Abstract: An integrated circuit (IC) package includes a via extending through a stack of antipads in a stack of layers, and the stack of antipads has an antipad with a shorter diameter between antipads with longer diameters. The via may have first and second connections and first and second pads at or over and under the antipads. The longer diameters (over and under the shorter diameter) may be equal. Intervening antipads of intermediate size may be between the smallest antipads and the largest antipads. An antipad void profile may be tapered and concave, with flatter slopes nearer the upper and lower ends of the via and steeper slopes near a via midpoint. A second via may be adjacent the first via. One or more other vias may have an aligned (rather than a tapered) profile.

Abstract: The present disclosure generally relates to a printed circuit board assembly that may include a circuit board having a first surface and an opposing second surface. The printed circuit board assembly may also include a first interconnect barrel disposed in the circuit board. The first interconnect barrel may have a first length extending between the first surface and the second surface. The first interconnect barrel may include a first section, and may further include a second section spaced apart from the first section by a first gap having a first depth extending partially through the first length. The printed circuit board assembly may further include a first conductive trace coupled to the first section and a second conductive trace coupled to the second section at a first terminal.