Patents by Inventor Li-Shang Liu

Li-Shang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Strip-line Structure, Method for Fabricating Strip-line Structure and Electronic Device Thereof
    Publication number: 20230261356
    Abstract: A strip-line structure includes a first ground plane formed on a first layer; a second ground plane formed on a second layer; a first power plane formed on the first layer, wherein the first ground plane and the first power plane are separated by a dielectric material; a stipe line formed on a third layer for signal transmission, wherein the third layer is between the first layer and the second layer; a ground line formed on the third layer, wherein the ground line and the strip line are separated by the dielectric material; a first via for electrically connecting the first ground plane and the second ground plane; and a second via for electrically connecting the ground line and the second ground plane.
    Type: Application
    Filed: April 15, 2022
    Publication date: August 17, 2023
    Applicant: Wistron Corporation
    Inventors: Ming-Yuan Chuang, Sheng-Hsun Tsai, Li-Shang Liu