Abstract: A vascular graft and method of fabricating the same are provided. The vascular graft includes an elongated tube fabricated from a material having a plurality of nodes interconnected by a plurality of fibrils. The elongated tube extends along an axis and has been previously stretched along the axis from an initial length to a desired length. Each of the plurality of fibrils has a length, and first and second ends separated by a linear distance. After the second stretching, the length of each of a majority of the plurality of fibrils is greater than the linear distance between the first and second ends of each of the majority of the plurality of fibrils, thereby allowing the vascular graft of the present invention to exhibit higher elastic compliance than prior synthetic, vascular grafts.

Abstract: Provided are a water and acid adsorbing battery separator and a preparation method therefor, a water and acid adsorbing electrode plate, and a battery. A metal organic framework material is used and scrape-coated on a battery separator to prepare a composite separator, which can efficiently adsorb impurities such as water/acid from a battery, as a water and acid adsorbing battery separator. In one aspect, the water and acid adsorbing battery separator can effectively improve the cycling stability of a battery by adsorbing impurities such as water and an acid from the battery. In another aspect, the water and acid adsorbing battery separator can reduce control conditions of water during a battery assembly process, thereby effectively reducing the cost.

Abstract: A method for near field communication with a serial transmission microcontroller and an NFC tag device using the same are provided in the present invention. The method includes: providing a serial interface microcontroller; capturing an NFC carrier signal from an NFC LC resonant circuit; performing a frequency division to the NFC carrier signal to obtain a NFC clock signal; filtering the NFC carrier signal from the NFC LC resonant circuit to obtain an envelope signal; sequentially receiving a digital sequence of the envelope signal according to triggering of the NFC clock signal based on a serial transmission protocol; and decoding an NFC data from the digital sequence based on an NFC transmission protocol rule.

Abstract: A package comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, an interconnect integrated device coupled to the first integrated device and the second integrated device, and an underfill. The substrate includes a cavity. The interconnect integrated device is located over the cavity of the substrate. The underfill is located (i) between the first integrated device and the substrate, (ii) between the second integrated device and the substrate, (iii) between the interconnect integrated device and the first integrated device, and (iv) between the interconnect integrated device and the second integrated device.

Abstract: Disclosed herein is a chip package and method for fabricating the same are provided that includes a redistribution layer (RDL) with a plurality of loop and void structures. The chip package includes an integrated circuit (IC) die, and a package substrate. The RDL is disposed between the IC die and the package substrate. The RDL has RDL circuitry that connects the IC die to the package substrate. The RDL circuitry includes a first coil formed in a first metal layer and a second coil formed in a second metal layer. A first end of the second coil is coupled to a second end of the first coil by a first via. A second end of the second coil is the IC die.

Abstract: Artificial intelligence (AI) functionality is becoming pervasive in electronic devices, including mobile ones in which interior volume and printed circuit board (PCB) area are constrained. AI processing also taxes computing hardware differently. Some tasks are relatively compute-bound, and some tasks are relatively memory-bound. Balancing these competing factors is challenging. In example implementations, AI engines are disposed in various locations to facilitate compute-bound and memory-bound AI tasks while efficiently utilizing area of a PCB. For example, a first package assembly can include nonvolatile memory and DRAM with processor-in-memory realized as at least one AI processing unit for memory-bound tasks. The first package assembly can also include an AI engine with greater processing capabilities for compute-bound tasks. Further, a second package assembly, which is coupled to the first package assembly, can include an SoC with a still more-capable AI engine.

Abstract: Package-on-package (POP) manufacturing combines the cost efficiencies of using separate packages with the space efficiencies of stacking integrated circuit (IC) chips. It can be difficult, however, to provide sufficient decoupling capacitance for those package(s) that do not form a base package coupled to a printed circuit board (PCB). In example implementations, the base package includes a decoupling capacitor disposed in a fan-out space in a same layer as an IC chip that is part of the base package. The decoupling capacitor can be electrically coupled to a power distribution network for an upper package to reduce voltage droop. Reducing voltage droop becomes more important for upper packages that include processing logic, such as a memory device with in-memory processing. In some cases, an interconnect via for the upper package and the decoupling capacitor can be adjacent to each other in the IC chip layer to further increase efficient space utilization.

Abstract: A hot pressing membrane includes a carrier film, a decorative layer formed on the carrier film, and a transparent protective layer formed on the decorative layer. The decorative layer includes, in parts by weight, 4.0 to 6.0 parts by weight of a first thermoplastic polyurethane, 1.0 to 2.0 parts by weight of a pigment, and 12.0 to 15.0 parts by weight of a first solvent. The transparent protective layer includes, in parts by weight, 4.0 to 6.0 parts by weight of a second thermoplastic polyurethane, 0.6 to 2.0 parts by weight of a functional additive, and 11.0 to 14.0 parts by weight of a second solvent. The hot pressing membrane of the invention is via the carrier film bonded to an outer surface of an object by a hot pressing process. The hot pressing membrane of the invention has a scratch resistance equal to or greater than 50 times.

Abstract: Disclosed are an aromatic heterocyclic compound and an application thereof. The aromatic heterocyclic compound is represented by formula I, and the compound has good LSD1 enzyme inhibitory activity, and can be used as an LSD1 inhibitor for treatment of tumors etc.

Abstract: Disclosed herein are methods for the detection of the presence of sperm DNA fragmentation in a semen sample. The methods include embedding of sperm cells of the semen sample in a gel, denaturing DNA of the sperm cells, and lysing the nuclear proteins of the sperm cells. The present method includes an ionic surfactant sodium dodycyl sulfate (SDS) and a chaotropic agent urea in the lysis solution for releasing DNA from protamine of chromosome, which significantly reduces the time required for lysis. A kit for detecting sperm DNA fragmentation in a semen sample is also disclosed.

Abstract: A chip package and method for fabricating the same are provided that includes a near-die integrated passive device. The near-die integrated passive device is disposed between a package substrate and an integrated circuit die of a chip package. Some non-exhaustive examples of an integrated passive device that may be disposed between the package substrate and the integrated circuit die include a resistor, a capacitor, an inductor, a coil, a balum, or an impedance matching element, among others.

Abstract: This disclosure provides isolated antibodies that bind specifically to CD27 with high affinity. The disclosure provides methods for treating a subject afflicted with a cancer comprising administering to the subject a therapeutically effective amount of an anti-CD27 antibody as monotherapy or in combination with a checkpoint inhibitor, such as an anti-PD-1, anti-PD-L1, or anti-CTLA-4 antibody.

Abstract: The present disclosure provides a purification method for 3-amino-5-methylpiperidine with amino protected by Boc. The method includes adding a solvent to the crude product of 3-amino-5-methylpiperidine with amino protected by Boc, heating until it is dissolved to obtain a mixed solution; adding an acid and an amine crystallization auxiliary to the mixed solution, stirring and dispersing to obtain a dispersed solution; cooling the dispersed solution until crystallization, separating and drying same to obtain a salt crystal of 3-amino-5-methylpiperidine with amino protected by Boc. The present disclosure improves the product characters of 3-amino-5-methylpiperidine with amino protected by Boc after salifying and crystallization, thereby improving the yield and purity of the product, at the same time, it simplifies the operation steps of salifying and crystallization of 3-amino-5-methylpiperidine with amino protected by Boc, shortens the operation time, and reduces production costs.

Abstract: A method for near field communication with a serial transmission microcontroller and an NFC tag device using the same are provided in the present invention. The method includes: providing a serial interface microcontroller; capturing an NFC carrier signal from an NFC LC resonant circuit; performing a frequency division to the NFC carrier signal to obtain a NFC clock signal; filtering the NFC carrier signal from the NFC LC resonant circuit to obtain an envelope signal; sequentially receiving a digital sequence of the envelope signal according to triggering of the NFC clock signal based on a serial transmission protocol; and decoding an NFC data from the digital sequence based on an NFC transmission protocol rule.

Abstract: This invention relates to compositions and methods for improving the adhesion of resin compositions to substrate materials, pre-treating substrate materials to improve the adhesion of resin compositions to the substrate materials, and/or controlling gel formation of resin compositions. More particularly, the invention relates to compositions and methods for improving the adhesion of ring opening metathesis polymerization (ROMP) compositions to substrate materials using adhesion promoters containing isocyanate groups in a resin composition. The invention also relates to methods for improving the adhesion of resin compositions to substrate materials by pre-treating substrate materials with adhesion promoters containing isocyanate groups. The invention further relates to a method of providing a gel-modified ROMP composition, in which a hydroperoxide is added to a ROMP polymerizable resin composition in order to control gel formation of the polymerizing resin.

Abstract: Provided in the present disclosure are a nemonoxacin malate active pharmaceutical ingredient with low combination impurities, and a preparation method thereof, specifically, provided in the present disclosure is a method for preparing the nemonoxacin malate active pharmaceutical ingredient, the method includes the following steps: 1) providing a C1-C3 alcohol/water mixed solvent in which nemonoxacin free base (Formula II) and D,L-malic acid are dissolved; and 2) performing cooling crystallization on a mixed solution obtained in the step 1), and then performing solid-liquid separation, washing and drying on a precipitated solid, so as to obtain the nemonoxacin malate active pharmaceutical ingredient.

Abstract: Chip packages are described herein that includes integrated passive devices embedded in a core of a substrate of the chip package, such as a package substrate or an interposer, that shield routings coupled to inductors from adjacent through-substrate conductive paths (e.g., vias). In one example, a chip package includes an integrated circuit (IC) die mounted to a substrate. A core of the substrate has a plurality of inductor routing vias, a plurality of signal transmission vias, and a plurality of ground and power routing vias. A first integrated passive device (IPD) is disposed in the core and separates at least one of the plurality of inductor routing vias from an adjacent via, the adjacent via being one of the plurality of signal transmission vias or one of the plurality of ground and power routing vias.

Abstract: A radio resource allocation method and a radio resource allocation system are provided. The radio resource allocation method includes: obtaining quality parameters of each of resource blocks, in which the quality parameters correspond to weight coefficients, respectively; adjusting the weight coefficients for a service requirement of each of network slices, and calculating, according to the weight coefficients and the quality parameters of each of the resource blocks, priority indices used to allocate the resource blocks to the network slices, respectively; and generating priority orders for allocating the resource blocks to the network slices, and configuring the base station to allocate the resource blocks to the network slices according to the priority orders.

Abstract: The present disclosure discloses a method for synthesizing quinolones intermediates by a continuous flow reaction. Specifically, according to the method, a microchannel reactor is used, which improves the selectivity and conversion rate of the reaction, and the conversion rate of compound ii is increased to more than 95% and the yield is increased to more than 85%; avoids the use of a solvent such as methanol, and methyl tert-butyl ether, etc., in the intermittent reaction process, which simplifies the post-processing method, shortens the overall operation time from about 24 hours to a few minutes, greatly improving the production efficiency, and realizing the continuity and automation of the whole process; and thus makes the product have high purity and high yield, which is suitable for industrial production.