Patents by Inventor Li-Tien Huang

Li-Tien Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180311158
    Abstract: A functionalized MWCNT complex structure containing SiO2@EDAS nano-particles and Ag@Citrate nano-molecules and of high moisturization and sterilization includes a functionalized MWCNT; carbon atoms of a benzene of the functionalized MWCNT being combined with other functional groups containing COOH, OH and SO; a plurality of SiO2@EDAS nano-particles which are formed by modifying N-[3-(2-Aminoethylamino) propyl] trimethoxysilane (EDAS) on SiO2 nano-particles; the adhering layer further containing a plurality of Ag@Citrate nano-molecules. Therefore, since the functionalized MWCNTs 10 contains both the SiO2@EDAS nano-particles 21 and the Ag@Citrate nano-molecules 22 and thus it has the functions of the moisturization and sterilization.
    Type: Application
    Filed: April 27, 2017
    Publication date: November 1, 2018
    Inventors: HONG-ZHENG LAI, Li-Tien Huang, I-Lin Lee, Cheng-Sung Lin, Tseng-Lung Chang
  • Patent number: 9196718
    Abstract: A semiconductor substructure with improved performance and a method of forming the same is described. The semiconductor substructure includes a dielectric film over a substrate, the dielectric film including at least one metal dielectric layer, at least one oxygen-donor layer, and at least one nitride-incorporation layer.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: November 24, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Liang-Chen Chi, Chia-Ming Tsai, Yu-Min Chang, Chin-Kun Wang, Miin-Jang Chen, Li-Tien Huang