Abstract: A suspendable assembly for fixing and holding a server includes a housing, a torsion spring, a limiting frame, a handle, and a shaft. The housing includes a first through hole. The torsion spring is fixed on the housing. The limiting frame clamps the torsion spring. The handle is fixed with the limiting frame, the handle comprising a first hook. The shaft penetrates through the housing, the torsion spring, the handle, and the limiting frame. The first hook is configured to engaged with a second hook to limit the suspendable assembly.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a fin spacer alongside a fin structure, a source/drain structure over the fin structure, and a salicide layer along a surface of the source/drain structure. A bottom portion of the salicide layer is in contact with the fin spacer. The semiconductor device structure also includes a capping layer over the salicide layer. A portion of the capping layer directly below the bottom portion of the salicide layer is in contact with the fin spacer. The semiconductor device structure also includes a dielectric layer over the capping layer. The dielectric layer is made of a different material than the capping layer.

Abstract: A chassis with built-in handles which do not add to dimensional clearance required for the chassis to be placed in a cavity includes a side plate, a mounting unit, and a handle. A mounting groove is defined on the side plate. The mounting unit is coupled to the side plate. The handle is partially clamped by the side plate and the mounting unit, and rotatably coupled with the side plate. By rotating the handle, the handle can be stored at least flush in the mounting groove.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The method includes forming a fin structure over a substrate. The method also includes forming a gate structure over the fin structure. The method further includes forming fin spacers over sidewalls of the fin structure and gate spacers over sidewalls of the gate structure. In addition, the method includes forming a source/drain structure over the fin structure and depositing a dummy material layer to cover the source/drain structure. The dummy material layer is removed faster than the gate spacers during the removal of the dummy material layer. The method further includes forming a salicide layer over the source/drain structure and the fin spacers, and forming a contact over the salicide layer. The dummy material layer includes Ge, amorphous silicon or spin-on carbon.

Abstract: A fixing bracket includes a connecting plate, a top plate, and two side plates. The two side plates are parallel to each other and cooperatively define an accommodating space with the top plate and the connecting plate. The connecting plate, the top plate, and the two side plates are integrally formed. A cutout is defined in at least one of the connecting plate and the top plate for passing through a clamping spring.

Abstract: A circuit board module includes a first circuit board, a second circuit board facing the first circuit board, a connecting device fixed between the first circuit board and the second circuit board, and an adapter board fixed to the connecting device and disposed between the first circuit board and the second circuit board. The adapter board is inserted into the first circuit board and the second circuit board.