Patents by Inventor Li-Sheng CHIANG

Li-Sheng CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11952690
    Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventors: Ying-Chi Lin, Wei-Hung Chen, Li-Chen Chu, Rih-Sheng Chiang
  • Patent number: 10290469
    Abstract: Embodiments of an apparatus having an improved coil antenna assembly that can provide enhanced plasma in a processing chamber is provided. The improved coil antenna assembly enhances positional control of plasma location within a plasma processing chamber, and may be utilized in etch, deposition, implant, and thermal processing systems, among other applications where the control of plasma location is desirable. In one embodiment, an electrode assembly configured to use in a semiconductor processing apparatus includes a RF conductive connector, and a conductive member having a first end electrically connected to the RF conductive connector, wherein the conductive member extends outward and vertically from the RF conductive connector.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: May 14, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Valentin N. Todorow, Gary Leray, Michael D. Willwerth, Li-Sheng Chiang
  • Publication number: 20140367046
    Abstract: Embodiments of an apparatus having an improved coil antenna assembly that can provide enhanced plasma in a processing chamber is provided. The improved coil antenna assembly enhances positional control of plasma location within a plasma processing chamber, and may be utilized in etch, deposition, implant, and thermal processing systems, among other applications where the control of plasma location is desirable. In one embodiment, an electrode assembly configured to use in a semiconductor processing apparatus includes a RF conductive connector, and a conductive member having a first end electrically connected to the RF conductive connector, wherein the conductive member extends outward and vertically from the RF conductive connector.
    Type: Application
    Filed: June 2, 2014
    Publication date: December 18, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Valentin N. TODOROW, Gary LERAY, Michael D. WILLWERTH, Li-Sheng CHIANG