with a time at which the LIDAR device captures a fourth image when the LIDAR device rotates to face in the second direction.

Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

Abstract: Embodiments are disclosed of an apparatus including a first digital camera with an image sensor optically coupled to a first lens, the first lens having a first magnification and a second digital camera including an image sensor optically coupled to a second lens. The second lens the second lens has a magnification that is greater than the magnification of the first lens and the second lens is a non-rectilinear lens having a magnification gradient in which magnification is highest at the center of the second lens and lowest at the edges. Other embodiments are disclosed and claimed.

Abstract: A slide rail self-return mechanism includes a holder base including a base block, a guide plate extended from the base block, a sliding groove defined in the guide plate and abutted to the base block and a mounting groove defined in the guide plate remote from the base block and disposed in communication with the sliding groove, a sliding seat slidably coupled to the holder base, and a biasing member including a body pivotally connected to the sliding seat and a position-limiting block located at the body and movable through the mounting groove into the sliding groove when the sliding seat is coupled to the holder base.

Abstract: Embodiments are disclosed of an apparatus including a first digital camera with an image sensor optically coupled to a first lens, the first lens having a first magnification and a second digital camera including an image sensor optically coupled to a second lens. The second lens the second lens has a magnification that is greater than the magnification of the first lens and the second lens is a non-rectilinear lens having a magnification gradient in which magnification is highest at the center of the second lens and lowest at the edges. Other embodiments are disclosed and claimed.

Abstract: A heat transfer apparatus includes a circuit board assembly and an image sensor including a plurality of photodetectors disposed in a semiconductor material. The image sensor is mounted to the circuit board assembly. A thermal strap with a first end is thermally coupled to transfer heat out of the image sensor. A heat sink is thermally coupled to a second end of the thermal strap opposite the first end of the thermal strap to receive heat from the image sensor.

Abstract: A heat transfer apparatus includes a circuit board assembly and an image sensor including a plurality of photodetectors disposed in a semiconductor material. The image sensor is mounted to the circuit board assembly. A thermal strap with a first end is thermally coupled to transfer heat out of the image sensor. A heat sink is thermally coupled to a second end of the thermal strap opposite the first end of the thermal strap to receive heat from the image sensor.

Abstract: Embodiments are disclosed of an apparatus including a first digital camera with an image sensor optically coupled to a first lens, the first lens having a first magnification and a second digital camera including an image sensor optically coupled to a second lens. The second lens the second lens has a magnification that is greater than the magnification of the first lens and the second lens is a non-rectilinear lens having a magnification gradient in which magnification is highest at the center of the second lens and lowest at the edges. Other embodiments are disclosed and claimed.

Abstract: A vision sensor includes a sensor assembly and a dedicated microprocessor. The sensor assembly includes a pixel array and a lens assembly that is optically coupled with the pixel array. The lens assembly has an F#<2, a total track length less than 4 mm, and a field of view of at least +/?20 degrees. The dedicated microprocessor is configured to perform computer vision processing computations based on image data received from the sensor assembly and includes an interface for a second processor.

Abstract: The embodiments disclose a method of fabricating a stack, including replacing a metal layer of a stack imprint structure with an oxide layer, patterning the oxide layer stack using chemical etch processes to transfer the pattern image and cleaning etch residue from the stack imprint structure to substantially prevent contamination of the metal layers.

Abstract: The embodiments disclose a method of fabricating a stack, including replacing a metal layer of a stack imprint structure with an oxide layer, patterning the oxide layer stack using chemical etch processes to transfer the pattern image and cleaning etch residue from the stack imprint structure to substantially prevent contamination of the metal layers.

Abstract: The embodiments disclose a method of stack patterning, including loading a stack into a stationary stack stage, rotating one or more ion beam grid assemblies substantially concentrically aligned with the stationary stack stage to etch the stack and controlling the operation of the one or more ion beam grid assemblies to achieve substantial axial uniformity of the etched stack.

Abstract: The embodiments disclose a method of fabricating a stack, including replacing a metal layer of a stack imprint structure with an oxide layer, patterning the oxide layer stack using chemical etch processes to transfer the pattern image and cleaning etch residue from the stack imprint structure to substantially prevent contamination of the metal layers.

Abstract: A vision sensor includes a sensor assembly and a dedicated microprocessor. The sensor assembly includes a pixel array and a lens assembly that is optically coupled with the pixel array. The lens assembly has an F#<2, a total track length less than 4 mm, and a field of view of at least +/?20 degrees. The dedicated microprocessor is configured to perform computer vision processing computations based on image data received from the sensor assembly and includes an interface for a second processor.

Abstract: Processes include aligning a disc with a template at a location so that the pattern from the template is transferred to the disc in a relative orientation. The relative orientation provides that when the disc with the transferred pattern is finally assembled into a hard disc drive, an inner diameter of the spindle hole of the disc may be abutted against an outer diameter of the disc drive spindle, and the data-containing patterns on the discs will be aligned concentrically with a center of the disc drive spindle. While the data-containing patterns are aligned concentrically with the disc drive spindle, the substrate itself is allowed to be non-concentric.

Abstract: The embodiments disclose a method of fabricating a stack, including replacing a metal layer of a stack imprint structure with an oxide layer, patterning the oxide layer stack using chemical etch processes to transfer the pattern image and cleaning etch residue from the stack imprint structure to substantially prevent contamination of the metal layers.