Patents by Inventor Li Wern CHEW

Li Wern CHEW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230113084
    Abstract: The present disclosure generally relates to a printed circuit board assembly that may include a circuit board having a first surface and an opposing second surface. The printed circuit board assembly may also include a first interconnect barrel disposed in the circuit board. The first interconnect barrel may have a first length extending between the first surface and the second surface. The first interconnect barrel may include a first section, and may further include a second section spaced apart from the first section by a first gap having a first depth extending partially through the first length. The printed circuit board assembly may further include a first conductive trace coupled to the first section and a second conductive trace coupled to the second section at a first terminal.
    Type: Application
    Filed: October 11, 2021
    Publication date: April 13, 2023
    Inventors: Jackson Chung Peng KONG, Bok Eng CHEAH, Kok Hou TEH, Kooi Chi OOI, Li Wern CHEW