Patents by Inventor Li Tsai
Li Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240177949Abstract: A force-sensitive key module and a force-sensitive switch structure are provided. The force-sensitive switch structure includes a first protective layer, a second protective layer, a first conductive layer, a second conductive layer and a force-sensitive layer. The first protective layer receives a pressing force. The second conductive layer is aligned with the first conductive layer. The force-sensitive layer is installed on the first conductive layer or the second conductive layer. When the first protective layer receives the pressing force, an electric connection between the first conductive layer and the second conductive layer is established, and the force-sensitive layer generates an analog sensing signal in response to the pressing force. When a magnitude of the pressing force is changed, the analog sensing signal is correspondingly changed according to an impedance change of the force-sensitive layer.Type: ApplicationFiled: February 22, 2023Publication date: May 30, 2024Inventors: Che-An Li, Yi-Liang Chen, Lei-Lung Tsai
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Patent number: 11997617Abstract: A number of power headroom solutions are disclosed, including but not limited to signaling of a bandwidth part (BWP) specific maximum outpower by a gNB to a UE, signaling of a beam specific maximum output power by the gNB to the UE, signaling by the UE to the gNB of the UE setting of BWP configured maximum transmit output power, signaling by the UE to the gNB of the UE setting of beam or group of beam configured maximum transmit output power, signaling by the UE to the gNB of BWP specific power headroom report, signaling by the UE to the gNB of beam or group of beam specific power headroom report and rules for power headroom reporting when the UE has overlapping resource grants.Type: GrantFiled: November 15, 2018Date of Patent: May 28, 2024Assignee: InterDigital Patent Holdings, Inc.Inventors: Pascal M. Adjakple, Qing Li, Guodong Zhang, Stephen E. Terry, Allan Y. Tsai
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Publication number: 20240172269Abstract: Methods, systems, and apparatuses are described herein for beamforming based initial access, beam management, and beam based mobility designs for NR systems. Issues are identified and addressed related to, for example, initial access, control channel design, eMBB and URLLC mixing, and beam training.Type: ApplicationFiled: January 19, 2024Publication date: May 23, 2024Applicant: InterDigital Patent Holdings, Inc.Inventors: Qing Li, Lakshmi R. Iyer, Allan Y. Tsai, Guodong Zhang, Tianyi Xu, Wei Chen, Pascal M. Adjakple, Joseph M. Murray
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Patent number: 11990761Abstract: A power supply system with current sharing includes a current sharing bus, a plurality of power supply units, and a plurality of controllers. The power supply units are connected to each other through the current sharing bus. Each power supply unit provides a current sharing signal value to the current sharing bus, and provides an output current to a load. Each controller receives current sharing signal values provided from other power supply units and current signal values corresponding to the output currents. When determining that the current signal value is less than a reference current sharing signal value, the controller increases an output voltage of the power supply unit to increase the output current. Otherwise, the controller decreases the output voltage to decrease the output current so that so that the output currents of the power supply units are shared to supply power to the load.Type: GrantFiled: November 10, 2022Date of Patent: May 21, 2024Assignee: FSP TECHNOLOGY INC.Inventors: Chien-Li Tsai, Chih-Fan Lin, Chih-Hsien Hsieh
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Patent number: 11991664Abstract: New radio channel designs incorporate a synchronization signal burst series frame structure, with higher layer channels mapped to physical channels transmitted during a synchronization signal, allowing user equipment to select beams during which to listen for paging information. A physical common control channel configuration information element may be used to signal the paging configuration as part of the System Information. Paging may occur with or without user equipment assistance.Type: GrantFiled: February 23, 2023Date of Patent: May 21, 2024Assignee: IPLA Holdings Inc.Inventors: Joseph M. Murray, Pascal M. Adjakple, Allan Y. Tsai, Qing Li, Lakshmi R. Iyer, Wei Chen, Guodong Zhang, Yifan Li, Mohamed Awadin
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Publication number: 20240156440Abstract: A method of reconstructing transcranial images using a dual-mode ultrasonic phased array includes steps of: controlling channels to emit energy toward an intracranial target point of a patient; respectively generating backscattered radiofrequency (RF) data by using the channels to receive backscattered energy reflected from the intracranial target; and reconstructing an acoustic distribution image based on those backscattered RF data in real-time. Compared with Pre-Treatment Ray Tracing Method, the present invention can display intracranial pressure distribution in real-time; compared with MR Thermometry, the present invention can be applied to low-energy applications without temperature change; and compared with Passive Cavitation Imaging, the present invention can stably present acoustic distribution images without relying on microbubbles.Type: ApplicationFiled: November 8, 2023Publication date: May 16, 2024Inventors: HAO-LI LIU, HSIANG-CHING LIN, ZHEN-YUAN LIAO, HSIANG-YANG MA, CHIH-HUNG TSAI, CHUN-HAO CHEN
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Publication number: 20240157412Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: ApplicationFiled: January 26, 2024Publication date: May 16, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20240164183Abstract: Disclosed are a display substrate and a display apparatus. The display substrate includes a display region, an opening region located in the display region, and a frame region located between the display region and the opening region. The frame region at least includes a first isolation region, and the first isolation region includes at least one signal line group and at least one organic insulation layer which are stacked. At least two first isolation grooves are disposed in the at least one organic insulation layer, the at least two first isolation grooves are disposed at intervals along a direction away from the opening region, and an orthographic projection of the signal line group in the frame region is located between orthographic projections of the at least two first isolation grooves in the frame region.Type: ApplicationFiled: July 28, 2021Publication date: May 16, 2024Inventors: Chunyan XIE, Paoming TSAI, Song ZHANG, Li JIA, Tao GAO
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Patent number: 11984450Abstract: A device includes a semiconductive fin, an isolation structure, a gate structure, dielectric spacers, and source/drain epitaxial structures. The isolation structure surrounds a bottom portion of the semiconductive fin. The gate structure is over the semiconductive fin. The dielectric spacers are on opposite sides of the semiconductive fin and over the isolation structure. The dielectric spacers include nitride. The source/drain epitaxial structures are on opposite sides of the gate structure and over the dielectric spacers. The source/drain epitaxial structures have hexagon shapes.Type: GrantFiled: June 10, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Sung-Li Wang, Pang-Yen Tsai, Yasutoshi Okuno
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Publication number: 20240150383Abstract: A compound including a first ligand LA of is disclosed. In the structure of Formula I, one of L1 and L2 is C, and the other is N; Y1 to Y14 are each C or N; at least two adjacent Y7, Y8, Y9, and Y10 are carbon atoms that are fused to a structure of Z1 and Z2 are each O, S, Se, NR, CRR?, or SiRR?; and each R, R?, RA, RB, RC, and RD is hydrogen or a substituent; and any two substituents may be joined or fused together to form a ring. In the compound, LA is complexed to a metal M by L1 and L2, and M has an atomic weight greater than 40. Organic light emitting devices and consumer products containing the compounds are also disclosed.Type: ApplicationFiled: November 29, 2023Publication date: May 9, 2024Applicant: UNIVERSAL DISPLAY CORPORATIONInventors: Zhiqiang LI, Jui-Yi TSAI, Alexey Borisovich DYATKIN, Chun LIN
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Patent number: 11974844Abstract: Electrochemical impedance spectroscopy (EIS) may be used in conjunction with continuous glucose monitoring (CGM) to enable identification of valid and reliable sensor data, as well implementation of Smart Calibration algorithms.Type: GrantFiled: April 29, 2019Date of Patent: May 7, 2024Assignee: MEDTRONIC MINIMED, INC.Inventors: Keith Nogueira, Taly G. Engel, Xiaolong Li, Bradley C. Liang, Rajiv Shah, Jaeho Kim, Mike C. Liu, Andy Y. Tsai
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Publication number: 20240145632Abstract: A micro light emitting device includes an epitaxial structure, a conductive layer, and a first insulating layer. The epitaxial structure has a first surface and a second surface opposite to the first surface, and includes a first semiconductor layer, an active layer and a second semiconductor layer that are arranged in such order in a direction from the first surface to the second surface. The conductive layer is formed on a surface of the first semiconductor layer away from the active layer. The first insulating layer is formed on the surface of the first semiconductor layer away from the active layer, and exposes at least a part of the conductive layer.Type: ApplicationFiled: October 23, 2023Publication date: May 2, 2024Inventors: Ming-Chun TSENG, Shaohua HUANG, Hongwei WANG, Kang-Wei PENG, Su-Hui LIN, Xiaomeng LI, Chi-Ming TSAI, Chung-Ying CHANG
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Patent number: 11974311Abstract: A method for wireless communication performed by a user equipment (UE) is provided. The method includes receiving, from a base station (BS), a Radio Resource Control (RRC) configuration to configure a first semi-persistent scheduling (SPS) physical downlink shared channel (PDSCH) and generating first uplink control information (UCI) in response to the first SPS PDSCH, where the RRC configuration includes a first parameter that indicates a priority of the first UCI.Type: GrantFiled: March 1, 2023Date of Patent: April 30, 2024Assignee: Hannibal IP LLCInventors: Wan-Chen Lin, Yu-Hsin Cheng, Heng-Li Chin, Hsin-Hsi Tsai
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Publication number: 20240136459Abstract: A multi junction solar cell structure includes a first sub-cell, a first tunnel diode layer, a second tunnel diode layer, a second sub-cell, a lattice gradient buffer layer and a third sub-cell. The first sub-cell includes a first surface and a second surface opposite to the first surface. The first tunnel diode layer is formed on the first surface of the first sub-cell. The second sub-cell is formed on the first tunnel diode layer. The second tunnel diode layer is formed on the second surface of the first sub-cell. The lattice gradient buffer layer is formed on the second tunnel diode. The third sub-cell is formed on the lattice gradient buffer layer. This disclosure also contains a method for manufacturing the above-mentioned multi-junction solar cell.Type: ApplicationFiled: April 19, 2023Publication date: April 25, 2024Inventors: YU-LI TSAI, Chih-Hung Wu
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Patent number: 11968644Abstract: Methods and apparatus are disclosed pertaining to paging for Unlicensed New Radio (NR-U). Methods include means to: perform paging using multiple paging occasions (POs) during a DRX Cycle, perform paging using a paging window, perform paging using a PO comprised of multiple sweeps and/or repetitions, signal DL channel access indication for paging, and perform paging using dynamic DRX. In accordance with one embodiment, an apparatus may receive a signal comprising a plurality of POs, wherein each PO comprises a plurality of physical downlink control channel (PDCCH) monitoring occasions. The apparatus may monitor, based on receiving an identifier associated with the apparatus, a portion of the plurality of paging occasions. The apparatus may detect, in a PDCCH monitoring occasion of the plurality of PDCCH monitoring occasions in the monitored portion, paging downlink control information (DCI).Type: GrantFiled: August 14, 2019Date of Patent: April 23, 2024Assignee: InterDigital Patent Holdings, Inc.Inventors: Joseph M. Murray, Pascal M. Adjakple, Lakshmi R. Iyer, Qing Li, Mohamed Awadin, Yifan Li, Allan Y. Tsai, Guodong Zhang
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Patent number: 11958090Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: GrantFiled: July 28, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20240121047Abstract: A wireless transmit/receive unit (WTRU) may receive a tracking reference signal comprising resources located in one or more slots. The resources may be located in one or more symbols used for receiving a demodulation reference signal. The one or more symbols in which the resources of the tracking reference signal are located may be within a first five symbols in each of the one or more slots. At least one resource of the received tracking reference signal may be frequency multiplexed with the demodulation reference signal.Type: ApplicationFiled: December 13, 2023Publication date: April 11, 2024Inventors: Yifan LI, Lakshmi R. IYER, Joseph M. MURRAY, Allan Y. TSAI, Guodong ZHANG, Qing LI
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Patent number: 11955423Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.Type: GrantFiled: March 26, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang
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Publication number: 20240113259Abstract: A light-emitting device includes a semiconductor epitaxial structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and having holes; a first insulation layer disposed on the semiconductor epitaxial structure and having first and second grooves; a first pad electrically connected to the first semiconductor layer through the first grooves; and a second pad electrically connected to the second semiconductor layer through the second grooves. A projection of the first pad does not overlap projections of the holes. A projection of the second pad does not overlap the projections of the holes. The first pad includes a first pad connection portion and first pad extension portions; the second pad includes a second pad connection portion and second pad extension portions. Projections of the second grooves fall between projections of the first and second pad extension portions. Two other aspects of the light-emitting device are also provided.Type: ApplicationFiled: September 28, 2023Publication date: April 4, 2024Inventors: Xiushan ZHU, Qi JING, Yan LI, Xiaoliang LIU, Zhilong LU, Chunhsien LEE, Chi-Ming TSAI, Juchin TU, Chung-Ying CHANG
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Patent number: 11950250Abstract: Methods and apparatuses are described herein for uplink control information (UCI) design for uplink (UL) transmission with configured grants. In accordance with one embodiment, a wireless communications device may receive, from a gNB, first information indicating a plurality of resources for a configured grant (CG) on a physical uplink shared channel (PUSCH). The wireless communications device may determine, based on second information, a portion of the plurality of resources to use for transmitting a configured grant-uplink control information (CG-UCI). The wireless communications device may generate the CG-UCI, wherein the CG-UCI comprises at least one of: an identifier associated with the wireless communications device or an indication of a modulation and coding scheme (MCS). The wireless communications device may transmit, to the gNB on the PUSCH, the CG-UCI using the determined portion of the plurality of resources.Type: GrantFiled: August 8, 2019Date of Patent: April 2, 2024Assignee: IPLA HOLDINGS INC.Inventors: Yifan Li, Allan Y. Tsai, Qing Li, Lakshmi R. Iyer, Mohamed Awadin, Joseph M. Murray, Guodong Zhang