Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: A system for detecting an illuminance of the present invention includes a light source, a light sensor, and a signal output module. The light source includes a first A light-emitting diode, the first A light-emitting diode having a first color light; and the light source emits a first ray of light. The light sensor has a sensing face; the light sensor includes a first B light-emitting diode disposed on the sensing face, the first B light-emitting diode having the first color light; and the light sensor receives at least a portion of the first ray of light and generates a first sensing voltage. The signal output module is coupled to the light sensor to receive the first sensing voltage and output a sensing result signal according to the first sensing voltage.

Abstract: The present invention provides a composite intelligent biological phototherapy device including a base structure, a plurality of white light fluorescent tubes arranged side by side on the base structure, a plurality of LEDs disposed between the white light fluorescent tubes, a housing having an opening and configured to accommodate the base structure and the white light fluorescent tubes and the LEDs thereon, a light-transmittable plate disposed on the housing corresponding to the opening, and an control module configured to respectively control the white light fluorescent tubes and the LEDs. The base structure includes a plurality of sections, and each of the sections has a first surface facing the light-transmittable plate. The white light fluorescent tubes and the LEDs are provided on the first surfaces, and the sections are bent relative to each other so an angle between the first surfaces of adjacent sections is less than 180 degrees.

Abstract: A system for detecting an illuminance of the present invention includes a light source, a light sensor, and a signal output module. The light source includes a first A light-emitting diode, the first A light-emitting diode having a first color light; and the light source emits a first ray of light. The light sensor has a sensing face; the light sensor includes a first B light-emitting diode disposed on the sensing face, the first B light-emitting diode having the first color light; and the light sensor receives at least a portion of the first ray of light and generates a first sensing voltage. The signal output module is coupled to the light sensor to receive the first sensing voltage and output a sensing result signal according to the first sensing voltage.

Abstract: The present invention provides a composite intelligent biological phototherapy device including a base structure, a plurality of white light fluorescent tubes arranged side by side on the base structure, a plurality of LEDs disposed between the white light fluorescent tubes, a housing having an opening and configured to accommodate the base structure and the white light fluorescent tubes and the LEDs thereon, a light-transmittable plate disposed on the housing corresponding to the opening, and an control module configured to respectively control the white light fluorescent tubes and the LEDs. The base structure includes a plurality of sections, and each of the sections has a first surface facing the light-transmittable plate. The white light fluorescent tubes and the LEDs are provided on the first surfaces, and the sections are bent relative to each other so an angle between the first surfaces of adjacent sections is less than 180 degrees.

Abstract: A magnetic resonance imaging (MRI) method is provided, including the steps of generating a wideband RF signal that has a plurality of frequency bands respectively corresponding to a plurality of different kinds of nuclei, to simultaneously excite the different kinds of nuclei, detecting a wideband responsive RF signal that has a plurality of frequency bands respectively emitted by the different kinds of nuclei, and reconstructing magnetic resonance images for the different kinds of nuclei based on the wideband responsive RF signal. An MRI apparatus employing the MRI method is also provided.

Abstract: Provided is a method for simultaneously acquiring magnetic resonance slices/slabs of a subject. The method comprises steps as follows. First, apply one or more than one RF pulse, which carries at least two frequency components, and a slice/slab selection magnetic field gradient so that at least two slices/slabs of the subject respectively corresponding to the at least two frequency components are excited simultaneously. Second, apply a spatial encoding magnetic field gradient. Third, apply a slice/slab separation magnetic field gradient so as to separate the at least two slices/slabs. The method according to the present invention can be used to acquire data for simultaneously reconstructing multiple slices/slabs. The method is compatible with existing MRI systems.

Abstract: A magnetic resonance imaging (MRI) method is provided, including the steps of generating a wideband RF signal that has a plurality of frequency bands respectively corresponding to a plurality of different kinds of nuclei, to simultaneously excite the different kinds of nuclei, detecting a wideband responsive RF signal that has a plurality of frequency bands respectively emitted by the different kinds of nuclei, and reconstructing magnetic resonance images for the different kinds of nuclei based on the wideband responsive RF signal. An MRI apparatus employing the MRI method is also provided.

Abstract: An electrically conductive substrate with a high heat conductivity has an aluminum plate having multiple holes. An isolation layer is formed on the aluminum plate and inner walls of the holes. Multiple electrically conductive materials are inserted in the holes. A circuit layer is formed on the aluminum plate, electrically connects to the electrically conductive materials and has a rough surface. A graphite layer is formed on the rough surface of the circuit layer. The electric components are respectively provided on the holes, and the heat generated by the electric components is dissipated effectively by the aluminum plate.

Abstract: Provided is a method for simultaneously acquiring magnetic resonance slices/slabs of a subject. The method comprises steps as follows. First, apply one or more than one RF pulse, which carries at least two frequency components, and a slice/slab selection magnetic field gradient so that at least two slices/slabs of the subject respectively corresponding to the at least two frequency components are excited simultaneously. Second, apply a spatial encoding magnetic field gradient. Third, apply a slice/slab separation magnetic field gradient so as to separate the at least two slices/slabs. The method according to the present invention can be used to acquire data for simultaneously reconstructing multiple slices/slabs. The method is compatible with existing MRI systems.

Abstract: An electrically conductive substrate with a high heat conductivity has an aluminum plate having multiple holes. An isolation layer is formed on the aluminum plate and inner walls of the holes. Multiple electrically conductive materials are inserted in the holes. A circuit layer is formed on the aluminum plate, electrically connects to the electrically conductive materials and has a rough surface. A graphite layer is formed on the rough surface of the circuit layer. The electric components are respectively provided on the holes, and the heat generated by the electric components is dissipated effectively by the aluminum plate.

Abstract: A carrier board has a copper substrate, an insulating layer, a copper layer, multiple recesses and a metal circuit layer. The substrate has at least one through hole. The insulating layer is a layer of glue that is insulating, acid-resisting and high-temperature-resisting and is mounted in the at least one through hole and mounted on the substrate. The copper layer is mounted on the insulating layer. The recesses are formed in the copper layer and the insulating layer that is mounted on the substrate. The metal circuit layer is plated on copper layer and along the recesses to contact with the substrate. A heat from the metal circuit layer will transmit to the insulating layer by the copper layer and to the copper substrate. Thus, the carrier board has a heat-dissipating effect without combining with a dissipating apparatus, so LEDs packaged with the carrier board have a small dimension and are compact.

Abstract: A base for a circuit board has a body made of metal material with a high heat conduction and an isolated heat conduction layer mounted on the body for preventing short circuit from occurring. Hence, the heat-generated by an electrical component can be effectively dissipated via the isolated heat conduction layer.

Abstract: A light emitting diode (LED) bulb includes a heat sink, a circuit layer having two opposite sides, multiple LEDs mounted on one side and an electrical insulating layer connected between the opposite side and the heat sink. Heat generated by the LEDs is conducted to the heat sink through the circuit layer and the electrical insulting layer and is dissipated quickly. Further, a fan can be mounted on the fins to dissipate heat from the heat sink more quickly. Therefore, the LED bulb has good heat dissipating efficiency.

Abstract: A light emitting diode device comprises a copper substrate having multiple light emitting regions, multiple dies and encapsulation. Each light emitting region has a die pad and at least one electrode connected together and encapsulant covering the light emitting region. The dies are respectively mounted on the die pads and are wire bonded to the corresponding electrode or electrodes. A step defining a gap is applied to the substrate to form multiple light emitting regions, and each light emitting region has a die pad and electrodes. Therefore, the present invention can simplify the steps for fabricating die pad and electrodes to increase the production rate of LED devices or LED display modules.

Abstract: A light emitting diode (LED) bulb includes a heat sink, a circuit layer having two opposite sides, multiple LEDs mounted on one side and an electrical insulating layer connected between the opposite side and the heat sink. Heat generated by the LEDs is conducted to the heat sink through the circuit layer and the electrical insulting layer and is dissipated quickly. Further, a fan can be mounted on the fins to dissipate heat from the heat sink more quickly. Therefore, the LED bulb has good heat dissipating efficiency.

Abstract: A light emitting diode device comprises a copper substrate having multiple light emitting regions, multiple dies and encapsulation. Each light emitting region has a die pad and at least one electrode connected together and encapsulant covering the light emitting region. The dies are respectively mounted on the die pads and are wire bonded to the corresponding electrode or electrodes. A step defining a gap is applied to the substrate to form multiple light emitting regions, and each light emitting region has a die pad and electrodes. Therefore, the present invention can simplify the steps for fabricating die pad and electrodes to increase the production rate of LED devices or LED display modules.