Abstract: A laser welding method for steel plates and a profile steel welded by laser welding are disclosed. The laser welding method comprises the following steps of connecting a first steel plate and a second steel plate to form a joint; and using a laser to weld the joint to form a profile steel. The laser has a laser power between 10,000 and 25,000 watts. A weld bead is formed at the joint. The weld bead has a weld depth and a weld width. The ratio of the weld depth to the weld width is between 1 and 5. Thus, the process can be simplified effectively, the welding time can be shortened, and the processing area can be reduced.

Abstract: A method for fabricating an integrated circuit device is provided. The method includes depositing a first dielectric layer; depositing a second dielectric layer over the first dielectric layer; etching a trench opening in the second dielectric layer, wherein the trench opening exposes a first sidewall of the second dielectric layer and a second sidewall of the second dielectric layer, the first sidewall of the second dielectric layer extends substantially along a first direction, and the second sidewall of the second dielectric layer extends substantially along a second direction different from the first direction in a top view; forming a via etch stop layer on the first sidewall of the second dielectric layer, wherein the second sidewall of the second dielectric layer is free from coverage by the via etch stop layer; forming a conductive line in the trench opening; and forming a conductive via over the conductive line.

Abstract: An insertion slot connector and a connector assembly. The insertion slot connector includes an insulating body and multiple conductive terminals. The insulating body includes two side walls, a bottom wall and an insertion slot. The insulating body has a mating surface and a mounting surface provided opposite to each other. The insertion slot runs through the mating surface. Each conductive terminal includes a base, an elastic arm extending from the base toward the mating surface and turns back to extend toward the bottom wall, a contact portion provided at a tail end of the elastic arm and a soldering portion. A distance between the insertion slot and the soldering surface of the soldering portion in the insertion direction is not greater than 0.70 mm. The connector assembly includes a circuit board and at least one insertion slot connector and at least one card edge connector alternately mounted thereon.

Abstract: A frequency locked loop circuit, comprising an operational circuit, a first impedance circuit, a second impedance circuit, a switching circuit and a frequency generation circuit. The operational circuit is configured to output an operational signal according to a voltage difference between a positive terminal and a negative terminal. The switching circuit is configured to periodically conduct the negative terminal to one of the first impedance node and the second impedance node, and periodically conduct the positive terminal to the other one of the first impedance node and the second impedance node. The frequency generation circuit is configured to periodically sample the operational signal to generate a sample signal to generate a clock signal. An operational frequency of the operational signal is an integer multiple of a sampling frequency of the frequency generation circuit.

Abstract: Disclosed are an edge tool configuration method and an electronic device. The edge tool configuration method includes: detecting a placement status of the electronic device through a sensor; reading configuration information of the edge tool according to the placement status, wherein the configuration information includes initial configuration information of the edge tool in a plurality of default placement statuses; placing the edge tool at an edge position in a display interface of a display according to the configuration information in the placement status.

Abstract: A semiconductor device includes a first type of light sensing units, where each instance of the first type of light sensing units is operable to receive a first amount of radiation; and a second type of light sensing units, where each instance of the second type of light sensing units is operable to receive a second amount of radiation, and the second type of light sensing units is arranged in an array with the first type of light sensing units to form a pixel sensor. The first amount of radiation is smaller than the second amount of radiation, and at least a first instance of the first type of light sensing units is adjacent to a second instance first type of light sensing unit.

Abstract: A semiconductor device includes a substrate, an isolation structure, a conductive structure, and a first contact structure. The isolation structure is disposed in the substrate. The conductive structure is disposed on the isolation structure. The conductive structure extends upwards from the isolation structure, in which the first contact structure has a top portion on the conductive structure and a bottom portion in contact with the isolation structure.

Abstract: Behavior report generation monitors the behavior of unknown sample files executing in a sandbox. Behaviors are encoded and feature vectors created based upon a q-gram for each sample. Prototypes extraction includes extracting prototypes from the training set of feature vectors using a clustering algorithm. Once prototypes are identified in this training process, the prototypes with unknown labels are reviewed by domain experts who add a label to each prototype. A K-Nearest Neighbor Graph is used to merge prototypes into fewer prototypes without using a fixed distance threshold and then assigning a malware family name to each remaining prototype. An input unknown sample can be classified using the remaining prototypes and using a fixed distance. For the case that no such prototype is close enough, the behavior report of a sample is rejected and tagged as an unknown sample or that of an emerging malware family.

Abstract: A health management system using contactless physiological measurement technology is disclosed. The health management system principally comprises a camera and a first processor, of which the camera is faced to a user for capturing a user image. The first processor is particularly configured to have a face detection unit and an activity index calculating unit therein. By such arrangement, after receiving the user image from the camera, the first processor detects a face portion from the user image, thereby subsequently extracting a PPG signal from the face portion. Consequently, after completing at least one process of the PPG signal, multiple indexes for describing a user's health activity are generated. The health activity indexes include health index, activity index, stability index, relaxation index, metabolism index, and balance index. Therefore, the first processor achieves an evaluation of the user's health activity state according to the forgoing health activity indexes.

Abstract: Provided is a display substrate, a drive method thereof and a display apparatus, the display substrate includes: a first drive mode and a second drive mode, the first drive mode has a refresh rate less than that of the second drive mode, wherein the contents displayed on the display substrate include a plurality of display frames, in the first drive mode, the display frames include: a refresh frame and at least one maintain frame; the display substrate includes pixel circuits arranged in an array, the pixel circuits include a data signal line and a first initial signal line; the data signal line provides a first data signal in the maintain frame, the voltage value of the first data signal is constant, and/or the first initial signal line provides a first initial signal in the refresh frame and the maintain frame, the first initial signal is an AC signal.

Abstract: A roller module includes a scroll wheel, a magnetization member, a swinging element and a pole-reversible magnetic element. The magnetization member is synchronously rotated with the scroll wheel. The swinging element includes a pivotal part, a first magnetic element and a second magnetic element. The first magnetic element and the second magnetic element are movable by using the pivotal part as a rotation center. The pole-reversible magnetic element and the first magnetic element interact with each other. Consequently, the second magnetic element is close to or away from the magnetization member.

Abstract: A conversion control circuit controls plural stackable sub-converters which are coupled in parallel to generate an output power to a load. The conversion control circuit includes a current sharing terminal and a current sharing circuit. A current sharing signal is connected, in parallel, to the current sharing terminals. The current sharing circuit includes: configuration (1): the current sharing signal is generated only according to an inductor current corresponding to one of plural inductors of the plural stackable sub-converters; or configuration (2): the current sharing signal is generated according to plural inductor currents corresponding to plural inductors of plural activated phases of the plural stackable sub-converters, wherein a ratio of a portion of the current sharing signal generated by a master control circuit to a portion generated by one of the slave control circuits is k which relates to a difference between a total phase number and an activated phase number.

Abstract: A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.

Abstract: An electrode controls transmittance of a blocking layer over a photodiode of a pixel sensor (e.g., a photodiode of a small pixel detector) by changing oxidation of a metal material included in the blocking layer. By using the electrode to adjust transmittance of the blocking layer, pixel sensors for different uses and/or products may be produced using a single manufacturing process. As a result, power and processing resources are conserved that otherwise would have been expended in switching manufacturing processes. Additionally, production time is decreased (e.g., by eliminating downtime that would otherwise have been used to reconfigure fabrication machines.

Abstract: The present disclosure provides a molding system for fabricating a FRP composite article. The molding system includes a detector, a resin dispenser, a processing module, and a molding machine. The detector is configured to capture a graph of a woven fiber from a top view. The resin dispenser is configured to provide a resin to the woven fiber to form a FRP. The processing module is configured to receive the graph and a plurality of parameters of the FRP. The processing module includes a CNN model, and is configured to use the CNN model to obtain a plurality of predicted mechanical properties of the FRP according to the graph and the plurality of parameters of the FRP. The molding machine is configured to mold the FRP to fabricate the FRP composite article according to the plurality of predicted mechanical properties.

Abstract: Aspects of the invention include generating a plurality of predictions that each define a plurality of future inputs for a model. A deviation curve is generated by determining a distance between each prediction of the plurality of predictions and a respective known data point of a plurality of known data points. One or more points in the deviation curve are sampled and the sampled points are compared to a low threshold and a high threshold. A judgement is determined for each prediction to determine whether the respective prediction will be accepted or denied as an input to the model. The future inputs for the model are modified based on the judgments.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed over a substrate. A film is formed over the underlying structure. Surface topography of the film is measured and the surface topography is stored as topography data. A local etching is performed by using directional etching and scanning the substrate so that an entire surface of the film is subjected to the directional etching. A plasma beam intensity of the directional etching is adjusted according to the topography data.

Abstract: A method for calibrating a laser machining system includes a scanner device for deflecting a laser beam to a plurality of positions on a surface and includes an observation device, an observation beam path of which runs coaxially to the laser beam path over the scanner device. The method includes calibrating the scanner device and calibrating the observation device. A laser machining system for machining a workpiece by means of a laser beam with a control configured to carry out said method is also provided.

Abstract: An auto-regressive method for a large language model includes receiving a hidden state associated with at least one token, generating key data, first value data, and query data according to a received hidden state, generating first positionally encoded key data by encoding the key data positionally, generating positionally encoded query data by encoding the query data positionally, performing first element-wise dot product operations according to the first positionally encoded key data, the positionally encoded query data, and second positionally encoded key data to generate an attention score, performing second element-wise dot product operations according to the first value data, the attention score, and second value data to generate an attention output, and adding the attention output and the hidden state to generate an updated hidden output.

Abstract: A package structure including a packaging substrate, a semiconductor device, passive components, a lid, and a dam structure is provided. The semiconductor device is disposed on and electrically connected to the packaging substrate. The passive components are disposed on the packaging substrate, wherein the semiconductor device is surrounded by the passive components. The lid is disposed on the packaging substrate, and the lid covers the semiconductor device and the passive components. The dam structure is disposed between the packaging substrate and the lid, wherein the dam structure covers the passive components and laterally encloses the semiconductor device.