Patents by Inventor Li-Wei Hung

Li-Wei Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240115410
    Abstract: An assistive device structure for positioning and pressure relief is provided, including a first elastic layer and a second elastic layer, which are attached by using a high-frequency encapsulation process, sealing, bagging, thermoforming, or an integrally molding process. Each of the first and second elastic layers has a bottom surface and an arc surface disposed opposite to each other. The arc surface includes two protrusions and a recess formed there in between. The two protrusions have different heights. A hollow area is disposed in the recess of the first and second elastic layers. Based on such structure, the bottom surfaces of the first and second elastic layers are attached to form the proposed assistive device structure for a user to lean against and providing multiple positioning effects and pressure relief. More than four axial directions of supporting forces are generated to effectively enhance muscle relaxation and stress relief.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: SY-WEN HORNG, LONG-YING CHENG, CHI-WEI HUNG, HSIANG-JUNG HUNG, LI-CHE HUNG
  • Publication number: 20240088650
    Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Li-Wei Chu, Tao Yi Hung, Chia-Hui Chen, Wun-Jie Lin, Jam-Wem Lee
  • Publication number: 20240088179
    Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 14, 2024
    Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: You-Wei Chang, Chien-Chen Lee, Li-Chun Hung
  • Patent number: 11892884
    Abstract: A hinge structure for an electronic device including a first part and a second part is provided. The hinge structure includes a first fixing base, a second fixing base, a rotating element, and a control element. The first fixing base connects to the first part. The second fixing base connects to the second part and includes a first locking structure. The rotating element includes a second locking structure. An end of the rotating element rotatably and movably connects to the first fixing base along an axial direction. The other end of the rotating element engages with the first locking structure through the second locking structure. The control element extends to the rotating element for driving the rotating element to move along the axial direction.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: February 6, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Tsung-Ju Chiang, Marco Da Ros, Yung-Hsiang Chen, Li Wei Hung
  • Patent number: 11892873
    Abstract: The disclosure provides a computer device. The computer device includes a base, a host case, and a display support. The base includes an upper surface and includes a power module therein. The host case is detachably fixed to the base and electrically connected to the power module through the upper surface. One end of the display support is connected to the base, and the other end thereof includes a display connection structure.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: February 6, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yung-Hsiang Chen, Li-Hsiang Chiu, Marco Da Ros, Li-Wei Hung
  • Patent number: 11868295
    Abstract: A method and system for accelerating the analysis of large-scale data reads a data packet from a queue, and after performing data processing on the data packet, a first high, middle, and low byte of the processed data packet is cyclically read; a preset signal reference value is read, and the signal reference value is converted into a collected value according to a preset signal transformation ratio and correction factor; the collected value is converted into an integer value, and the integer value is split into a second high, middle, and low byte; and the first high, middle, and low byte of the processed data packet is compared with the second high, middle and low byte of the integer value in a preset way. A determination as to whether the data of the packet is abnormal or not is made based on the result of the comparison.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: January 9, 2024
    Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventors: Gan-Hao Wei, Li-Wei Hung
  • Patent number: 11871531
    Abstract: A computer device and a host module thereof are provided. The host module includes a case, a motherboard, and a power supply unit. The case includes a first side plate, a second side plate, a front panel, a rear panel, and a separation structure. The rear panel is located on an opposite side of the front panel. The first side plate, the second side plate, the front panel, and the rear panel enclose an internal space. The separation structure is located in the internal space, extends from the first side plate to the second side plate, and divides the internal space into a first part and a second part. The second part is located under the first part. The motherboard is disposed in the first part. The power supply unit is disposed in the second part, and is electrically connected to the motherboard.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: January 9, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yung-Hsiang Chen, Marco Da Ros, Li-Wei Hung, Li-Hsiang Chiu
  • Publication number: 20240004819
    Abstract: A method and system for accelerating analysis of large-scale data that reads a data packet from a queue, and after performing data processing on the data packet, a first high, middle, and low byte of the processed data packet is cyclically read; a preset signal reference value is read, and the preset signal reference value is converted into a collected value according to a preset signal transformation ratio and a correction factor; the collected value is converted into an integer value, and the integer value is split into a second high, middle, and low byte; and the first high, middle, and low byte of the processed data packet is compared with the second high, middle and low byte of the integer value in a preset way. A determination as to whether the data of the packet is abnormal or not is made based on the result of the comparison.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Applicant: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventors: GAN-HAO WEI, LI-WEI HUNG
  • Publication number: 20230106020
    Abstract: A light-emitting diode chip is described. The light-emitting diode chip includes a light-emitting structure, a first electrode, and a second electrode. The first electrode is disposed on the light-emitting structure and is electrically connected to the light-emitting structure. The second electrode is disposed on the light-emitting structure, and the second electrode and the first electrode are located on the same side of the light-emitting structure, wherein the second electrode is electrically connected to the light-emitting structure. The light-emitting diode chip has a first surface and a second surface which are opposite to each other, and a side surface connected between the first surface and the second surface. The side surface is substantially perpendicular to the first surface and the second surface, and an included angle between the side surface and the first surface is between 86 degrees and 94 degrees.
    Type: Application
    Filed: December 3, 2021
    Publication date: April 6, 2023
    Inventors: Li-Wei HUNG, Hsin-Liang YEH, Wei-Chen CHIEN, Zhen-Jin WANG
  • Publication number: 20230050313
    Abstract: The disclosure provides a computer device. The computer device includes a base, a host case, and a display support. The base includes an upper surface and includes a power module therein. The host case is detachably fixed to the base and electrically connected to the power module through the upper surface. One end of the display support is connected to the base, and the other end thereof includes a display connection structure.
    Type: Application
    Filed: May 9, 2022
    Publication date: February 16, 2023
    Inventors: Yung-Hsiang CHEN, Li-Hsiang CHIU, Marco DA ROS, Li-Wei HUNG
  • Publication number: 20230049278
    Abstract: A computer device and a host module thereof are provided. The host module includes a case, a motherboard, and a power supply unit. The case includes a first side plate, a second side plate, a front panel, a rear panel, and a separation structure. The rear panel is located on an opposite side of the front panel. The first side plate, the second side plate, the front panel, and the rear panel enclose an internal space. The separation structure is located in the internal space, extends from the first side plate to the second side plate, and divides the internal space into a first part and a second part. The second part is located under the first part. The motherboard is disposed in the first part. The power supply unit is disposed in the second part, and is electrically connected to the motherboard.
    Type: Application
    Filed: March 7, 2022
    Publication date: February 16, 2023
    Inventors: Yung-Hsiang CHEN, Marco DA ROS, Li-Wei HUNG, Li-Hsiang CHIU
  • Publication number: 20220399478
    Abstract: A micro light-emitting film structure includes a first conductivity type semiconductor film, a light-emitting film, a second conductivity type semiconductor film, a first contact electrode, and a second contact electrode. The first conductivity type semiconductor film has first and second surfaces opposite to each other. The second surface includes an asperity. A height difference of relief of the asperity is less than or equal to 1 ?m. The light-emitting film is disposed on the first surface. The second conductivity type semiconductor film is connected to the light-emitting film sandwiched between the second conductivity type semiconductor film and the first conductivity type semiconductor film. The first contact electrode is connected to the first conductivity type semiconductor film. The second contact electrode is connected to the second conductivity type semiconductor film. A thickness of the micro light-emitting film structure is equal to or smaller than 10 ?m.
    Type: Application
    Filed: December 3, 2021
    Publication date: December 15, 2022
    Inventors: Ming-Sen HSU, Li-Wei HUNG, Hsin-Liang YEH, Wei-Chen CHIEN
  • Publication number: 20220382699
    Abstract: A method and system for accelerating the analysis of large-scale data reads a data packet from a queue, and after performing data processing on the data packet, a first high, middle, and low byte of the processed data packet is cyclically read; a preset signal reference value is read, and the signal reference value is converted into a collected value according to a preset signal transformation ratio and correction factor; the collected value is converted into an integer value, and the integer value is split into a second high, middle, and low byte; and the first high, middle, and low byte of the processed data packet is compared with the second high, middle and low byte of the integer value in a preset way. A determination as to whether the data of the packet is abnormal or not is made based on the result of the comparison.
    Type: Application
    Filed: May 16, 2022
    Publication date: December 1, 2022
    Inventors: GAN-HAO WEI, LI-WEI HUNG
  • Publication number: 20220326732
    Abstract: An electronic device is provided. The electronic device includes a first body with a base and a movable member, a second body, a lifting member, and a linkage mechanism. The movable member is located on an upper surface of the base and includes a first side and a second side. The first side is pivotally connected to the base. The second body is pivotally connected to the second side by using a first rotary shaft. The lifting member is pivotally connected to the movable member by using a second rotary shaft. The linkage mechanism is disposed on the movable member, is linked to the second body by using the first rotary shaft, and drives the lifting member to rotate by using the second rotary shaft. When the second body is opened upward, an air outlet on a rear side of the first body is prevented from being covered.
    Type: Application
    Filed: February 22, 2022
    Publication date: October 13, 2022
    Inventors: Yung-Hsiang CHEN, Li-Wei HUNG
  • Publication number: 20220129045
    Abstract: A hinge structure for an electronic device including a first part and a second part is provided. The hinge structure includes a first fixing base, a second fixing base, a rotating element, and a control element. The first fixing base connects to the first part. The second fixing base connects to the second part and includes a first locking structure. The rotating element includes a second locking structure. An end of the rotating element rotatably and movably connects to the first fixing base along an axial direction. The other end of the rotating element engages with the first locking structure through the second locking structure. The control element extends to the rotating element for driving the rotating element to move along the axial direction.
    Type: Application
    Filed: May 28, 2021
    Publication date: April 28, 2022
    Inventors: Tsung-Ju CHIANG, Marco DA ROS, Yung-Hsiang CHEN, Li Wei HUNG
  • Publication number: 20220131039
    Abstract: A micro light-emitting diode includes an epitaxial structure, an insulation layer, a first electrode, and a second electrode. The epitaxial structure includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer. The epitaxial structure has a cavity penetrating the second semiconductor layer and the light-emitting layer and exposing a portion of the first semiconductor layer. The insulation layer covers the epitaxial structure, and a side surface and a bottom surface of the cavity. The insulation layer has a first hole exposing a portion of the second semiconductor layer, and a second hole exposing a portion of the bottom surface. The first electrode covers the exposed portion of the bottom surface. The second electrode covers the exposed portion of the second semiconductor layer and is distant from the first electrode. The cavity is distant from an edge of the micro LED.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 28, 2022
    Inventors: Li-Wei HUNG, Hsin-Liang YEH, Wei-Chen CHIEN, Ming-Sen HSU
  • Publication number: 20220129044
    Abstract: A hinge structure applied to an electronic device having a first component and a second component is provided. The hinge structure includes a torque hinge and a one-way pivoting mechanism. The torque hinge includes a first base and a first rotation element. The first base connects to the first component. The first rotation element rotatably connects to the first base. The second component pivotally connects to the first rotation element through the one-way pivoting mechanism.
    Type: Application
    Filed: May 28, 2021
    Publication date: April 28, 2022
    Inventors: Tsung-Ju CHIANG, Marco DA ROS, Yung-Hsiang CHEN, Li Wei HUNG
  • Patent number: 10303207
    Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: May 28, 2019
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ming-Hsing Yang, Kun-Hsiang Tsai, Yung-Hsiang Chen, Li-Wei Hung
  • Publication number: 20180364755
    Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.
    Type: Application
    Filed: June 7, 2018
    Publication date: December 20, 2018
    Inventors: Ming-Hsing YANG, Kun-Hsiang TSAI, Yung-Hsiang CHEN, Li-Wei HUNG
  • Patent number: 10120412
    Abstract: An electronic device is provided. The electronic device comprises a first body structure; a connecting portion; and a second body structure connected to the first body structure via the connecting portion. The second body structure includes a cover portion, and an end portion connected to an edge of the cover portion. A thickness of the end portion is larger than the thickness of the cover portion. An I/O port is disposed at a side wall of the end portion.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: November 6, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Yung-Hsiang Chen, Li-Wei Hung