Patents by Inventor Li-Te Lin

Li-Te Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10847633
    Abstract: In some embodiments, a method is provided. Dummy gate stacks are formed over a semiconductor substrate. An interlayer dielectric (ILD) layer is formed over the dummy gate stacks. A first portion of the ILD layer over top surfaces of the dummy gate stacks is removed, such that a second portion of the ILD layer remains between the dummy gate stacks. The dummy gate stacks are replaced with metal gate stacks. Neutral NF3 radicals into the water are applied to etch the ILD layer.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: November 24, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Ruei Jhan, Yi-Lun Chen, Fang-Wei Lee, Han-Yu Lin, Li-Te Lin, Pinyen Lin
  • Publication number: 20200357899
    Abstract: A semiconductor device includes a substrate, a semiconductor fin, a gate electrode, a pair of gate spacers, a dielectric cap, and a hard mask layer. The semiconductor fin extends upwardly from the substrate. The gate electrode straddles the semiconductor fin. The pair of gate spacers is on opposite sidewalls of the gate electrode. The dielectric cap is atop the gate electrode and laterally between the pair of gate spacers. The hard mask layer is atop the dielectric cap and laterally between the pair of gate spacers. A bottommost position of the hard mask layer is not lower than a topmost position of the dielectric cap.
    Type: Application
    Filed: July 24, 2020
    Publication date: November 12, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Chen LO, Li-Te LIN, Pinyen LIN
  • Publication number: 20200335489
    Abstract: An integrated circuit includes at least one first active region, at least one second active region adjacent to the first active region, and a plurality of third active regions. The first active region and the second active region are staggered. The third active regions are present adjacent to the first active region, wherein the third active regions are substantially aligned with each other.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Chung-Te Lin, Ting-Wei Chiang, Hui-Zhong Zhuang, Pin-Dai Sue, Li-Chun Tien
  • Publication number: 20200335340
    Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Shih-Chun HUANG, Chiu-Hsiang CHEN, Ya-Wen YEH, Yu-Tien SHEN, Po-Chin CHANG, Chien Wen LAI, Wei-Liang LIN, Ya Hui CHANG, Yung-Sung YEN, Li-Te LIN, Pinyen LIN, Ru-Gun LIU, Chin-Hsiang LIN
  • Publication number: 20200328148
    Abstract: A device includes gates and a first conductive segment. A first distance is present between a first gate of the gates and the first conductive segment. A second distance is present between a second gate of the gates and the first conductive segment. The first distance is greater than the second distance.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 15, 2020
    Inventors: Chung-Te Lin, Ting-Wei Chiang, Hui-Zhong Zhuang, Li-Chun Tien, Pin-Dai Sue
  • Publication number: 20200327274
    Abstract: Placement methods described in this disclosure provide placement and routing rules where a system implementing the automatic placement and routing (APR) method arranges standard cell structures in a vertical direction that is perpendicular to the fins but parallel to the cell height. Layout methods described in this disclosure also improve device density and further reduce cell height by incorporating vertical power supply lines into standard cell structures. Pin connections can be used to electrically connect the power supply lines to standard cell structures, thus improving device density and performance. The APR process is also configured to rotate standard cells to optimize device layout.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 15, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Hsiung CHEN, Chung-Te Lin, Fong-Yuan Chang, Ho Che Yu, Li-Chun Tien
  • Patent number: 10790195
    Abstract: A method includes following steps. A semiconductor fin is formed on a substrate and extends in a first direction. A source/drain region is formed on the semiconductor fin and a first interlayer dielectric (ILD) layer over the source/drain region. A gate stack is formed across the semiconductor fin and extends in a second direction substantially perpendicular to the first direction. A patterned mask having a first opening is formed over the first ILD layer. A protective layer is formed in the first opening using a deposition process having a faster deposition rate in the first direction than in the second direction. After forming the protective layer, the first opening is elongated in the second direction. A second opening is formed in the first ILD layer and under the elongated first opening. A conductive material is formed in the second opening.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: September 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Chin Chang, Li-Te Lin, Pinyen Lin
  • Patent number: 10777455
    Abstract: A method for forming a semiconductor device structure is provided. A gate structure and a source/drain contact structure are formed over a substrate. The gate structure is covered with a capping layer. The capping layer and the source/drain contact structure are successively covered with a first insulating layer and a second insulating layer. A via opening is formed in the second insulating layer to expose the first insulating layer above the source/drain contact structure. The exposed first insulating layer is recessed using a first etching gas mixture including an oxygen gas, to leave a portion of the first insulating layer. The left portion of the first insulating layer using a second etching gas mixture including a hydrogen gas, to expose the source/drain contact structure. A conductive material is formed in the via opening to electrically connect the source/drain contact structure.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: September 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Jui Huang, Li-Te Lin, Pinyen Lin
  • Publication number: 20200287047
    Abstract: A device includes a semiconductor substrate, a first fin arranged over the semiconductor substrate, and an isolation structure. The first fin includes an upper portion, a bottom portion, and an insulator layer between the upper portion and the bottom portion. A top surface of the insulator layer is wider than a bottom surface of the upper portion of the first fin. The isolation structure surrounds the bottom portion of the first fin.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 10, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shu-Hao KUO, Jung-Hao CHANG, Chao-Hsien HUANG, Li-Te LIN, Kuo-Cheng CHING
  • Patent number: 10755968
    Abstract: A method is provided. A sacrificial layer is formed over a semiconductor substrate. An etching process is performed to form an opening in the sacrificial layer. The etching process includes a first cycle and a second cycle performed after the first cycle, and each of the first cycle and the second cycle includes applying a passivation gas and an etchant gas over the sacrificial layer, and performing an ionized gas bombardment on the sacrificial layer after applying the passivation gas and the etchant gas over the sacrificial layer. The passivation gas is applied at a first flow rate in the first cycle and is applied at a second flow rate in the second cycle, and the first flow rate is higher than the second flow rate.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Shan Chen, Chan-Syun David Yang, Li-Te Lin, Pinyen Lin
  • Patent number: 10755943
    Abstract: A method includes forming a mandrel structure over a semiconductor substrate. A first spacer and a second spacer are formed alongside the mandrel structure. A mask layer is over a first portion of the first spacer, in which a second portion of the first spacer and the second spacer are exposed from the mask layer. The exposed second spacer is etched, in which etching the exposed second spacer is performed such that a polymer is formed over a top surface of the exposed second portion of the first spacer. The mask layer, the polymer, and the mandrel structure are removed. The semiconductor substrate is patterned using the first spacer.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jung-Hao Chang, Chao-Hsien Huang, Wen-Ting Lan, Shi-Ning Ju, Li-Te Lin, Kuo-Cheng Ching
  • Patent number: 10741671
    Abstract: A method for manufacturing a semiconductor device, includes: forming a dummy gate structure on a semiconductor substrate; forming a plurality of gate spacers on opposite sidewalls of the dummy gate structure; removing the dummy gate structure from the semiconductor substrate; forming a metal gate electrode on the semiconductor substrate and between the gate spacers; and performing a plasma etching process to the metal gate electrode, wherein the plasma etching process comprises performing in sequence a first non-zero bias etching step and a first zero bias etching step.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: August 11, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Chen Lo, Li-Te Lin, Pinyen Lin
  • Publication number: 20200251382
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a recess in a layer. The recess has two opposite first inner walls and two opposite second inner walls, the first inner walls are spaced apart by a first distance, the second inner walls are spaced apart by a second distance, and the first distance is less than the second distance. The method includes depositing a first covering layer in the recess. The first covering layer covering the first inner walls is thinner than the first covering layer covering the second inner walls. The method includes removing the first covering layer over the first inner walls and a bottom surface of the recess.
    Type: Application
    Filed: April 20, 2020
    Publication date: August 6, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Xi-Zong CHEN, Chih-Hsuan LIN, Cha-Hsin CHAO, Yi-Wei CHIU, Li-Te HSU
  • Patent number: 10733352
    Abstract: Placement methods described in this disclosure provide placement and routing rules where a system implementing the automatic placement and routing (APR) method arranges standard cell structures in a vertical direction that is perpendicular to the fins but parallel to the cell height. Layout methods described in this disclosure also improve device density and further reduce cell height by incorporating vertical power supply lines into standard cell structures. Pin connections can be used to electrically connect the power supply lines to standard cell structures, thus improving device density and performance. The APR process is also configured to rotate standard cells to optimize device layout.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: August 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Hsiung Chen, Chung-Te Lin, Fong-Yuan Chang, Ho Che Yu, Li-Chun Tien
  • Publication number: 20200243385
    Abstract: A method for forming a semiconductor device structure is provided. A gate structure and a source/drain contact structure are formed over a substrate. The gate structure is covered with a capping layer. The capping layer and the source/drain contact structure are successively covered with a first insulating layer and a second insulating layer. A via opening is formed in the second insulating layer to expose the first insulating layer above the source/drain contact structure. The exposed first insulating layer is recessed using a first etching gas mixture including an oxygen gas, to leave a portion of the first insulating layer. The left portion of the first insulating layer using a second etching gas mixture including a hydrogen gas, to expose the source/drain contact structure. A conductive material is formed in the via opening to electrically connect the source/drain contact structure.
    Type: Application
    Filed: January 29, 2019
    Publication date: July 30, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Jui HUANG, Li-Te LIN, Pinyen LIN
  • Publication number: 20200243336
    Abstract: A directional patterning method includes following steps. A substrate is provided with a mask layer thereon, and the mask layer has at least one opening pattern therein. A cyclic deposition and etching process is performed to increase a length of the at least one opening pattern.
    Type: Application
    Filed: January 27, 2019
    Publication date: July 30, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Chin Chang, Li-Te Lin, Ru-Gun Liu, Wei-Liang Lin, Pinyen Lin, Yu-Tien Shen, Ya-Wen Yeh
  • Patent number: 10727177
    Abstract: A device includes gates and a first conductive segment. A first distance is present between a first gate of the gates and the first conductive segment. A second distance is present between a second gate of the gates and the first conductive segment. The first distance is greater than the second distance.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Te Lin, Ting-Wei Chiang, Hui-Zhong Zhuang, Li-Chun Tien, Pin-Dai Sue
  • Patent number: 10707199
    Abstract: An integrated circuit includes at least one first active region, at least one second active region adjacent to the first active region, and a plurality of third active regions. The first active region and the second active region are staggered. The third active regions are present adjacent to the first active region, wherein the third active regions are substantially aligned with each other.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: July 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Te Lin, Ting-Wei Chiang, Hui-Zhong Zhuang, Pin-Dai Sue, Li-Chun Tien
  • Patent number: 10707081
    Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: July 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chun Huang, Chiu-Hsiang Chen, Ya-Wen Yeh, Yu-Tien Shen, Po-Chin Chang, Chien Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Li-Te Lin, Pinyen Lin, Ru-Gun Liu, Chin-Hsiang Lin
  • Patent number: 10680109
    Abstract: A device includes a semiconductor substrate, a first fin arranged over the semiconductor substrate, and an isolation structure. The first fin includes an upper portion, a bottom portion, and an insulator layer between the upper portion and the bottom portion. A top surface of the insulator layer is wider than a bottom surface of the upper portion of the first fin. The isolation structure surrounds the bottom portion of the first fin.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: June 9, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shu-Hao Kuo, Jung-Hao Chang, Chao-Hsien Huang, Li-Te Lin, Kuo-Cheng Ching