Patents by Inventor Li Ye
Li Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958789Abstract: A method for determining a consistency coefficient of a power-law cement grout includes: determining a water-cement ratio of the power-law cement grout; according to engineering practice requirements, determining a time required to determine the consistency coefficient of the power-law cement grout; and obtaining the consistency coefficient of the power-law cement grout. The method is accurate and reliable, requires less calculation, etc.; and has very high practical value and popularization value in environmental protection and ecological restoration.Type: GrantFiled: December 12, 2023Date of Patent: April 16, 2024Assignee: KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Zhi-quan Yang, Jun-fan Xiong, Ying-yan Zhu, Yi Yang, Yong-shun Han, Muhammad Asif Khan, Jian-bin Xie, Tian-bing Xiang, Bi-hua Zhang, Han-hua Xu, Jie Zhang, Shen-zhang Liu, Qi-jun Jia, Cheng-yin Ye, Gang Li
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Patent number: 11956919Abstract: A cold plate is provided and includes: a housing disposed with a chamber; a base combined with the housing to form a working space separated from the chamber but connected with the chamber through an interconnecting structure to allow a working medium to flow within the chamber and the working space; a heat transfer structure disposed on the inner side of the base; and a pump disposed within the working space to drive the working medium in the working space. As such, the cold plate can provide better heat dissipation performance.Type: GrantFiled: December 23, 2020Date of Patent: April 9, 2024Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-An Chen, Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Wei-Shen Lee
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Publication number: 20240113188Abstract: An integrated circuit (IC) structure includes a semiconductor substrate, a first gate line, a second gate line, and a first auxiliary gate portion. The semiconductor substrate comprises a semiconductor fin. The semiconductor fin extends substantially along a first direction. The first gate line and the second gate line extend substantially along a second direction different form the first direction from a top view. The first auxiliary gate portion connects the first gate line to the second gate line from the top view.Type: ApplicationFiled: March 27, 2023Publication date: April 4, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wen-Li CHIU, Yi-Juei LEE, Yu-Jie YE, Chi-Hsin CHANG, Chun-Jun LIN
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Patent number: 11949681Abstract: Methods and systems are provided for improving user authentication and access control by a network file system service in a multi-tenant public cloud environment by receiving a request for a connection to a file system from a file system client (client), sending an identification request for identification authentication of the client to a control system, receiving a response from the control system, establishing the connection to the file system upon determining that the connection to the file system is allowed based on cloud tenant information associated with the client, receiving an attempt to access the file system from the client by a sub-user, authenticating the sub-user based on the cloud tenant information, issuing a security token including a globally unique sub-user identifier of the sub-user, and using the security token to determine access rights of the sub-user to the file system for a subsequent request.Type: GrantFiled: October 10, 2018Date of Patent: April 2, 2024Assignee: Alibaba Group Holding LimitedInventors: Qingda Lu, Junpu Chen, Qinghua Ye, Lei Wang, Zhiyong Lin, Liping Bao, Jiesheng Wu, Li Xu, Xiaohui Pei, Feng Zhang, Leilei Tian
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Patent number: 11930618Abstract: A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.Type: GrantFiled: August 31, 2021Date of Patent: March 12, 2024Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Chien-An Chen
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Patent number: 11923041Abstract: A device includes a memory array, bit line pairs, word lines, a modulation circuit and a control signal generator. The memory array has bit cells arranged in rows and columns. Each bit line pair is connected to a respective column of bit cells. Each word line is connected to a respective row of bit cells. The modulation circuit is coupled with at least one bit line pair. The control signal generator is coupled with the modulation circuit. The control signal generator includes a tracking wiring with a tracking length positively correlated with a depth distance of the word lines. The control signal generator is configured to produce a control signal, switching to a first voltage level for a first time duration in reference with the tracking length, for controlling the modulation circuit. A method of controlling aforesaid device is also disclosed.Type: GrantFiled: July 5, 2022Date of Patent: March 5, 2024Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC NANJING COMPANY LIMITED, TSMC CHINA COMPANY LIMITEDInventors: Xiu-Li Yang, He-Zhou Wan, Mu-Yang Ye, Lu-Ping Kong, Ming-Hung Chang
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Publication number: 20240071470Abstract: A memory device includes a first transistor, a second transistor and a third transistor. The first transistor is coupled to a first word line at a first node. The second transistor is coupled to a second word line different from the first word line at a second node. A control terminal of the first transistor is coupled to a control terminal of the second transistor. The third transistor is coupled between a ground and a third node which is coupled to each of the first node and the second node. In a layout view, each of the first transistor and the second transistor has a first length along a direction. The first transistor, the third transistor and second transistor are arranged in order along the direction. A method is also disclosed herein.Type: ApplicationFiled: November 1, 2023Publication date: February 29, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC Nanjing Company Limited, TSMC China Company LimitedInventors: He-Zhou WAN, Xiu-Li YANG, Mu-Yang YE, Yan-Bo SONG
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Patent number: 11832418Abstract: A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.Type: GrantFiled: March 26, 2021Date of Patent: November 28, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Yu Chen, Jen-Hao Lin, Chien-An Chen, Yun-Kuei Lin
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Patent number: 11723174Abstract: A liquid cooling head manufacturing method includes the following steps. First, a liquid channel main body is provided. Then, a heat dissipation bottom plate and a heat sink are disposed in different recessed indentations in the liquid channel main body. The heat dissipation bottom plate and the heat sink are welded in the liquid channel main body and a cover plate is sealed on the liquid channel main body.Type: GrantFiled: August 31, 2021Date of Patent: August 8, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin
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Publication number: 20230213415Abstract: The present disclosure provides methods of preparing a biological specimen for imaging analysis, comprising fixing and clearing the biological specimen and subsequently analyzing the cleared biological specimen using microscopy. Also included are methods of quantifying cells, for example, active populations of cells in response to a stimulant. The present disclosure also provides devices for practicing the described methods. A flow-assisted clearing device provides rapid clearing of hydrogel-embedded biological specimens without the need of specialized equipment such as electrophoresis or perfusion devices.Type: ApplicationFiled: February 22, 2023Publication date: July 6, 2023Inventors: Karl A. Deisseroth, William E. Allen, Brian Hsueh, Li Ye
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Patent number: 11624685Abstract: The present disclosure provides methods of preparing a biological specimen for imaging analysis, comprising fixing and clearing the biological specimen and subsequently analyzing the cleared biological specimen using microscopy. Also included are methods of quantifying cells, for example, active populations of cells in response to a stimulant. The present disclosure also provides devices for practicing the described methods. A flow-assisted clearing device provides rapid clearing of hydrogel-embedded biological specimens without the need of specialized equipment such as electrophoresis or perfusion devices.Type: GrantFiled: October 22, 2019Date of Patent: April 11, 2023Assignee: The Board of Trustees of the Leland Sanford Junior UniveristyInventors: Karl A. Deisseroth, William E. Allen, Brian Hsueh, Li Ye
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Patent number: 11626346Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.Type: GrantFiled: December 17, 2020Date of Patent: April 11, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Yu Chen, Chien-An Chen
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Publication number: 20230088418Abstract: Provided are a high-entropy carbide ceramic, a rare earth-containing high-entropy carbide ceramic, fibers thereof, precursors thereof, and preparation methods thereof. The precursor includes at least four elements selected from Ti, Zr, Hf, V, Nb, Ta, Mo, and W, with each metal element accounting for 5-35% of the total molar quantity of metal elements in the precursor. The rare earth-containing high-entropy carbide ceramic precursor includes at least four transition metal elements and at least one rare-earth metal element. The high-entropy ceramic is a single-crystal-phase high-performance ceramic prepared from the precursor, with each element being homogenously distributed at molecular level.Type: ApplicationFiled: November 11, 2020Publication date: March 23, 2023Inventors: Li YE, Tong ZHAO, Yanan SUN, Weijian HAN, Fenghua CHEN
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Publication number: 20230065557Abstract: A two-phase cold plate includes a base, an upper cover, a heat exchange cavity and a cooling fin module. The upper cover is installed on the base, the heat exchange cavity is formed between the base and the upper cover, and the cooling fin module is installed in the heat exchange cavity. The upper cover includes at least one nozzle module and a plurality of two-phase fluid channels. The two-phase fluid channels are respectively located on both sides of the nozzle module, and the nozzle module sprays a heat dissipating fluid to the cooling fin module, and the heat dissipating fluid flows along the cooling fin module to the two-phase fluid channels on both sides of the cooling fin module to cool the cooling fin module.Type: ApplicationFiled: July 11, 2022Publication date: March 2, 2023Inventors: Chien-Yu CHEN, Tian-Li YE, Chun-Ming HU
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Patent number: 11523537Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.Type: GrantFiled: December 8, 2020Date of Patent: December 6, 2022Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Chien-An Chen
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Publication number: 20220351767Abstract: Example magnetic random access memories are described. One example magnetic random access memory includes a plurality of structural units and a plurality of voltage control lines. The plurality of voltage control lines are in parallel with each other. Planes in which the plurality of structural units are located are in parallel with each other, and a plane in which each of the plurality of structural units is located is perpendicular to the plurality of voltage control lines. Each structural unit includes a multi-layer storage structure including multiple layers that are stacked in sequence. Each layer of the multi-layer storage structure includes an electrode line and a plurality of storage units disposed on the electrode line. Each of the plurality of storage units includes a magnetic tunnel junction. A first end of each storage unit is connected to the electrode line, and a second end of each storage unit is connected to one of the plurality of voltage control lines.Type: ApplicationFiled: July 14, 2022Publication date: November 3, 2022Inventors: Li YE, Wenjing LI
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Publication number: 20220274888Abstract: Disclosed are a high-entropy nitride ceramic fiber, and a preparation method and use thereof. The high-entropy ceramic fiber comprises Ti, Hf, Ta, Nb, and Mo; the high-entropy nitride ceramic fiber presents single crystal phase, and each of the elements are uniformly distributed at molecular level. The preparation method of the high-entropy ceramic fiber comprises: mixing a high-entropy ceramic precursor comprising the target metal elements, a spinning aid, and a solvent uniformly to prepare a precursor spinning solution, followed by working procedures of spinning, pyrolyzation, and nitriding to prepare the high-entropy nitride ceramic fiber. The high-entropy nitride ceramic fiber can be used in photocatalysis process of carbon dioxide to prepare methane.Type: ApplicationFiled: November 11, 2020Publication date: September 1, 2022Inventors: Tong ZHAO, Li YE, Wei LI, Yanan SUN
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Publication number: 20220248570Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, an integrated pipe, and a fluid driving module. The power supply module is electrically connected to the control module, the integrated pipe includes a plurality of inlets and an outlet to collect and output a cooled working fluid, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, integrated pipe, and fluid driving module are all arranged in the casing.Type: ApplicationFiled: January 19, 2022Publication date: August 4, 2022Inventors: Chien-Yu CHEN, Tian-Li YE, Chun-Ming HU
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Patent number: 11363739Abstract: A liquid cooling head device includes a base, a cover covering the base, an inlet portion disposed on the base, an outlet portion formed on the cover, and a fluid pump having a housing and a fan blade. The base includes a diversion channel, an opening and a first chamber connected to the diversion channel and the opening. A second chamber is formed between the cover and the base, and connected to the first chamber through the opening. The inlet portion is connected to the first chamber through the diversion channel. The housing covers one surface of the cover, so that a third chamber is collectively defined by the housing and the cover, and connected with the second chamber and the outlet portion. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber.Type: GrantFiled: March 10, 2021Date of Patent: June 14, 2022Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Chien-An Chen
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Patent number: D956004Type: GrantFiled: September 28, 2020Date of Patent: June 28, 2022Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Jen-Hao Lin, Tian-Li Ye, Chien-Yu Chen, Chien-An Chen