Abstract: A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number.

Abstract: A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number.

Abstract: A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

Abstract: A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.