Abstract: The disclosure provides a touch recognition device, including a display device and manufacturing method thereof. The touch recognition device includes a substrate, a thin film transistor layer, a transparent conductive layer, a first metal layer, a piezoelectric material layer and a second metal layer. The transparent conductive layer is disposed on an end of the thin film transistor layer, and the transparent conductive layer includes a plurality of transparent electrodes. The first metal layer is adjacent to the plurality of transparent electrodes. The piezoelectric material layer is disposed on the transparent conductive layer and the first metal layer. The second metal layer is disposed on the piezoelectric material layer to achieve the effect of increasing voltage of signals and power of ultrasound.

Abstract: The disclosure provides a touch recognition device, including a display device and manufacturing method thereof. The touch recognition device includes a substrate, a thin film transistor layer, a transparent conductive layer, a first metal layer, a piezoelectric material layer and a second metal layer. The transparent conductive layer is disposed on an end of the thin film transistor layer, and the transparent conductive layer includes a plurality of transparent electrodes. The first metal layer is adjacent to the plurality of transparent electrodes. The piezoelectric material layer is disposed on the transparent conductive layer and the first metal layer. The second metal layer is disposed on the piezoelectric material layer to achieve the effect of increasing voltage of signals and power of ultrasound.

Abstract: The present disclosure provides an acoustic wave fingerprint recognition unit including a sensor circuit substrate, a film adhesive layer positioned on the sensor circuit substrate, a piezoelectric material layer positioned on the film adhesive layer and a protection layer positioned on the piezoelectric material layer. The film adhesive layer is formed of a film adhesive material, and the film adhesive material is composed of a film adhesive agent and an organic solvent. The film adhesive agent is an epoxy resin, and the organic solvent is a C3-C8 and carbonyl-containing organic solvent. The solid content of the film adhesive agent in the film adhesive material is in a range of 1%-90%. A method for manufacturing the acoustic wave fingerprint recognition unit is also provided herein.

Abstract: The present disclosure provides an acoustic wave fingerprint recognition unit including a sensor circuit substrate, a film adhesive layer positioned on the sensor circuit substrate, a piezoelectric material layer positioned on the film adhesive layer and a protection layer positioned on the piezoelectric material layer. The film adhesive layer is formed of a film adhesive material, and the film adhesive material is composed of a film adhesive agent and an organic solvent. The film adhesive agent is an epoxy resin, and the organic solvent is a C3-C8 and carbonyl-containing organic solvent. The solid content of the film adhesive agent in the film adhesive material is in a range of 1%-90%. A method for manufacturing the acoustic wave fingerprint recognition unit is also provided herein.

Abstract: A method of processing a substrate or panel is disclosed. A substrate having thereon an array of chips is provided. A mask layer is laminated on the substrate. The mask layer has a plurality of openings to reveal active areas of the chips respectively. A spray-coating process is then performed to form an adhesive film in the active areas. The mask layer is then stripped off.