Patents by Inventor Li Ting Celina ONG

Li Ting Celina ONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded wire semiconductor device
    Patent number: 8450841
    Abstract: A bonded wire semiconductor device includes a sub-assembly including a semiconductor die having an active face with a set of internal electrical contact elements and an externally exposed set of electrical contact elements. A set of bond wires make respective electrical connections between the internal electrical contact elements and the externally exposed set of electrical contact elements. A molding compound encapsulates the semiconductor die with the active face embedded in the molding compound. The bond wires have the same length. The bond wires are bonded to the internal electrical contact elements and to the externally exposed electrical contact elements at first and second curved arrays and of bond positions respectively. The first and second curved arrays and of bond positions have corresponding concentric shapes.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: May 28, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Li Ting Celina Ong, Yin Kheng Au, Zi-Song Poh
  • BONDED WIRE SEMICONDUCTOR DEVICE
    Publication number: 20130032932
    Abstract: A bonded wire semiconductor device includes a sub-assembly including a semiconductor die having an active face with a set of internal electrical contact elements and an externally exposed set of electrical contact elements. A set of bond wires make respective electrical connections between the internal electrical contact elements and the externally exposed set of electrical contact elements. A molding compound encapsulates the semiconductor die with the active face embedded in the molding compound. The bond wires have the same length. The bond wires are bonded to the internal electrical contact elements and to the externally exposed electrical contact elements at first and second curved arrays and of bond positions respectively. The first and second curved arrays and of bond positions have corresponding concentric shapes.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Li Ting Celina ONG, Yin Kheng Au, Zi-Song Poh