Patents by Inventor Li Wen Tsai

Li Wen Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having conductive vias and semiconductor package having semiconductor device
    Patent number: 9024445
    Abstract: The present invention relates to a package having a semiconductor device. The semiconductor device includes a substrate body, a plurality of conductive vias and a plurality of metal pads. The conductive vias are disposed in the through holes of the substrate body. The metal pads are electrically connected to the conductive vias. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The curvature of the curved side wall is different from that of the reference side wall, so as to allow the metal pads to be closer to each other. This arrangement allows the conductive to be closer to each other. Therefore, more conductive vias can be arranged in a limited space.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: May 5, 2015
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo Hua Chen, Li Wen Tsai
  • SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS AND SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR DEVICE
    Publication number: 20120126420
    Abstract: The present invention relates to a package having a semiconductor device. The semiconductor device includes a substrate body, a plurality of conductive vias and a plurality of metal pads. The conductive vias are disposed in the through holes of the substrate body. The metal pads are electrically connected to the conductive vias. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The curvature of the curved side wall is different from that of the reference side wall, so as to allow the metal pads to be closer to each other. This arrangement allows the conductive to be closer to each other. Therefore, more conductive vias can be arranged in a limited space.
    Type: Application
    Filed: May 23, 2011
    Publication date: May 24, 2012
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo Hua Chen, Li Wen Tsai