Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: A multi junction solar cell structure includes a first sub-cell, a first tunnel diode layer, a second tunnel diode layer, a second sub-cell, a lattice gradient buffer layer and a third sub-cell. The first sub-cell includes a first surface and a second surface opposite to the first surface. The first tunnel diode layer is formed on the first surface of the first sub-cell. The second sub-cell is formed on the first tunnel diode layer. The second tunnel diode layer is formed on the second surface of the first sub-cell. The lattice gradient buffer layer is formed on the second tunnel diode. The third sub-cell is formed on the lattice gradient buffer layer. This disclosure also contains a method for manufacturing the above-mentioned multi-junction solar cell.

Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

Abstract: A power supply system with current sharing includes a current sharing bus, a plurality of power supply units, and a plurality of controllers. The power supply units are connected to each other through the current sharing bus. Each power supply unit provides a current sharing signal value to the current sharing bus, and provides an output current to a load. Each controller receives current sharing signal values provided from other power supply units and current signal values corresponding to the output currents. When determining that the current signal value is less than a reference current sharing signal value, the controller increases an output voltage of the power supply unit to increase the output current. Otherwise, the controller decreases the output voltage to decrease the output current so that so that the output currents of the power supply units are shared to supply power to the load.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: A multi junction solar cell structure includes a first sub-cell, a first tunnel diode layer, a second tunnel diode layer, a second sub-cell, a lattice gradient buffer layer and a third sub-cell. The first sub-cell includes a first surface and a second surface opposite to the first surface. The first tunnel diode layer is formed on the first surface of the first sub-cell. The second sub-cell is formed on the first tunnel diode layer. The second tunnel diode layer is formed on the second surface of the first sub-cell. The lattice gradient buffer layer is formed on the second tunnel diode. The third sub-cell is formed on the lattice gradient buffer layer. This disclosure also contains a method for manufacturing the above-mentioned multi-junction solar cell.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: A detection circuit is provided herein, which includes a first transistor, a second transistor, a third transistor, a light sensor, a capacitor, and a fourth transistor. The first transistor has a control terminal, a first terminal, and a second terminal. The second transistor is coupled to the control terminal. The third transistor is coupled to the control terminal and the second terminal. The light sensor is coupled to the control terminal. The capacitor is coupled to the control terminal. The fourth transistor is coupled to the second terminal.

Abstract: A method of updating power firmware is applied to update power firmware when a power supply is powered. The method is executed by a microcontroller of the power supply, and the method includes steps of: planning a memory space in the microcontroller as a first space and a second space, wherein the first space stores a first program currently executing the power supply required by the power supply, emptying the second space before the power firmware is updated, writing a second program stored in a management system into the second space, switching the second space to the first space to complete updating the power firmware after the second program is completely written into the second space, and continuously outputting working power.

Abstract: A power supply system with current sharing includes a current sharing bus, a plurality of power supply units, and a plurality of controllers. The power supply units are connected to each other through the current sharing bus. Each power supply unit provides a current sharing signal value to the current sharing bus, and provides an output current to a load. Each controller receives current sharing signal values provided from other power supply units and current signal values corresponding to the output currents. When determining that the current signal value is less than a reference current sharing signal value, the controller increases an output voltage of the power supply unit to increase the output current. Otherwise, the controller decreases the output voltage to decrease the output current so that so that the output currents of the power supply units are shared to supply power to the load.

Abstract: A sensing device, including a plurality of sensing pixels arranged in Y rows and M columns, a plurality of readout lines coupled to the sensing pixels, and a plurality of control lines each coupled to a sensing pixel subset, is provided. The Y times N sensing pixels within the sensing pixel subset are arranged in adjacent N columns, where Y, M and N are integers and N is smaller than M. Each of the control lines is configured to control one row of the sensing pixel subset to output signals through corresponding readout lines.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: An electronic device is provided. The electronic device includes a substrate, a first conductive layer disposed on the substrate, a planarization layer disposed on the first conductive layer, an electric element, and a second conductive layer disposed on the planarization layer. The first conductive layer and the second conductive layer include an output line and a control line, respectively. The electric element is used to produce a first signal. The electronic device further includes a switching element, which is used to receive the first signal and output the first signal to the output line according to a second signal of the control line. The output line and the control line partially overlap.

Abstract: A master-slave interchangeable power supply device, a power supply method, a host with the master-slave interchangeable power supply device, and a computer-readable storage medium for use in execution of the power supply method are provided. Upon receipt of a start command, a power control module and a power supply unit of the power supply device operate in a master mode and a slave mode respectively, and then the power supply device provides a working power to a master device to effect related configuration of the power supply device, so as to allow the power control module to switch to the slave mode and allow the working power to be provided to the master device. Therefore, given compliance with a specification of a communication bus, the power control module and the power supply unit, which function as peripheral devices, can perform a communicative function.

Abstract: A detection circuit is provided herein, which includes a first transistor, a second transistor, a third transistor, a light sensor, a capacitor, and a fourth transistor. The first transistor has a control terminal, a first terminal, and a second terminal. The second transistor is coupled to the control terminal. The third transistor is coupled to the control terminal and the second terminal. The light sensor is coupled to the control terminal. The capacitor is coupled to the control terminal. The fourth transistor is coupled to the second terminal.

Abstract: A sensing device includes a sensing circuit, a conductive line, and a sampling circuit. The conductive line is electrically connected to the sensing circuit. The sampling circuit is electrically connected to the conductive line. The sampling circuit includes a capacitor, a first thin film transistor, and a second thin film transistor. The first terminal of the first thin film transistor is electrically connected to the first terminal of the capacitor. The first terminal of the second thin film transistor is electrically connected to the second terminal of the capacitor. The second terminal of the first thin film transistor is electrically connected to the conductive line. The second terminal of the second thin film transistor is electrically connected to the ground terminal.

Abstract: A sensing device is provided herein, which operates in a reset period, an exposure period, and a readout period. The sensing device includes a first transistor, a second transistor, a detection device, and a third transistor. The first transistor includes a control terminal and a first terminal. The second transistor is coupled to the first transistor and configured to set the voltage of the control terminal during the exposure period. The sensing device is coupled to the first transistor and configured to change the voltage of the control terminal during the exposure period. The third transistor is coupled to the first transistor and includes an output terminal outputting a sense signal from the first terminal during the readout period. The first transistor is an N-type transistor and the third transistor is a P-type transistor.