Patents by Inventor LI-TING HSIEH

LI-TING HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116148
    Abstract: A tool set includes a tool holder, a tool and a tool rack. The tool has a groove unit. The tool holder has a latch unit that engages the groove unit. The tool rack includes a rack body and a blocking member. When the tool holder is moved away from the rack body after the tool is moved into the rack body by the tool holder and after the blocking member moves to a blocking position, the tool is blocked by the blocking member so that the latch unit is separated from the groove unit and that the tool holder is separated from the tool.
    Type: Application
    Filed: August 28, 2023
    Publication date: April 11, 2024
    Applicant: Jabil Inc.
    Inventors: Harpuneet Singh, Lei Hu, Ying-Chieh Huang, Wei-Hsiu Hsieh, Xiao-Ting Zheng, Chien-Cheng Chu, Tike Hoong Phua, Li Yun Chee
  • Patent number: 9285681
    Abstract: The invention relates to a photosensitive resin composition, and an overcoat and/or spacer for a liquid crystal display component. The photosensitive resin composition comprises an alkali-soluble resin (A), a compound having an ethylenically unsaturated group (B); a photoinitiator (C); a solvent (D); and an organic acid (E). The alkali-soluble resin (A) comprises a resin having an unsaturated group (A-1) synthesized by polymerizing a mixture, and the mixture comprises an epoxy compound having at least two epoxy groups (i) and a compound having at least one carboxyl group and at least one vinyl unsaturated group (ii). A molecular weight of said organic acid (E) is below 1000.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: March 15, 2016
    Assignee: CHI MEI CORPORATION
    Inventor: Li-Ting Hsieh
  • Publication number: 20160054651
    Abstract: The present invention relates to a photosensitive resin composition for a black matrix and an application thereof. The aforementioned photosensitive resin composition includes an alkali-soluble resin (A), a compound having an ethylenically unsaturated group (B), a photo-initiator (C), a solvent (D), a black pigment (E) and an oxetane compound having silicon atom (F). The aforementioned alkali-soluble resin (A) includes a first alkali-soluble resin (A-1) having a fluorine atom. The photosensitive resin composition for the black matrix has excellent development resistance and lower surface resistance.
    Type: Application
    Filed: November 5, 2015
    Publication date: February 25, 2016
    Inventors: Chun-An Shih, Hao-Wei Liao, Li-Ting Hsieh, Chen-Yu Wu
  • Publication number: 20150060745
    Abstract: A photosensitive resin composition for a black matrix including an alkali-soluble resin (A), a compound (B) having an ethylenically unsaturated group, a photoinitiator (C), a solvent (D), a black pigment (E), a cross-linking agent (F), and an inorganic particle is provided. The alkali-soluble resin (A) includes a resin (A-1) having an unsaturated group, wherein the resin (A-1) having an unsaturated group is obtained by polymerizing a mixture including an epoxy compound having at least two epoxy groups and a compound having at least one carboxylic acid group and at least one ethylenically unsaturated group. The cross-linking agent (F) includes a cross-linking agent (F-1) obtained by reacting a novolac resin represented by formula (f-1) and an epihalohydrin under an existence of an alkali metal hydroxides. The inorganic particle employs oxides of a Group 4 element, oxides of silicone, or a combination thereof to serve as the major component.
    Type: Application
    Filed: August 19, 2014
    Publication date: March 5, 2015
    Inventors: Hao-Wei Liao, Li-Ting Hsieh
  • Publication number: 20140356786
    Abstract: The invention relates to a photosensitive resin composition, and an overcoat and/or spacer for a liquid crystal display component. The photosensitive resin composition comprises an alkali-soluble resin (A), a compound having an ethylenically unsaturated group (B); a photoinitiator (C); a solvent (D); and an organic acid (E). The alkali-soluble resin (A) comprises a resin having an unsaturated group (A-1) synthesized by polymerizing a mixture, and the mixture comprises an epoxy compound having at least two epoxy groups (i) and a compound having at least one carboxyl group and at least one vinyl unsaturated group (ii). A molecular weight of said organic acid (E) is below 1000.
    Type: Application
    Filed: May 19, 2014
    Publication date: December 4, 2014
    Applicant: CHI MEI CORPORATION
    Inventor: LI-TING HSIEH